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Chip carrier, the Glossary

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips").^[1]

19 relations: Ceramic, Chip carrier, Dual in-line package, Electronics, Flash memory, Heat spreader, IC extractor, Integrated circuit, JEDEC, Lead (electronics), List of integrated circuit packaging types, Package on a package, Plastic, Quad flat package, Reflow soldering, Semiconductor package, Surface-mount technology, Through-hole technology, Wire wrap.
Chip carriers

Ceramic

A ceramic is any of the various hard, brittle, heat-resistant, and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature.

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Chip carrier

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Chip carrier and chip carrier are chip carriers.

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Dual in-line package

In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. Chip carrier and dual in-line package are chip carriers.

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Electronics

Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other electrically charged particles.

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Flash memory

Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed.

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Heat spreader

A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger.

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An IC extractor is a tool for safely and quickly removing integrated circuits (ICs) from their sockets.

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Integrated circuit

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

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JEDEC

The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in the United States.

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Lead (electronics)

In electronics, a lead or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically.

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List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. Chip carrier and List of integrated circuit packaging types are chip carriers.

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Package on a package

Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Chip carrier and package on a package are chip carriers.

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Plastic

Plastics are a wide range of synthetic or semi-synthetic materials that use polymers as a main ingredient.

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Quad flat package

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Chip carrier and quad flat package are chip carriers.

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Reflow soldering

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.

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Semiconductor package

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.

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Surface-mount technology

Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). Chip carrier and surface-mount technology are chip carriers.

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Through-hole technology

In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. Chip carrier and through-hole technology are chip carriers.

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Wire wrap

Close-up of a wire-wrap connection Typical wire wrap construction of Bell System telephone crossbar switch. Some types of connection were soldered. Wire wrap is an electronic component assembly technique that was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards.

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References

[1] https://en.wikipedia.org/wiki/Chip_carrier

Also known as Ceramic Leadless Chip Carrier, Ceramic leaded chip carrier, ILCC, Leaded Chip Carrier, Leadless chip carrier, PLCC 100, PLCC 156, PLCC 16, PLCC 2, PLCC 20, PLCC 24, PLCC 28, PLCC 32, PLCC 4, PLCC 44, PLCC 52, PLCC 6, PLCC 68, PLCC 8, PLCC 84, PLCC-100, PLCC-156, PLCC-16, PLCC-2, PLCC-20, PLCC-24, PLCC-28, PLCC-32, PLCC-4, PLCC-44, PLCC-52, PLCC-6, PLCC-68, PLCC-8, PLCC-84, PLCC100, PLCC156, PLCC16, PLCC2, PLCC20, PLCC24, PLCC28, PLCC32, PLCC4, PLCC44, PLCC52, PLCC6, PLCC68, PLCC8, PLCC84, Plastic Leaded Chip Carrier, Plastic Leadless chip carrier, Plastic-leaded chip carrier.