Flatpack (electronics), the Glossary

Table of Contents

1. 11 relations: Dual in-line package, Integrated circuit packaging, Lead (electronics), MIL-PRF-38534, MIL-STD-883, Printed circuit board, Quad flat package, Surface-mount technology, Terminal (electronics), Texas Instruments, TO-5.

2. Chip carriers

Dual in-line package

In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. Flatpack (electronics) and dual in-line package are Chip carriers.

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Integrated circuit packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. Flatpack (electronics) and Integrated circuit packaging are Chip carriers.

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Lead (electronics)

In electronics, a lead or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically.

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MIL-PRF-38534

The MIL-PRF-38534 specification establishes the general performance requirements for hybrid microcircuits (hybrid integrated circuit), multi-chip modules (MCM) and, similar devices and the verification and validation requirements for ensuring that these devices meet the applicable performance requirements.

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MIL-STD-883

The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.

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Printed circuit board

A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit.

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Quad flat package

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Flatpack (electronics) and quad flat package are Chip carriers.

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Surface-mount technology

Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). Flatpack (electronics) and surface-mount technology are Chip carriers.

See Flatpack (electronics) and Surface-mount technology

Terminal (electronics)

A terminal is the point at which a conductor from a component, device or network comes to an end.

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Texas Instruments

Texas Instruments Incorporated (TI) is an American multinational semiconductor company headquartered in Dallas, Texas.

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TO-5

In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits.

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See also

Chip carriers

• AlSiC
• Ball grid array
• Chip carrier
• Chip-scale package
• Copper–tungsten
• Dual in-line package
• Dye-and-pry
• Dymalloy
• E-Material
• Electronic packaging
• Embedded wafer level ball grid array
• Fan-out wafer-level packaging
• Flat no-leads package
• Flatpack (electronics)
• Flip chip
• Integrated circuit packaging
• Land grid array
• Lead frame
• List of integrated circuit packaging types
• Low insertion force
• Mini-Cartridge
• Multi-chip module
• Multi-leaded power package
• Package on a package
• Pin grid array
• Quad flat package
• Quad in-line package
• Small outline integrated circuit
• Solid Logic Technology
• Surface-mount technology
• Thin small outline package
• Through-hole technology
• Universal integrated circuit card
• Wafer-level packaging
• XSON
• Zig-zag in-line package

References

[1] https://en.wikipedia.org/wiki/Flatpack_(electronics)