Flip chip, the Glossary

Table of Contents

1. 35 relations: Adhesive, Aviation Week & Space Technology, Ball grid array, Conductive polymer, Die (integrated circuit), Digital Equipment Corporation, Electroless copper plating, Flip-Chip module, General Electric, Gold, Hybrid pixel detector, IBM, IBM 308X, Inductance, Insulator (electricity), Integrated circuit, Integrated passive devices, Mainframe computer, MEMS, Mobile phone, Printed circuit board, Reflow soldering, Roll-to-roll processing, Semiconductor device, Semiconductor device fabrication, Siemens, Solder, Solder ball, Solid Logic Technology, Tape-automated bonding, Thermal bridge, Thermosonic bonding, Utica, New York, Wafer (electronics), Wire bonding.

2. Chip carriers

Adhesive

Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation.

See Flip chip and Adhesive

Aviation Week & Space Technology

Aviation Week & Space Technology, often abbreviated Aviation Week or AW&ST, is the flagship magazine of the Aviation Week Network, a division of Informa.

See Flip chip and Aviation Week & Space Technology

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. Flip chip and ball grid array are chip carriers.

See Flip chip and Ball grid array

Conductive polymer

Conductive polymers or, more precisely, intrinsically conducting polymers (ICPs) are organic polymers that conduct electricity.

See Flip chip and Conductive polymer

Die (integrated circuit)

A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated.

See Flip chip and Die (integrated circuit)

Digital Equipment Corporation

Digital Equipment Corporation (DEC), using the trademark Digital, was a major American company in the computer industry from the 1960s to the 1990s.

See Flip chip and Digital Equipment Corporation

Electroless copper plating

Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic.

See Flip chip and Electroless copper plating

Flip-Chip module

A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9, and PDP-10 computers, and related peripherals, beginning on August 24, 1964.

See Flip chip and Flip-Chip module

General Electric

General Electric Company (GE) was an American multinational conglomerate founded in 1892, incorporated in the state of New York and headquartered in Boston.

See Flip chip and General Electric

Gold

Gold is a chemical element; it has symbol Au (from the Latin word aurum) and atomic number 79.

See Flip chip and Gold

Hybrid pixel detector

Hybrid pixel detectors are a type of ionizing radiation detector consisting of an array of diodes based on semiconductor technology and their associated electronics.

See Flip chip and Hybrid pixel detector

IBM

International Business Machines Corporation (using the trademark IBM), nicknamed Big Blue, is an American multinational technology company headquartered in Armonk, New York and present in over 175 countries.

See Flip chip and IBM

IBM 308X

The IBM 308X is a line of mainframe computers, of which the first model, the Model 3081 Processor Complex, was introduced November 12, 1980.

See Flip chip and IBM 308X

Inductance

Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it.

See Flip chip and Inductance

Insulator (electricity)

An electrical insulator is a material in which electric current does not flow freely.

See Flip chip and Insulator (electricity)

Integrated circuit

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

See Flip chip and Integrated circuit

Integrated passive devices

Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate.

See Flip chip and Integrated passive devices

Mainframe computer

A mainframe computer, informally called a mainframe or big iron, is a computer used primarily by large organizations for critical applications like bulk data processing for tasks such as censuses, industry and consumer statistics, enterprise resource planning, and large-scale transaction processing.

See Flip chip and Mainframe computer

MEMS

MEMS (micro-electromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts.

See Flip chip and MEMS

Mobile phone

A mobile phone or cell phone is a portable telephone that can make and receive calls over a radio frequency link while the user is moving within a telephone service area, as opposed to a fixed-location phone (landline phone).

See Flip chip and Mobile phone

Printed circuit board

A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit.

See Flip chip and Printed circuit board

Reflow soldering

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.

See Flip chip and Reflow soldering

Roll-to-roll processing

In the field of electronic devices, roll-to-roll processing, also known as web processing, reel-to-reel processing or R2R, is the process of creating electronic devices on a roll of flexible plastic, metal foil, or flexible glass.

See Flip chip and Roll-to-roll processing

Semiconductor device

A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function.

See Flip chip and Semiconductor device

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM).

See Flip chip and Semiconductor device fabrication

Siemens

Siemens AG is a German multinational technology conglomerate.

See Flip chip and Siemens

Solder

Solder (NA) is a fusible metal alloy used to create a permanent bond between metal workpieces.

See Flip chip and Solder

Solder ball

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former.

See Flip chip and Solder ball

Solid Logic Technology

Solid Logic Technology (SLT) was IBM's method for hybrid packaging of electronic circuitry introduced in 1964 with the IBM System/360 series of computers. Flip chip and Solid Logic Technology are chip carriers.

See Flip chip and Solid Logic Technology

Tape-automated bonding

Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.

See Flip chip and Tape-automated bonding

Thermal bridge

A thermal bridge, also called a cold bridge, heat bridge, or thermal bypass, is an area or component of an object which has higher thermal conductivity than the surrounding materials, creating a path of least resistance for heat transfer.

See Flip chip and Thermal bridge

Thermosonic bonding

Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers.

See Flip chip and Thermosonic bonding

Utica, New York

Utica is a city in the Mohawk Valley and the county seat of Oneida County, New York, United States.

See Flip chip and Utica, New York

Wafer (electronics)

In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.

See Flip chip and Wafer (electronics)

Wire bonding

Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

See Flip chip and Wire bonding

See also

Chip carriers

• AlSiC
• Ball grid array
• Chip carrier
• Chip-scale package
• Copper–tungsten
• Dual in-line package
• Dye-and-pry
• Dymalloy
• E-Material
• Electronic packaging
• Embedded wafer level ball grid array
• Fan-out wafer-level packaging
• Flat no-leads package
• Flatpack (electronics)
• Flip chip
• Integrated circuit packaging
• Land grid array
• Lead frame
• List of integrated circuit packaging types
• Low insertion force
• Mini-Cartridge
• Multi-chip module
• Multi-leaded power package
• Package on a package
• Pin grid array
• Quad flat package
• Quad in-line package
• Small outline integrated circuit
• Solid Logic Technology
• Surface-mount technology
• Thin small outline package
• Through-hole technology
• Universal integrated circuit card
• Wafer-level packaging
• XSON
• Zig-zag in-line package

References

[1] https://en.wikipedia.org/wiki/Flip_chip

Also known as Chip connection, FCLGA, Flip-chip, Micro bump.