Lead frame, the Glossary
A lead frame (pronounced) is a metal structure inside a chip package that carries signals from the die to the outside, used in DIP, QFP and other packages where connections to the chip are made on its edges.[1]
Table of Contents
7 relations: Chip carrier, Die (integrated circuit), Dual in-line package, Flat no-leads package, Integrated circuit packaging, Quad flat package, Wire bonding.
- Chip carriers
Chip carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Lead frame and chip carrier are chip carriers.
See Lead frame and Chip carrier
Die (integrated circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated.
See Lead frame and Die (integrated circuit)
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. Lead frame and dual in-line package are chip carriers.
See Lead frame and Dual in-line package
Flat no-leads package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Lead frame and Flat no-leads package are chip carriers.
See Lead frame and Flat no-leads package
Integrated circuit packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. Lead frame and Integrated circuit packaging are chip carriers.
See Lead frame and Integrated circuit packaging
Quad flat package
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Lead frame and quad flat package are chip carriers.
See Lead frame and Quad flat package
Wire bonding
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
See Lead frame and Wire bonding
See also
Chip carriers
- AlSiC
- Ball grid array
- Chip carrier
- Chip-scale package
- Copper–tungsten
- Dual in-line package
- Dye-and-pry
- Dymalloy
- E-Material
- Electronic packaging
- Embedded wafer level ball grid array
- Fan-out wafer-level packaging
- Flat no-leads package
- Flatpack (electronics)
- Flip chip
- Integrated circuit packaging
- Land grid array
- Lead frame
- List of integrated circuit packaging types
- Low insertion force
- Mini-Cartridge
- Multi-chip module
- Multi-leaded power package
- Package on a package
- Pin grid array
- Quad flat package
- Quad in-line package
- Small outline integrated circuit
- Solid Logic Technology
- Surface-mount technology
- Thin small outline package
- Through-hole technology
- Universal integrated circuit card
- Wafer-level packaging
- XSON
- Zig-zag in-line package
References
[1] https://en.wikipedia.org/wiki/Lead_frame
Also known as Leadframe.