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Multi-chip module, the Glossary

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.^[1]

71 relations: Advanced packaging (semiconductors), AMD APU, AMD Instinct, Apple silicon, Arrandale, ATI Technologies, Bubble memory, CDNA (microarchitecture), Chip carrier, Chiplet, Clarkdale (microprocessor), Co-fired ceramic, Die (integrated circuit), Dynamic random-access memory, EDRAM, Epyc, Espresso (processor), Flash memory, Flip chip, Graphics processing unit, High Bandwidth Memory, Hybrid integrated circuit, IBM, IBM 308X, IBM z196, Integrated circuit, Intel, Intel Core, Intel Graphics Technology, Interposer, Kaby Lake, Lead (electronics), Lunar Lake, Memory Stick, Meteor Lake, Micron Technology, MultiMediaCard, Network on a chip, Package on a package, Pentium D, Pentium OverDrive, Pentium Pro, Personal digital assistant, Power10, POWER2, POWER4, POWER5, POWER7, POWER8, Printed circuit board, ... Expand index (21 more) »
Chip carriers
Modularity

Advanced packaging (semiconductors)

Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged.

See Multi-chip module and Advanced packaging (semiconductors)

AMD APU

AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.

See Multi-chip module and AMD APU

AMD Instinct

AMD Instinct is AMD's brand of data center GPUs.

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Apple silicon

Apple silicon refers to a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture.

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Arrandale

Arrandale is the code name for a family of mobile Intel processors, sold as mobile Intel Core i3, i5 and i7 as well as Celeron and Pentium.

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ATI Technologies

ATI Technologies Inc., commonly called ATI, was a Canadian semiconductor technology corporation based in Markham, Ontario, that specialized in the development of graphics processing units and chipsets.

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Bubble memory

Bubble memory is a type of non-volatile computer memory that uses a thin film of a magnetic material to hold small magnetized areas, known as bubbles or domains, each storing one bit of data.

See Multi-chip module and Bubble memory

CDNA (microarchitecture)

CDNA (Compute DNA) is a compute-centered graphics processing unit (GPU) microarchitecture designed by AMD for datacenters.

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Chip carrier

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Multi-chip module and chip carrier are chip carriers.

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Chiplet

A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality.

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Clarkdale (microprocessor)

Clarkdale is the codename for Intel's first-generation Core i5, i3 and Pentium dual-core desktop processors.

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Co-fired ceramic

Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time.

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Die (integrated circuit)

A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated.

See Multi-chip module and Die (integrated circuit)

Dynamic random-access memory

Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal–oxide–semiconductor (MOS) technology.

See Multi-chip module and Dynamic random-access memory

EDRAM

Embedded DRAM (eDRAM) is dynamic random-access memory (DRAM) integrated on the same die or multi-chip module (MCM) of an application-specific integrated circuit (ASIC) or microprocessor.

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Epyc

Epyc (stylized as EPYC) is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture.

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Espresso (processor)

Espresso is the codename of the 32-bit central processing unit (CPU) used in Nintendo's Wii U video game console.

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Flash memory

Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed.

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Flip chip

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. Multi-chip module and Flip chip are chip carriers.

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Graphics processing unit

A graphics processing unit (GPU) is a specialized electronic circuit initially designed for digital image processing and to accelerate computer graphics, being present either as a discrete video card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles.

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High Bandwidth Memory

High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

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Hybrid integrated circuit

A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB).

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IBM

International Business Machines Corporation (using the trademark IBM), nicknamed Big Blue, is an American multinational technology company headquartered in Armonk, New York and present in over 175 countries.

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IBM 308X

The IBM 308X is a line of mainframe computers, of which the first model, the Model 3081 Processor Complex, was introduced November 12, 1980.

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IBM z196

The z196 microprocessor is a chip made by IBM for their zEnterprise 196 and zEnterprise 114 mainframe computers, announced on July 22, 2010.

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Integrated circuit

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

See Multi-chip module and Integrated circuit

Intel

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware.

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Intel Core

Intel Core is a line of multi-core (with the exception of Core Solo and Core 2 Solo) central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation.

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Intel Graphics Technology

Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU).

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Interposer

An interposer is an electrical interface routing between one socket or connection to another.

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Kaby Lake

Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016.

See Multi-chip module and Kaby Lake

Lead (electronics)

In electronics, a lead or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically.

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Lunar Lake

Lunar Lake is the codename for the upcoming Series 2 Core Ultra mobile processors designed by Intel, set for release in September 3, 2024.

See Multi-chip module and Lunar Lake

Memory Stick

The Memory Stick is a removable flash memory card format, originally launched by Sony in late 1998.

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Meteor Lake

Meteor Lake is Intel's codename for the first generation of Intel Core Ultra mobile processors, and was officially launched on December 14, 2023.

See Multi-chip module and Meteor Lake

Micron Technology

Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives.

See Multi-chip module and Micron Technology

MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage.

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Network on a chip

A network on a chip or network-on-chip (NoC or)This article uses the convention that "NoC" is pronounced. Multi-chip module and network on a chip are Modularity.

See Multi-chip module and Network on a chip

Package on a package

Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Multi-chip module and package on a package are chip carriers.

See Multi-chip module and Package on a package

Pentium D

Pentium D is a range of desktop 64-bit x86-64 processors based on the NetBurst microarchitecture, which is the dual-core variant of the Pentium 4 manufactured by Intel.

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Pentium OverDrive

The Pentium OverDrive was a microprocessor marketing brand name used by Intel, to cover a variety of consumer upgrade products sold in the mid-1990s.

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Pentium Pro

The Pentium Pro is a sixth-generation x86 microprocessor developed and manufactured by Intel and introduced on November 1, 1995.

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Personal digital assistant

A personal digital assistant (PDA) is a multi-purpose mobile device which functions as a personal information manager.

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Power10

Power10 is a superscalar, multithreading, multi-core microprocessor family, based on the open source Power ISA, and announced in August 2020 at the Hot Chips conference; systems with Power10 CPUs.

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POWER2

The POWER2, originally named RIOS2, is a processor designed by IBM that implemented the POWER instruction set architecture.

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POWER4

The POWER4 is a microprocessor developed by International Business Machines (IBM) that implemented the 64-bit PowerPC and PowerPC AS instruction set architectures.

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POWER5

The POWER5 is a microprocessor developed and fabricated by IBM.

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POWER7

POWER7 is a family of superscalar multi-core microprocessors based on the Power ISA 2.06 instruction set architecture released in 2010 that succeeded the POWER6 and POWER6+.

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POWER8

POWER8 is a family of superscalar multi-core microprocessors based on the Power ISA, announced in August 2013 at the Hot Chips conference.

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Printed circuit board

A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit.

See Multi-chip module and Printed circuit board

Radeon RX 7000 series

The Radeon RX 7000 series is a series of graphics processing units developed by AMD, based on their RDNA 3 architecture.

See Multi-chip module and Radeon RX 7000 series

RDNA 3

RDNA 3 is a GPU microarchitecture designed by AMD, released with the Radeon RX 7000 series on December 13, 2022.

See Multi-chip module and RDNA 3

Ryzen

Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture.

See Multi-chip module and Ryzen

Samsung

Samsung Group (stylised as SΛMSUNG) is a South Korean multinational manufacturing conglomerate headquartered in Samsung Digital City, Suwon, South Korea.

See Multi-chip module and Samsung

SD card

Secure Digital, officially abbreviated as SD, is a proprietary, non-volatile, flash memory card format the SD Association (SDA) developed for use in portable devices.

See Multi-chip module and SD card

Single-Chip Module

A single-chip module (SCM) is a chip package with only one die.

See Multi-chip module and Single-Chip Module

Sony

, formerly known as and, commonly known as Sony, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan.

See Multi-chip module and Sony

System in a package

A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.

See Multi-chip module and System in a package

System on a chip

A system on a chip or system-on-chip (SoC; pl. SoCs) is an integrated circuit that integrates most or all components of a computer or other electronic system.

See Multi-chip module and System on a chip

Thin film

A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness.

See Multi-chip module and Thin film

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.

See Multi-chip module and Three-dimensional integrated circuit

References

[1] https://en.wikipedia.org/wiki/Multi-chip_module

Also known as Chip stack multi-chip module, Heterogeneous integration, Multi chip module, Multi-chip package, Multichip module.

, Radeon RX 7000 series, RDNA 3, Ryzen, Samsung, SD card, Single-Chip Module, Sony, System in a package, System on a chip, Thin film, Three-dimensional integrated circuit, Universal Flash Storage, VIA Nano, Wii U, Xbox 360, Xenos (graphics chip), Xeon, Zen (microarchitecture), Zen 2, Zen 3, Zen+.

Multi-chip module, the Glossary

Table of Contents

See also

Chip carriers

Modularity

References