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Thermally conductive pad, the Glossary

In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).^[1]

22 relations: Aluminium, AMD, Central processing unit, Computer cooling, Computing, Copper, Dynamic frequency scaling, Electronics, Heat sink, Hot-melt adhesive, Integrated circuit, Intel, List of integrated circuit packaging types, List of thermal conductivities, Overclocking, Paraffin wax, Phase-change material, Silicone, Thermal adhesive, Thermal conduction, Thermal interface material, Thermal paste.
Computer hardware cooling

Aluminium

Aluminium (Aluminum in North American English) is a chemical element; it has symbol Al and atomic number 13.

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AMD

Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and fabless semiconductor company based in Santa Clara, California, that designs, develops and sells computer processors and related technologies for business and consumer markets.

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Central processing unit

A central processing unit (CPU), also called a central processor, main processor, or just processor, is the most important processor in a given computer.

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Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Thermally conductive pad and computer cooling are computer hardware cooling.

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Computing

Computing is any goal-oriented activity requiring, benefiting from, or creating computing machinery.

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Copper

Copper is a chemical element; it has symbol Cu and atomic number 29.

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Dynamic frequency scaling

Dynamic frequency scaling (also known as CPU throttling) is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip.

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Electronics

Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other electrically charged particles.

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Heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Thermally conductive pad and heat sink are computer hardware cooling and heat transfer.

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Hot-melt adhesive

Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun.

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Integrated circuit

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

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Intel

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware.

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List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

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List of thermal conductivities

In heat transfer, the thermal conductivity of a substance, k, is an intensive property that indicates its ability to conduct heat. Thermally conductive pad and List of thermal conductivities are heat transfer.

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Overclocking

In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer.

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Paraffin wax

Paraffin wax (or petroleum wax) is a soft colorless solid derived from petroleum, coal, or oil shale that consists of a mixture of hydrocarbon molecules containing between 20 and 40 carbon atoms.

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Phase-change material

A phase-change material (PCM) is a substance which releases/absorbs sufficient energy at phase transition to provide useful heat or cooling.

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Silicone

In organosilicon and polymer chemistry, a silicone or polysiloxane is a polymer composed of repeating units of siloxane (where R.

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Thermal adhesive

Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. Thermally conductive pad and thermal adhesive are materials stubs.

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Thermal conduction

Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. Thermally conductive pad and Thermal conduction are heat transfer.

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Thermal interface material

A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. Thermally conductive pad and thermal interface material are computer hardware cooling and heat transfer.

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Thermal paste

Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. Thermally conductive pad and thermal paste are computer hardware cooling, cooling technology and heat transfer.

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References

[1] https://en.wikipedia.org/wiki/Thermally_conductive_pad

Also known as Thermal pad (computing).