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UCIe, the Glossary

Index UCIe

Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets.[1]

Table of Contents

  1. 30 relations: Alibaba Group, AMD, Arm Holdings, ASE Group, Bus (computing), Chiplet, Compute Express Link, Die (integrated circuit), Flit (computer networking), GitHub, Google Cloud, Intel, Interconnect (integrated circuits), Interposer, Joule, Meta Platforms, Microsoft, Nvidia, Open standard, PCI Express, Photomask, Physical layer, Qualcomm, Samsung, Semiconductor device fabrication, SerDes, System on a chip, Three-dimensional integrated circuit, Transfers per second, TSMC.

  2. Computer-related introductions in 2022

Alibaba Group

Alibaba Group Holding Limited, branded as Alibaba, is a Chinese multinational technology company specializing in e-commerce, retail, Internet, and technology.

See UCIe and Alibaba Group

AMD

Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and fabless semiconductor company based in Santa Clara, California, that designs, develops and sells computer processors and related technologies for business and consumer markets.

See UCIe and AMD

Arm Holdings

Arm Holdings plc (formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a British semiconductor and software design company based in Cambridge, England, whose primary business is the design of central processing unit (CPU) cores that implement the ARM architecture family of instruction sets.

See UCIe and Arm Holdings

ASE Group

Advanced Semiconductor Engineering, Inc., previously known as ASE Group, is a leading provider of independent semiconductor packaging and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.

See UCIe and ASE Group

Bus (computing)

In computer architecture, a bus (historically also called data highway or databus) is a communication system that transfers data between components inside a computer, or between computers.

See UCIe and Bus (computing)

Chiplet

A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality.

See UCIe and Chiplet

Compute Express Link (CXL) is an open standard for high-speed, high capacity central processing unit (CPU)-to-device and CPU-to-memory connections, designed for high performance data center computers. UCIe and compute Express Link are serial buses.

See UCIe and Compute Express Link

Die (integrated circuit)

A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated.

See UCIe and Die (integrated circuit)

Flit (computer networking)

In computer networking, a flit (flow control unit or flow control digit) is a link-level atomic piece that forms a network packet or stream.

See UCIe and Flit (computer networking)

GitHub

GitHub is a developer platform that allows developers to create, store, manage and share their code.

See UCIe and GitHub

Google Cloud

Google Cloud refers to the Google Cloud Platform or other past and present cloud-computing services including.

See UCIe and Google Cloud

Intel

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware.

See UCIe and Intel

Interconnect (integrated circuits)

In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements (such as transistors) together electrically.

See UCIe and Interconnect (integrated circuits)

Interposer

An interposer is an electrical interface routing between one socket or connection to another.

See UCIe and Interposer

Joule

The joule (pronounced, or; symbol: J) is the unit of energy in the International System of Units (SI).

See UCIe and Joule

Meta Platforms, Inc., doing business as Meta, and formerly named Facebook, Inc., and TheFacebook, Inc., is an American multinational technology conglomerate based in Menlo Park, California.

See UCIe and Meta Platforms

Microsoft

Microsoft Corporation is an American multinational corporation and technology company headquartered in Redmond, Washington.

See UCIe and Microsoft

Nvidia

Nvidia Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware.

See UCIe and Nvidia

Open standard

An open standard is a standard that is openly accessible and usable by anyone. UCIe and open standard are open standards.

See UCIe and Open standard

PCI Express

PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. UCIe and PCI Express are serial buses.

See UCIe and PCI Express

Photomask

A photomask (also simply called a mask) is an opaque plate with transparent areas that allow light to shine through in a defined pattern.

See UCIe and Photomask

Physical layer

In the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer: the layer most closely associated with the physical connection between devices.

See UCIe and Physical layer

Qualcomm

Qualcomm Incorporated is an American multinational corporation headquartered in San Diego, California, and incorporated in Delaware.

See UCIe and Qualcomm

Samsung

Samsung Group (stylised as SΛMSUNG) is a South Korean multinational manufacturing conglomerate headquartered in Samsung Digital City, Suwon, South Korea.

See UCIe and Samsung

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM).

See UCIe and Semiconductor device fabrication

SerDes

A Serializer/Deserializer (SerDes) is a pair of functional blocks commonly used in high speed communications to compensate for limited input/output.

See UCIe and SerDes

System on a chip

A system on a chip or system-on-chip (SoC; pl. SoCs) is an integrated circuit that integrates most or all components of a computer or other electronic system.

See UCIe and System on a chip

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.

See UCIe and Three-dimensional integrated circuit

Transfers per second

In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel.

See UCIe and Transfers per second

TSMC

Taiwan Semiconductor Manufacturing Company Limited (TSMC or Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company.

See UCIe and TSMC

See also

References

[1] https://en.wikipedia.org/wiki/UCIe