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VIA Eden, the Glossary

VIA Eden is a variant of VIA's C3/C7 x86 processors, designed to be used in embedded devices.^[1]

16 relations: Alternate Instruction Set, Ball grid array, Central processing unit, Clock rate, EPIA, Front-side bus, List of VIA Eden microprocessors, Mini-ITX, Motherboard, Nano-ITX, Pico-ITX, Semiconductor package, Thermal design power, VIA C3, VIA C7, VIA Technologies.
Computer-related introductions in 2007
VIA Technologies x86 microprocessors

Alternate Instruction Set

The Alternate Instruction Set (AIS) is a second 32-bit instruction set architecture found in some x86 CPUs made by VIA Technologies. VIA Eden and Alternate Instruction Set are VIA Technologies x86 microprocessors.

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Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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Central processing unit

A central processing unit (CPU), also called a central processor, main processor, or just processor, is the most important processor in a given computer.

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Clock rate

In computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed.

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EPIA

VIA EPIA (VIA Embedded Platform Innovative Architecture) is a series of mini-ITX, em-ITX, nano-ITX, pico-ITX and pico-ITXe motherboards with integrated VIA processors. VIA Eden and EPIA are computer hardware stubs.

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Front-side bus

The front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s.

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List of VIA Eden microprocessors

The Eden microprocessors from VIA Technologies are fifth- and sixth-generation CPUs targeted at the embedded market. VIA Eden and List of VIA Eden microprocessors are VIA Technologies x86 microprocessors.

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Mini-ITX

Mini-ITX is a motherboard form factor developed by VIA Technologies in 2001.

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Motherboard

A motherboard (also called mainboard, main circuit board, MB, base board, system board, or, in Apple computers, logic board) is the main printed circuit board (PCB) in general-purpose computers and other expandable systems.

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Nano-ITX

Nano-ITX is a computer motherboard form factor first proposed by VIA Technologies at CeBIT in March 2003, and implemented in late 2005. VIA Eden and Nano-ITX are computer hardware stubs.

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Pico-ITX

In computer design, Pico-ITX is a PC motherboard form factor announced by VIA Technologies in January 2007 and demonstrated later the same year at CeBIT.

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Semiconductor package

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.

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Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload.

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References

[1] https://en.wikipedia.org/wiki/VIA_Eden