en.unionpedia.org

Dymalloy, the Glossary

Index Dymalloy

Dymalloy is a metal matrix composite of 20% copper and 80% silver alloy matrix with type I diamond.[1]

Table of Contents

  1. 36 relations: AlSiC, Aluminium, Brilliant Pebbles, Carbide, Chromium, Cooperative research and development agreement, Copper, Diamond, Diamond type, Gallium arsenide, Gold, Graphite, Hafnium, Lawrence Livermore National Laboratory, Magnesium, Metal matrix composite, Microelectronics, Multi-chip module, Niobium, Physical vapor deposition, Rhenium, Silicon, Silicon carbide, Silver, Sun Microsystems, Tantalum, Thermal conductivity and resistivity, Thermal expansion, Titanium, Tungsten, Tungsten carbide, Vanadium, Wafer (electronics), Waste heat, Zinc, Zirconium.

  2. Chip carriers
  3. Diamond
  4. Metal matrix composites

AlSiC

AlSiC, pronounced "alsick", is a metal matrix composite consisting of aluminium matrix with silicon carbide particles. Dymalloy and AlSiC are Chip carriers and metal matrix composites.

See Dymalloy and AlSiC

Aluminium

Aluminium (Aluminum in North American English) is a chemical element; it has symbol Al and atomic number 13.

See Dymalloy and Aluminium

Brilliant Pebbles

Brilliant Pebbles was a ballistic missile defense (BMD) system proposed by Lowell Wood and Edward Teller of the Lawrence Livermore National Laboratory (LLNL) in 1987, near the end of the Cold War.

See Dymalloy and Brilliant Pebbles

Carbide

In chemistry, a carbide usually describes a compound composed of carbon and a metal.

See Dymalloy and Carbide

Chromium

Chromium is a chemical element; it has symbol Cr and atomic number 24.

See Dymalloy and Chromium

Cooperative research and development agreement

In the United States, a cooperative research and development agreement (CRADA or CRDA) is an agreement between a government agency and another government agency, a private company, non-profit, or university to work together on research and development.

See Dymalloy and Cooperative research and development agreement

Copper

Copper is a chemical element; it has symbol Cu and atomic number 29.

See Dymalloy and Copper

Diamond

Diamond is a solid form of the element carbon with its atoms arranged in a crystal structure called diamond cubic.

See Dymalloy and Diamond

Diamond type

Diamond type is a method of scientifically classifying diamonds by the level and type of their chemical impurities. Dymalloy and diamond type are diamond.

See Dymalloy and Diamond type

Gallium arsenide

Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a zinc blende crystal structure.

See Dymalloy and Gallium arsenide

Gold

Gold is a chemical element; it has symbol Au (from the Latin word aurum) and atomic number 79.

See Dymalloy and Gold

Graphite

Graphite is a crystalline form of the element carbon.

See Dymalloy and Graphite

Hafnium

Hafnium is a chemical element; it has symbol Hf and atomic number 72.

See Dymalloy and Hafnium

Lawrence Livermore National Laboratory

Lawrence Livermore National Laboratory (LLNL) is a federally funded research and development center in Livermore, California, United States.

See Dymalloy and Lawrence Livermore National Laboratory

Magnesium

Magnesium is a chemical element; it has symbol Mg and atomic number 12.

See Dymalloy and Magnesium

In materials science, a metal matrix composite (MMC) is a composite material with fibers or particles dispersed in a metallic matrix, such as copper, aluminum, or steel. Dymalloy and metal matrix composite are metal matrix composites.

See Dymalloy and Metal matrix composite

Microelectronics

Microelectronics is a subfield of electronics.

See Dymalloy and Microelectronics

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Dymalloy and multi-chip module are Chip carriers.

See Dymalloy and Multi-chip module

Niobium

Niobium is a chemical element; it has symbol Nb (formerly columbium, Cb) and atomic number 41.

See Dymalloy and Niobium

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers.

See Dymalloy and Physical vapor deposition

Rhenium

Rhenium is a chemical element; it has symbol Re and atomic number 75.

See Dymalloy and Rhenium

Silicon

Silicon is a chemical element; it has symbol Si and atomic number 14.

See Dymalloy and Silicon

Silicon carbide

Silicon carbide (SiC), also known as carborundum, is a hard chemical compound containing silicon and carbon.

See Dymalloy and Silicon carbide

Silver

Silver is a chemical element; it has symbol Ag (derived from Proto-Indo-European ''*h₂erǵ'')) and atomic number 47. A soft, white, lustrous transition metal, it exhibits the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. The metal is found in the Earth's crust in the pure, free elemental form ("native silver"), as an alloy with gold and other metals, and in minerals such as argentite and chlorargyrite.

See Dymalloy and Silver

Sun Microsystems

Sun Microsystems, Inc. (Sun for short) was an American technology company that sold computers, computer components, software, and information technology services and created the Java programming language, the Solaris operating system, ZFS, the Network File System (NFS), and SPARC microprocessors.

See Dymalloy and Sun Microsystems

Tantalum

Tantalum is a chemical element; it has symbol Ta and atomic number 73.

See Dymalloy and Tantalum

Thermal conductivity and resistivity

The thermal conductivity of a material is a measure of its ability to conduct heat.

See Dymalloy and Thermal conductivity and resistivity

Thermal expansion

Thermal expansion is the tendency of matter to increase in length, area, or volume, changing its size and density, in response to an increase in temperature (usually excluding phase transitions).

See Dymalloy and Thermal expansion

Titanium

Titanium is a chemical element; it has symbol Ti and atomic number 22.

See Dymalloy and Titanium

Tungsten

Tungsten (also called wolfram) is a chemical element; it has symbol W and atomic number 74.

See Dymalloy and Tungsten

Tungsten carbide

Tungsten carbide (chemical formula: WC) is a chemical compound (specifically, a carbide) containing equal parts of tungsten and carbon atoms.

See Dymalloy and Tungsten carbide

Vanadium

Vanadium is a chemical element; it has symbol V and atomic number 23.

See Dymalloy and Vanadium

Wafer (electronics)

In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.

See Dymalloy and Wafer (electronics)

Waste heat

Waste heat is heat that is produced by a machine, or other process that uses energy, as a byproduct of doing work.

See Dymalloy and Waste heat

Zinc

Zinc is a chemical element with the symbol Zn and atomic number 30.

See Dymalloy and Zinc

Zirconium

Zirconium is a chemical element; it has symbol Zr and atomic number 40.

See Dymalloy and Zirconium

See also

Chip carriers

Diamond

Metal matrix composites

References

[1] https://en.wikipedia.org/wiki/Dymalloy