CN100470117C - Methods and apparatus for an LED light - Google Patents
- ️Wed Mar 18 2009
CN100470117C - Methods and apparatus for an LED light - Google Patents
Methods and apparatus for an LED light Download PDFInfo
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Publication number
- CN100470117C CN100470117C CNB2004800285689A CN200480028568A CN100470117C CN 100470117 C CN100470117 C CN 100470117C CN B2004800285689 A CNB2004800285689 A CN B2004800285689A CN 200480028568 A CN200480028568 A CN 200480028568A CN 100470117 C CN100470117 C CN 100470117C Authority
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- emitting diode
- luminous plaque
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Abstract
An LED light engine comprising a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.
Description
Technical field
The application is usually directed to illuminating product, particularly relates to the luminous plaque that has light emitting diode (light emitting diode).
Background technology
For many years, light emitting diode (LED) is used to indicator lamp, digital display of relative low energy or the like.But in recent years, the brightness of single light emitting diode and energy have had large increase, can be used for the device of 1 watt and 5 watts.
Though volume is little, light emitting diode is compared with the traditional lighting product, and very high usefulness and average life span are arranged.For example, the usefulness of a typical incandescent lamp bulb is every watt of 10-12 lumen, and continues about 1000 to 2000 hours; The usefulness of a common fluorescent lamp tube is every watt of 40-80 lumen, and continues 10000 to 20000 hours; The usefulness of a typical based on halogen bulb is every watt of 20 lumen, and continues 2000 to 3000 hours.On the contrary, red-orange led can be sent every watt of 55 lumen, and average life span is 100000 hours.
Although the usefulness of light emitting diode has had large increase and can considerable energy saving, existing systems still can't be utilized the Ideal Characteristics of light emitting diode, and produces and can substitute employed standard illuminants product in commercial and consumer field.This mainly is because the inherence restriction of existing luminous plaque.
For example, commercial high energy light-emitting diode assembly produces a large amount of heat, is approximately 50W/cm 2In order to obtain reliability and longer service life, it is very important keeping the temperature of light emitting diode very low.Existing known system can't also will keep necessary heat transfer property simultaneously with the assembling up of a plurality of light emitting diode compactnesses.
Similarly; preferably protect light emitting diode die by some coatings; but a plurality of light emitting diode dies of a row are protected in the semiconductor passivation that can't use standard reliably, because mould bonding and other integrity problem that the thermal stress that temperature excursion (particularly in large assemblies) causes will cause the shear line bonding, break.
And, the trial that mixes a plurality of colorful light-emitting diodes generation white lights is also undesirable, even this is because light-emitting diode assembly very closely fits together (remaining the restriction that is subjected to heat transmission reason), the light that is produced by this system can not mix well, and its result is the spot of uneven each color of generation rather than the uniform projection of white light.Similarly, the synthesized semiconductor led color of producing at present can't produce a certain wavelength (for example, the gold-tinted of 575nm) effectively.It is a reasonable method that effective redness of general and green LED mix.
Therefore, need a kind of led light device that can overcome these and other limitation of prior art.
Summary of the invention
In general, the invention provides the luminous plaque of multicore sheet (MCOB) on a kind of novel, plate, this luminous plaque comprises high thermal conductivity substrate, several are mechanically connected to suprabasil light emitting diode semiconductor device, be fixed in the substrate and around the outer dike (outer dike) of above-mentioned light-emitting diode assembly at least a portion, with be positioned on the light-emitting diode assembly and by roughly transparent polymeric sealant (for example, the silicones of optical-grade) that outer dike limited.
According to one embodiment of present invention, high thermal conductivity substrate comprises the printed circuit board (PCB) (PCB) of metallic cover.
According to various embodiments of the present invention, the electric connection structure of light-emitting diode assembly is series, parallel or their combination.
According to another embodiment of the invention, luminous plaque comprises and is fixed on suprabasil reflector (for example, being the reflector of general conical) to form outer dike.
According to another embodiment of the invention, optics (for example, lens, optical filter etc.) optics is connected on the polymeric sealant that is positioned at light-emitting diode assembly.
Like this, the invention provides a kind of efficient LED luminous plaque that is widely used in lighting device.
The accompanying drawing summary
Can obtain more complete understanding of the present invention with reference to detailed description in conjunction with the accompanying drawings, wherein identical reference marker is represented components identical in institute's drawings attached, and:
Fig. 1 is a kind of isometric view of luminous plaque according to an embodiment of the invention, and this luminous plaque has the light-emitting diode chip for backlight unit that surface that a plurality of parallel connections and series connection constitute is connected;
Fig. 2 is a kind of vertical view of luminous plaque in accordance with another embodiment of the present invention, and this luminous plaque has the light-emitting diode chip for backlight unit of the wire-bonded that a plurality of parallel connections and series connection constitute; Wherein each light-emitting diode chip for backlight unit comprises two bonding pads;
Fig. 3 is a kind of vertical view of luminous plaque in accordance with another embodiment of the present invention, and this luminous plaque has the light-emitting diode chip for backlight unit of the wire-bonded of a plurality of parallel connections;
Fig. 4 is a kind of vertical view of luminous plaque in accordance with another embodiment of the present invention, and this luminous plaque has the light-emitting diode chip for backlight unit of the wire-bonded that a plurality of parallel connections and series connection constitute; Wherein each light-emitting diode chip for backlight unit comprises a bonding pad;
Fig. 5 is the equal proportion partial view of the luminous plaque of example, and this luminous plaque comprises a suprabasil circuit of LED tube core of the PCB in metallic cover, high-termal conductivity;
Fig. 6 is the isometric view that comprises the luminous plaque of interior embankment and outer dike;
Fig. 7 A and 7B are respectively the vertical view and the side views of luminous plaque, and this luminous plaque comprises outer dike and the interior embankment that is filled with sealant material;
Fig. 8 is the isometric view that comprises the luminous plaque of reflector and interior embankment;
Fig. 9 A and 9B are respectively the vertical view and the side views of the luminous plaque among Fig. 8;
Figure 10 A and 10B are respectively the vertical view and the side views of luminous plaque that has the lens of example;
Figure 11 is the curve map of the spectrum of expression different temperatures white light.
The specific embodiment
Explanation hereinafter only is the description to exemplary embodiment of the present, and limits scope of the present invention, purposes or structure never in any form.On the contrary, following description is the description in order to realize that different embodiments of the invention are provided convenience.Obviously, without departing from the present invention, the function of the element of describing among these embodiment and arrangement can be made multiple variation.
General introduction
In general, led light according to the present invention comprises that high thermal conductivity substrate (for example, the PCB of metallic cover), a plurality ofly be mechanically connected to this suprabasil a plurality of light emitting diodes (light emitting diode) semiconductor device, be fixed in this substrate and around the outer dike of at least a portion (being preferably whole) of this light-emitting diode assembly, and be arranged on a plurality of light-emitting diode assemblies and by the polymeric seal agent (for example, the silicones of optical-grade) of the substantially transparent of outer dike restriction.In one embodiment, this luminous plaque comprises and is fixed on suprabasil reflector (for example, the general conical reflector), to form outer dike and to help guiding and focused light and/or mix light from the light-emitting diode assembly of two or more different colours.In other embodiments, as described further below, one or more optical elements such as optical filter, lens etc. are fixed on the sealant coating.
The connectivity of light emitting diode
With reference to the Fig. 1 that has represented exemplary electric layout of the present invention (electrical topology),
luminous plaque100 comprises a plurality of light-
emitting diode assemblies104 on the high thermal conductivity substrate (or abbreviate as " substrate ") 102 (surface connect light-emitting diode chip for backlight unit) in the present embodiment, that are connected to.In the present embodiment,
substrate102 comprises and being electrically connected with a plurality of light-
emitting diode assemblies104 or the conductive trace figure (conductive trace pattern) 106 of mechanical connection.
Trace figure 106 is configured to link to each other with AC or DC power supply according to application.For example, in an illustrated embodiment, provide DC V +Terminals 108 and V 0Terminals 110.In some cases, these terminals are commonly referred to as " input ".
Light-
emitting diode assembly104 is electrically connected mutually by any suitable mode.As shown in Figure 1, for example, light-
emitting diode assembly104 can be for circuit so that the series connection of the group of a plurality of isolated systems links to each other, and wherein these groups itself are with respect to the input parallel connection.In an illustrated embodiment, seven parallel columns itself are with in parallel across
terminals108 and 110, and every row all comprise the light-emitting diode assembly of five series connection.Perhaps, referring to Fig. 3, a plurality of light-emitting diode assemblies 104 (chip of 49 wire-bonded in the present embodiment) are connected with
terminals110 and 108.
Usually, although the embodiment shown in above-mentioned the present invention includes the light-emitting diode assembly of any number, these light-emitting diode assemblies can adopt any suitable electric layout (series, parallel or their combination) and any suitable geometry.For example, this light-emitting diode assembly can be orientated line pattern (for example, square or rectangular array), circle or curve pattern, any or random pattern as, or in their any combination pattern.In addition, light-emitting diode assembly can be arranged in a plurality of zones, and wherein each zone has the different patterns and the device of varying number.
The quantity that is used for the light-emitting
diode assembly104 of device can be selected according to a plurality of design variables, for example comprises the characteristic of power supply (AC is converted to DC, effectively dc voltage, effective power etc.), this light-emitting diode assembly self characteristics (forward voltage (V for example f), rated power etc.), required color matching (hereinafter describing), the characteristic (for example, thermal conductivity, geometry etc.) of
substrate102 and the characteristic of purposes characteristic and external heat state.
In one embodiment, these light-emitting diode assembly serial or parallel connections connect so that whole associating positive voltages of light-emitting diode assembly and electricity input coupling.For example, in the U.S. and Canadian domestic. applications, 120VAC must be 162V DC by the power supply changeover device rectification before inputing to light emitting diode.In general, according to the V of each light emitting diode f, 40 to 80 light-emitting diode assemblies of can connecting are to accept the DC input of 162V rectification.As everyone knows, the specified Vf of typical redness and amber light-emitting diode assembly is about 1.8 to 2.5V, the specified V of green and blue light emitting diode fBe about 3.0 to 4.5V.In order to use lower voltage, for example 12V DC or 24V DC MR-16 so that obtain required light output and with the input voltage coupling, just must be with the light-emitting diode chip for backlight unit serial or parallel connection.Outside the U.S. and Canada, the most countries domestic power supply is 220V or 230V, so need to use 80 to 160 light-emitting diode chip for backlight unit be together in series with rectification after DC be complementary.
By associating positive voltage and input power source voltage are complementary, the power supply that provides to luminous plaque can be provided, so just need not connect with system with large volume, complicated voltage rising or the rectifier that reduces or with Switching power; It is just enough that simply, effectively AC is converted to the rectification circuit of DC.This just make luminous plaque be incorporated in the assembly of compact conformation-for example, insert the bulb assembly in the standard lamp socket.
Light-emitting diode assembly
Any suitable light-
emitting diode assembly104 can be used for connecting with the present invention, and these devices comprise single tube core, wafer-level package, conventional package, surperficial jockey (SMD) or any other present light-emitting diode assembly known or future development.In the embodiment that introduces in conjunction with Fig. 1, for example, light-
emitting diode assembly104 comprises surperficial jockey, and this surface jockey has the lip-deep electric contact that directly is installed to trace figure 106, for example, on " flip chip (flip-chip) " or the tube core of solder protuberance.
Perhaps, with reference to accompanying drawing 2, this light-emitting diode assembly can comprise the light-emitting diode chip for
backlight unit204 of connection (by welding connection, epoxy cement etc.) to the
PCB liner206 separately, wherein each
tube core204 has at least two bonding pads, is used for providing through wire-bonded
connectors202 electrically connecting.Perhaps, Zhong Jian PCB
liner208 can be used for the wire-bonded between the convenient independent tube core.This embodiment shows seven groups of parallel tube cores that seven tube core series connection form; Yet, as mentioned above, the invention is not restricted to this, can comprise tube core coupled in series, the parallel connection of any number or mix connecting.
Fig. 5 has represented the equal proportion partial sectional view of the single light-emitting diode assembly shown in Fig. 2.As shown in the figure,
substrate102 comprises the high-
termal conductivity base504 that is coated with high-termal conductivity, electrically insulating
material502 on it.
Single PCB trace208 and 206 places on the
layer502, and
LED core204 is engaged on the PCB trace 206.The wire-bonded (not shown) is used for
tube core204 and contiguous tube core are coupled to each other (for example, utilizing middle trace 208).
Fig. 4 has also represented an alternative embodiment of the invention.According to this design, single circuit of
LED tube core204 is connected (through solder bonds or other conductive attachment) to PCB liner 206.Single then wire-
bonded connectors202 is used for
PCB liner206 is attached to the engaging zones of adjacent die.That is to say that each
LED core204 all comprises a single brace, the back side of this tube core is as second electric contact.
One or more the suitable semi-conducting material manufacturings of light-emitting
diode assembly104 usefulness for example, comprise GaAsP, GaP, AlGaAs AlGaInP, GaInN etc.The size of this selected light-
emitting diode assembly104 can use different design parameters to determine.In one embodiment, light-
emitting diode assembly104 is thick about 100 microns, the tube core of 300 * 300 square microns.Those skilled the in art will appreciate that the present invention is not limited to this.
Be well known that each light-emitting diode assembly has the particular color corresponding to specific wavelength (or frequency).An aspect of of the present present invention relates to the ability that a plurality of light emitting diodes that use different colours produce radiative required color.Usually, be installed in suprabasil one group of light-emitting diode assembly and comprise x red light emitting diodes, a y green LED and Z blue LED, wherein selected x:y:z ratio is to obtain the white light of certain relevant colour temperature (CCT).
Usually, the led color of any amount can be used in required arbitrarily ratio.Typical incandescent lamp bulb produces the light (warm white) with 2700K CCT, and fluorescent lamp bulb produces the light of about 5000KCCT.Like this, typically need more redness and yellow light-emitting diode to obtain the light of 2700K, light for 5000K then needs more blue LED. reproduce index (CRI) (ColorRendering Index) in order to obtain high color, light source must be launched the white light with the spectrum that almost covers visible light four corner (380nm to 770nm wavelength), so that in mixing, occur dark red, light red, amber, pale green, dark green, pale blue and dark blue color.
In order to reach these purposes, the present invention allows to use the light-emitting diode assembly with different wave length in luminous plaque.In one embodiment, for example, in order to obtain the light of 3200K, the mixed proportion of R (620nm): Y (590nm): G (525nm): B (465nm) (with respect to the number of light emitting diode) is 6:2:5:1.According to another embodiment, the mixed proportion of R:Y:G:B is 7:3:7:2, is used to obtain the light of 3900K.In another embodiment, the ratio of 10:3:10:4 is used for obtaining the light of 5000K. and the spectrum of each of above-mentioned three embodiment is represented in Figure 11.
Be understandable that the mixed proportion of enumerating is by the brightness and the decision of their wavelength of chip.Therefore, the present invention is not limited to the quantity of the light emitting diode kind that can be used for forming institute's light requirement output.
Except white light, the present invention also can utilize similar blend of colors technology to produce the light of particular color.That is,, also can utilize the light emitting diode combined of two or more colors to form composite coloured in some cases though often can utilize a plurality of single color LEDs to produce required color.
In particular, because the material behavior of led compound semiconductors, the effect of some wavelength is unwanted.For example, there is not traditional compound semiconductor materials can effectively launch the gold-tinted of 575nm.This wavelength, 575nm, the performance valley between AlGaInP and CaInN semiconductor.Yet,, can produce gold-tinted with required effect by mixing the light-emitting diode assembly of making by these two kinds of materials.
Substrate
102 comprises enough provide the mechanical support arbitrary structures can for light-
emitting diode assembly104, and this structure provides required thermal characteristics-promptly simultaneously, by all or part of heat that helps to dissipate and produced by light-emitting diode assembly 104.In this,
substrate102 is preferably high thermal-conductivity substrate.
Term as used herein " high thermal conductivity substrate " is meant that its effective thermal conductivity is greater than 1W/ ° of K-m, more preferably greater than the substrate of about 3W/ ° K-m.Therefore the geometry and the material of this
substrate102 can be according to its application change.In one embodiment,
substrate102 comprises the PCB of a metallic cover, for example, and the hot clad substrates of ThermagonT-Lam or Bergquist.Can utilize traditional FR-4PCB technology to make these metallic cover PCB, and therefore save cost relatively.Other substrate that is fit to comprises various hybrid ceramic substrates and enamel metallic substrates.In addition, by in substrate, using white mask and making trace circuits silver-plated, can add the reflection of high light from substrate.
Sealant layer
Preferably, the polymeric sealant of substantial transparent is arranged on the light-emitting diode assembly, suitably solidifies so that protective layer to be provided then.In a preferred embodiment, the sealing agent comprises the silicones of optical-grade.The characteristic that can select the sealing agent for example, is selected by the light that light-emitting diode assembly produces by filtering to obtain other optical characteristics.Meanwhile, this protection sealant layer is enough soft keeping out the thermal drift (thermal excursion) that assembly bears, and does not make tube core, lead-in wire and other component ageing.
Fig. 6,7A and Fig. 7 B represent the different views of one embodiment of the invention, and the sealant that wherein covers light-emitting diode assembly is suitable for by the embankment structure qualification.In particular, the
luminous plaque100 of Fig. 6 comprises
outer dike602, its around
LED core204 at least-part.In a preferred embodiment,
embankment602 be generally around the array of
whole LED core204, be roughly rectangle, square, hexagon, circle, octagon or oval structure.
Outer dike602 is suitable for utilizing adhesive or other suitable method of attachment is connected in the substrate 102.Owing to the reason of optics is preferably circular embankment.
As shown in the figure, sealant material preferably is deposited on the
LED core204, so that it fills up the space that is formed by outer dike 602.That is to say that with reference to the cross section (section A-A) shown in Fig. 7 B,
sealant material606 is filled on the end face of outer dike 602.In addition,
outer dike602 is preferably made by the material of substantial transparent, for example, and transparent plastic (for example, Merlon) material.Its transparency allows to emit around the light at luminous plaque edge.
In alternate embodiments, one second,
interior embankment604 are positioned near the center of LED core 204.The effect of
interior embankment604 is restriction sealants, and is preferably transparent material.The appearance of
interior embankment604 allows to connect by the circuit board center.
Tore of reflection
According to another embodiment, luminous plaque comprises basic tore of reflection around light-emitting diode assembly, and it helps to focus on and/or guide the light that is produced by system.
Be connected to suitably in the
substrate102 of luminous plaque in the mode that all
LED cores204 all are positioned on the reflector base with reference to 8, one
exemplary reflectors802 of accompanying drawing.In an illustrated embodiment, however that
reflector802 is generally is conical., be understandable that
reflector802 can be paraboloidal, dihedral or has any other required shape and size.As shown in the figure,
reflector802 plays the effect of outer dike by the restriction sealant.
In order to make
reflector802 can guide and focus on the light that LED
core204 produces, the quality of
reflector802 and material preferably have high reflectance. and on this point,
reflector802 preferably has roughly level and smooth, inner surface polishing, mirror-like usually.
Be essentially white light (or other particular color) and produce in the application of this color will adopting with the light emitting diode combined of two or more colors, preferably the inner surface of
reflector802 plays the effect of scattering by the light of light-emitting diode assembly generation, thereby provide best colour mixture, even therefore the efficient of luminous plaque or focusing meeting reduce (because light scattering) a little.Therefore, in the application of using two or more color LEDs, the inner surface of this
reflector802 was preferably also handled in the proper ratio by suitable technology.For example, this
reflector802 can be skill facet, blasting treatment, chemical roughening or other is handled so that required scattered power to be provided.In addition, quality or skill facet can be arbitrarily, clocklike, at random or their combination.
Other optical element
According to another embodiment of the present invention, one or more optical elements are arranged on the surface of sealant, to provide required optical effect with respect to the light by the light-emitting diode assembly emission.These optical elements itself can be hard glass or plastics, because sealant layer is as the protection surface, so element does not cause the damage to light-emitting diode assembly.Suitable optical element comprises, for example, and various lens (concavees lens, convex lens, planar lens, " blister (bubble) " lens, Fresnel Lenses or the like) and various optical filter (polarizing filter, colored filter etc.).
Figure 10 A, 10B and 10C illustrate vertical view, profile and the isometric view of luminous plaque according to an embodiment of the invention, and wherein luminous plaque has " blister " lens.
More bubble lens102 comprises planar side and the blister side that is connected with
sealant606, and the blister side comprises a plurality of elevated regions 1004.In an illustrated embodiment,
bubble lens102 comprises the grid of 4 * 4 this blisters.The present invention has thought better of any number and the size of this lens characteristics.
Conclusion
In brief, the invention provides-kind novel, multi-chip light emitting diode luminous plaque on the plate efficiently, this luminous plaque can be used in during any conceivable illumination now known or future development uses.For example, such luminous plaque can be used for adopting bulb (the master screw bulb that can be installed on the standard household device, fluorescent lamp, Halogen lamp LED etc.) device on, on the Automobile Products (taillight, head lamp, flashlight or the like), in portable lighting device and the traffic control device (traffic signals etc.).In addition, claimed luminous plaque can be used for comprising the white light of any required colour temperature in the device of particular color color or color gamut.The application's content is not the scope that wherein can use application of the present invention in order to limit.
Other advantage and structural details of the present invention is apparent from accompanying drawing, and those skilled in the art can well understand.Yet according to specific exemplary embodiment the present invention has been described above., do not deviating under the scope of the present invention and can make many changes, combination and distortion exemplary embodiment.
Claims (21)
1, a kind of luminous plaque comprises:
High thermal conductivity substrate;
Several are mechanically connected to described suprabasil light-emitting diode assembly, and above-mentioned light-emitting diode assembly is connected electrically in the circuit with first and second terminals mutually, and described first and second terminals are used for receiving input voltage;
Be fixed in the described substrate and around the outer dike of above-mentioned light-emitting diode assembly at least a portion;
Be positioned on above-mentioned a plurality of light-emitting diode assembly and by the transparent polymeric sealant that described outer dike limited, and
Be positioned at the middle embankment of above-mentioned substrate.
2, luminous plaque according to claim 1, it is characterized in that: above-mentioned a plurality of light-emitting diode assemblies comprise first light emitting diode with first color and second light emitting diode with second color, above-mentioned tore of reflection has surface texture, the light that the surface texture dispersion is produced by above-mentioned first and second light emitting diodes is so that mix the light of above-mentioned first color and second color.
3, luminous plaque according to claim 1 is characterized in that: above-mentioned substrate is connected on the tore of reflection.
4, luminous plaque according to claim 3 is characterized in that: the part of above-mentioned tore of reflection is as above-mentioned outer dike.
5, a kind of luminous plaque comprises:
High thermal conductivity substrate;
Several are mechanically connected to described suprabasil light-emitting diode assembly, and above-mentioned light-emitting diode assembly is connected electrically in the circuit with first and second terminals mutually, and described first and second terminals are used for receiving input voltage;
Be fixed in the described substrate and around the outer dike of above-mentioned light-emitting diode assembly at least a portion;
Be positioned on above-mentioned a plurality of light-emitting diode assembly and by the transparent polymeric sealant that outer dike limited, wherein above-mentioned substrate is connected on the tore of reflection, and the part of above-mentioned tore of reflection is as above-mentioned outer dike,
Wherein, above-mentioned a plurality of light-emitting diode assembly comprises first light emitting diode with first color and second light emitting diode with second color, above-mentioned tore of reflection has surface texture, the light that the surface texture dispersion is produced by above-mentioned first and second light emitting diodes is so that mix the light of above-mentioned first color and second color.
6, a kind of led light comprises:
Have the substrate of the printed circuit board (PCB) of metallic cover;
Several are mechanically connected to described suprabasil light-emitting diode assembly, and above-mentioned light-emitting diode assembly is connected electrically in the circuit with first and second terminals mutually, and described first and second terminals are used for receiving input voltage;
Be fixed in the described substrate and around the tore of reflection of above-mentioned light-emitting diode assembly at least a portion;
Be positioned on above-mentioned a plurality of light-emitting diode assembly and be reflected and encircle the transparent polymeric sealant that is limited,
Above-mentioned a plurality of light-emitting diode assembly comprises first light emitting diode with first color and second light emitting diode with second color, above-mentioned tore of reflection has surface texture, the light that the surface texture dispersion is produced by above-mentioned first and second light emitting diodes is so that mix the light of above-mentioned first color and second color.
7, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned light-emitting diode assembly is electrically connected in series.
8, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned light-emitting diode assembly is in parallel to be electrically connected.
9, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned light-emitting diode assembly is divided into the light-emitting diode assembly group of different series connection, and these device groups are together in parallel.
10, according to each described luminous plaque in the claim 1,5, it is characterized in that: the substrate of high-termal conductivity comprises the printed circuit board (PCB) of metallic cover.
11, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned sealant comprises the silicones of optical-grade.
12, according to each described luminous plaque in the claim 1,5, it is characterized in that: above-mentioned sealant flows on the end face of above-mentioned outer dike, and above-mentioned outer dike is transparent.
13, according to claim 5 or 6 described luminous plaques, it is characterized in that: comprise that also is positioned at the middle embankment of above-mentioned substrate.
14, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: also comprise an optics on above-mentioned polymeric sealant.
15, luminous plaque according to claim 14 is characterized in that: above-mentioned optics comprises lens.
16, luminous plaque according to claim 15 is characterized in that: said lens is selected from concave lens, protruding lens or planar lens.
17, luminous plaque according to claim 14 is characterized in that: above-mentioned optics comprises optical filter.
18, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned a plurality of light-emitting diode assemblies comprise that the ratio that will select single particular color light emitting diode is so that obtain to have the white light of required certain relevant colour temperature (CCT).
19, luminous plaque according to claim 18 is characterized in that: above-mentioned CCT is between 2000K to 10000K.
20, according to each described luminous plaque in the claim 1,5 or 6, it is characterized in that: above-mentioned a plurality of light-emitting diode assemblies comprise the ratio that will select single particular color light emitting diode so that obtain specific color.
21, according to each described luminous plaque in the claim 3,5 or 6, it is characterized in that: above-mentioned tore of reflection comprises reflection electrodeposited coating and the structure of mixing light.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50785803P | 2003-10-01 | 2003-10-01 | |
| US60/507,858 | 2003-10-01 | ||
| US60/540,743 | 2004-01-30 | ||
| US10/924,389 | 2004-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1860327A CN1860327A (en) | 2006-11-08 |
| CN100470117C true CN100470117C (en) | 2009-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800285689A Expired - Fee Related CN100470117C (en) | 2003-10-01 | 2004-09-30 | Methods and apparatus for an LED light |
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| Country | Link |
|---|---|
| CN (1) | CN100470117C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101392891B (en) * | 2007-09-18 | 2012-08-15 | 华兴电子工业股份有限公司 | Array light emitting device with high color rendering |
| KR101283867B1 (en) * | 2010-05-14 | 2013-07-08 | 엘지이노텍 주식회사 | Light-emitting element array, Backlight apparatus, and Illumination apparatus |
| CN104303298B (en) * | 2012-04-06 | 2018-01-19 | 飞利浦照明控股有限公司 | White luminous module |
| JP2014157691A (en) * | 2013-02-14 | 2014-08-28 | Panasonic Corp | Light emitting device and light source for lighting |
| CN104344235A (en) * | 2013-07-26 | 2015-02-11 | 盈胜科技股份有限公司 | Manufacturing method of integrated multi-layer LED lamp tube with bridging unit |
| CN104990020A (en) * | 2015-08-04 | 2015-10-21 | 苏州晶品新材料股份有限公司 | Double-face light-extraction slice type LED automobile headlamp |
| WO2017038209A1 (en) * | 2015-08-31 | 2017-03-09 | シチズン電子株式会社 | Light emission device and method for manufacturing same |
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- 2004-09-30 CN CNB2004800285689A patent/CN100470117C/en not_active Expired - Fee Related
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