CN102287671A - Light emitting diode (LED) lamp strip for high-whiteness base plate - Google Patents

The invention provides a light emitting diode (LED) lamp strip for a high-whiteness base plate, which comprises a lamp head, a heat radiator, an LED light source module group, a power supply part and a lamp tube, wherein the LED light source module group comprises a base and an LED chip, the base comprises a base plate and a plurality of linearly ranged reflecting cups arranged on the base plate, the bottom of each reflecting cup is glued and fixed with at least one LED chip through insulating glue, fluorescent powder and a glue water layer are coated on the upper surface of the LED chip, and the whiteness of the luminous surface used for installing LEDs on the reflecting cups is greater than or equal to 70. After the whiteness of the base is improved, the light extraction efficiency of the LED chips is greatly improved, so the loss for converting light energy into heat energy is greatly reduced. Therefore, the heat radiation performance of the LED lamp strip can also be greatly improved, the LED lamp made by the LED lamp strip has the advantages of good safety performance, nonconductivity and cracking difficulty, and the service life can also be greatly prolonged.

Technical field

The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.

Background technology

LED is a kind of low voltage light sources, because its power saving, life-span are long, various lighting devices now have been widely used in, if traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp, its reflector efficiency is not high, particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way, at first its technology is complicated, production cost is higher, simultaneously, because after having increased one deck reflector layer, traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the wiring board is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people, greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.

Summary of the invention

The technical problem to be solved in the present invention is to provide a kind of and can either saves production cost, enhances productivity, and can keep the high whiteness substrate LED lamp bar of heat dispersion preferably again.

The technical solution used in the present invention is: a kind of high whiteness substrate LED lamp bar, comprise lamp holder, radiator, the led light source module, power unit and fluorescent tube, described lamp holder is installed in the two ends of fluorescent tube, power unit also is housed in the lamp holder, described led light source module is installed in the fluorescent tube after connecting radiator, and be wired to power unit, it is characterized in that: described led light source module, comprise base and led chip, described base comprises substrate and the some reflectors arranged in a straight line that have that are arranged on the substrate, the bottom of each reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, is used to install light-emitting area whiteness 〉=70 of LED on the described reflector.

Described base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to make, and reflector is bonded and fixed on the substrate.

The light-emitting area whiteness that is used to install LED on the described reflector is more preferred from 〉=and 85.

Be used on the described reflector to install that the light-emitting area whiteness of LED is best is 〉=88.

The sidewall locations of described adjacent reflector is equipped with opening, forms one group of reflector of strip, also is provided with the circuit board slot on this base, and wiring board is installed in the groove, and described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.

The below of described circuit board slot is provided with a through hole and extends base.

Described circuit board slot is positioned at the reflector at the two ends of base.

The bottom of described circuit board slot is lower than the bottom of reflector.

Described base is a strip, and reflector is circular.

Compared with prior art, the present invention has following advantage: owing to substrate and reflector adopt with pottery or glass through one-body molded fire the high whiteness LED base that forms after, can adopt prefabricated mode directly to produce base and can reduce traditional LED employing metab and the reflector layer production process of needs increase, both simplified production technology, can save production cost, help large batch of suitability for industrialized production.The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to 〉=70, can promote well and get optical efficiency, and the heat dispersion excellence; Its whiteness is 〉=88 best results if lifting is better for 〉=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of making, also improve greatly non-friable service life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, simplify production technology, can save production cost greatly.

Description of drawings

The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.

Fig. 1 is the overall structure schematic diagram of the high whiteness substrate of the present invention LED lamp bar.

Fig. 2 is the generalized section of Fig. 1.

Fig. 3 is the overall structure schematic diagram of the light source module of the high whiteness substrate of the present invention LED lamp bar.

Fig. 4 is the A-A generalized section of Fig. 3.

Fig. 5 is the structural representation of base of the light source module of the high whiteness substrate of the present invention LED lamp bar.

Fig. 6 is the B-B generalized section of Fig. 5.

The specific embodiment

The present invention will be described in detail below in conjunction with specific embodiment.

Described base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to make, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness 〉=70 of LED on the described reflector, be more preferred from 〉=85, the best is 〉=88.

Because traditional general whiteness of LED metab is all less than 70, therefore in actual production, need light-emitting area thereon to increase the reflector layer production process, but do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention adopts the pottery or the glass base of high whiteness, according to producing the prefabricated size that processes needs of needs, both met the requirement of whiteness 〉=70, can improve heat dispersion again, adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production, can adopt prefabricated mode directly to produce base simultaneously, production efficiency will improve greatly.