CN102298085A - Loading plate - Google Patents

The first voltage

signal test point

11

The second voltage

signal test point

12

The first ground

signalling test point

13

The second ground

signalling test point

14

With reference to figure 1, the better embodiment of this

load board

100 comprises that a printed circuit board (PCB) 10 and is located at first

golden finger

20 and second

golden finger

30 of these 10 liang of opposite ends of printed circuit board (PCB).This first

golden finger

20 can with a computer motherboard on be used to peg graft corresponding the pegging graft of a DIMM (Dual Inline MemoryModule, dual inline memory module) slot (not shown) of one first internal memory.This second

golden finger

30 can with this computer motherboard on be used to peg graft the corresponding grafting of the second dimm socket (not shown) of one second internal memory.This first

golden finger

20 comprises one

first voltage pin

21, one

second voltage pin

22 and one first grounding pin 23.This second

golden finger

30 comprises a

tertiary voltage pin

31, one the

4th voltage pin

32 and one second grounding pin 33.First,

second voltage pin

21,22 of this first

golden finger

20 and

first grounding pin

23 correspond respectively to first, second voltage signal pin and the first ground signalling pin in this first dimm socket.The the 3rd, the

4th voltage pin

31,32 of this second

golden finger

30 and

second grounding pin

33 correspond respectively to the 3rd, the 4th voltage signal pin and the second ground signalling pin in this second dimm socket.

Also be provided with the first voltage

signal test point

11, the second voltage

signal test point

12, a pair of first ground

signalling test point

13 and a pair of second ground

signalling test point

14 that should the second voltage

signal test point

12 that should the first voltage

signal test point

11 on this printed circuit board (PCB) 10.This first voltage

signal test point

11 is connected to

first voltage pin

21 of this first

golden finger

20 and the

tertiary voltage pin

31 of this second golden finger 30.This second voltage

signal test point

12 is connected to

second voltage pin

22 of this first

golden finger

20 and the

4th voltage pin

32 of this second golden finger 30.This first ground

signalling test point

13 is connected to

first grounding pin

23 of this first

golden finger

20 and

second grounding pin

33 of this second

golden finger

30 respectively.This second ground

signalling test point

14 is connected to

first grounding pin

23 of this first

golden finger

20 and

second grounding pin

33 of this second

golden finger

30 respectively.

When need are tested first internal memory and are plugged in this first dimm socket during available first and second voltage, first

golden finger

20 of this

load board

100 is inserted in these first dimm sockets, and this first, second voltage

signal test point

11,12 first and

second voltage pin

21,22 by this first

golden finger

20 respectively is connected to first and second voltage signal pin on this first dimm socket.This first, second ground

signalling test point

13,14

first grounding pin

23 by this first

golden finger

20 respectively is connected to the first ground signalling pin on this first dimm socket.And this first, second voltage

signal test point

11,12 and first, second ground

signalling test point

13,14 are connected to the corresponding test lead of a signal tester respectively, thereby can obtain first and second voltage on this

load board

100, so can determine first and second voltage of obtaining when deserving this first internal memory is plugged in this first dimm socket.

When need are tested second internal memory and are plugged in this second dimm socket during the available the 3rd and the 4th voltage, second

golden finger

30 of this

load board

100 is inserted in these second dimm sockets, and this first, second voltage

signal test point

11,12 the 3rd and the

4th voltage pin

31,32 by this second

golden finger

30 respectively is connected to the 3rd and the 4th voltage signal pin on this second dimm socket.This first, second ground

signalling test point

13,14

second grounding pin

33 by this second

golden finger

30 respectively is connected to the second ground signalling pin on this second dimm socket.And this first, second voltage

signal test point

11,12 and first, second ground

signalling test point

13,14 are connected to the corresponding test lead of a signal tester respectively, thereby can obtain the 3rd and the 4th voltage on this

load board

100, so can determine the 3rd and the 4th voltage that obtains when deserving this second internal memory is plugged in this second dimm socket.

In the present embodiment, these first golden finger, 20 corresponding DDR2 internal memories.These second golden finger, 30 corresponding DDR3 internal memories.In other true mode, this

load board

100 also can substitute other chip and test the voltage that obtains after other chip inserted is gone in the corresponding slot.

Load board

100 of the present invention comprises first and second

golden finger

20,30, thereby measure the voltage that obtains on the

load board

100 in corresponding first and second dimm socket of can pegging graft as required, thereby can utilize this

load board

100 to obtain voltage on DDR2 and the DDR3 internal memory, improved the compatibility of load board, and convenient and swift.

1. load board, comprise a printed circuit board (PCB), be arranged on peg graft second golden finger of one second slot of first golden finger and being used to of one first slot of pegging graft that is used at these printed circuit board (PCB) two ends, this first golden finger comprises first voltage pin of a pair of first voltage signal pin that should first slot, first grounding pin of second voltage pin of a pair of second voltage signal pin that should first slot and a pair of first ground signalling pin that should first slot, this second golden finger comprises the tertiary voltage pin of a pair of tertiary voltage signal pin that should second slot, second grounding pin of the 4th voltage pin of a pair of the 4th voltage signal pin that should second slot and a pair of second ground signalling pin that should second slot, also be provided with one first voltage signal test point on this load board, one second voltage signal test point, the a pair of first ground signalling test point and a pair of second ground signalling test point that should the second voltage signal test point that should the first voltage signal test point, this is first years old, the second voltage signal test point connects first of this first golden finger respectively, second voltage pin, this is first years old, the second ground signalling test point connects first grounding pin of this first golden finger, this is first years old, the second voltage signal test point also connects the 3rd of this second golden finger respectively, the 4th voltage pin, this is first years old, the second ground signalling test point is connected to second grounding pin of this second golden finger.

2. load board as claimed in claim 1 is characterized in that: the corresponding DDR2 internal memory of described first golden finger, the corresponding DDR3 internal memory of described second golden finger.

3. load board as claimed in claim 1 is characterized in that: described first and second golden finger is arranged on the relative two ends of described printed circuit board (PCB).