CN102736007A - High-frequency coupling signal adjusting method and testing device thereof - Google Patents

See also and be illustrated in figure 1 as first preferred embodiment provided by the present invention, be the proving installation 1 with high-frequency coupling mode transmitting high-frequency signal, this proving installation 1 can carry out testing electrical property to the IC chip with operating at high-frequency demand; The present invention is that the vertical probe that has the high density arrays distribution to give an example touches IC chip as contact element with point, is application category of the present invention like cantalever type probe or micro electronmechanical integrated technique (MEMS) probe etc. such as, thereby not subject to the limits.This proving installation 1 be distinguish have from around the

102, a

104 and the

106 that distribute in regular turn to the center; This

102 power supply property connections one signal produces the source; Some contact like electrical measurement board (not shown); To export, receive by a signal receiving end again, like the signal input solder joint of above-mentioned integrated circuit chip (not shown) to be measured with test signal this

104 of transmission from one channel to another of electrical measurement board and by these

106 set vertical probes; After chip calculation process to be measured; The test signal that operation result produced is then exported by the signal output solder joint (another signal produces the source) of chip to be measured; Be back to this proving installation 1 again; Earlier after this

106,

104 so that

102, the some contact (another signal receiving end) by the electrical measurement board receives to read and the analytical test result at last.This proving installation 1 has a

10, a

20, a plurality of

32 and

34, wherein:

This

10 has relative a

11 and a

12, and

10 central authorities are provided with a

13 correspondences and are positioned at this

106, is used to install this probe base 20.This

11 is provided with a plurality of

14 for the some contact that is electrically connected to above-mentioned electrical measurement board, and this

10 is laid with a plurality of

15 and coupled

16; Respectively this

15 can be like what present embodiment was given an example and is the public plate manufacturing specification of

10; Be to electrically connect this

14 and extend to 104 backs, translation field from this

102 to electrically connect this coupled

16, make circuit space conversion that this coupled

16 can any direction ad-hoc location this

14 conductings to probe

106 at this

11 with the mode of radially extending.This

13 is for being located at a cell body of these

10 central authorities, and its

131 upwards can supply those coupled

16 to extend into after fixing and

133;

133 is provided with an

135, and made for the material of tool good insulation characteristic, respectively the metal core of this coupled

16 can pass this

135 and be fixedly welded on a

137 of

135 bottoms.

This

20 is located at the bottom of this

135; Have a

22 and a

24; The material that this two

22,24 is a tool good insulation characteristic is made; Be with periphery mutually stacked and each above that, the lower face correspondence wears the through

26,28 of a plurality of adjacent fixed spacings, being used to make respectively, this

32 and

34 vertically wear this

20; These a plurality of

32,34 are erected on this two

22,24 and form and these

10 orthogonal aspects; And respectively but the body portion of this

32,34 with elasticity arching is positioned at this two

22, the accommodation space between 24, therefore can be in the inner spaces that have transverse elasticity to cushion of obtaining of

20 when receive normal stress.

Respectively an end of this

32 is to protrude the top of this

22 to be resisted against this

135, and the through

28 that the other end then protrudes this

24 touches measured electronic elements in order to point; Respectively be somebody's turn to do an end of

34; Promptly respectively be somebody's turn to do the backshank of

34; The top that is this

22 of protrusion electrically connects with

137 and this coupled

16 that is resisted against these

135 bottoms, and the other end is then fixed its lateral attitudes to be the aspect that firmly is erected in this

20 by the

28 of this bottom guide 24.This

34 and these

32 adjacent being set up in parallel; Be used for producing specific capacitor and mutual inductance with

32; Make high-frequency signal transmission lead to the high-frequency coupling signal of frequency through the specific band of this

32 and this

34 back formation with the effect of high-pass filtering (high pass filter) or bandpass filtering (band pass filter); 26,28 of through holes that change this

34 to another and this

32 adjacent different distance can be adjusted the transmission frequency and the characteristics of signals impedance of this high-frequency coupling signal; Not only can completely cut off direct current transmission between this

32 and the electrical measurement board reducing DC power consumption, and can reduce unnecessary band interference beyond the transmission frequency of high-frequency coupling signal; Therefore the horizontal spacing of 26,28 of each through holes only need be preconfigured to the fine setting amplitude corresponding with the specific transmission frequency, then can wear the

34 that is coupled according to high-frequency transmission specification through

26,28 around

32 of measured electronic elements; And respectively in fact this

34 has the function of high-frequency coupling; Be not used in and a little touch measured electronic elements; Do not contact with

32 yet; Can only need with small this

24 of tip portion protrusion like what present embodiment was given an example, or can directly push up to this

24 or be fixed on the inner mode of through

28, and not at application category that the present invention limited.

Therefore; After

14 receptions of test signal by this

10 of electrical measurement board; Transmit scriptures this

15 and coupled

16 so that this

34; Then form the high-frequency coupling signal by these

32 outputs with these

32 electrical couplings, the signal input solder joint by chip to be measured receives again; Such signal transmission path forms a high-

40 of this proving installation 1; Produce the source with the electrical measurement board as above-mentioned signal; This

15, coupled

16 and this

34 form a HF link 42 of this high-

40; This

32 forms a coupling circuit of this high-

40, and the signal input solder joint of chip to be measured is as above-mentioned signal receiving end.Otherwise; After chip calculation process to be measured, then produce the test result signal; Signal output solder joint by chip to be measured exports this

32 to; Form the high-frequency coupling signal again with after these

34 electrical couplings,, be back to the reception of electrical measurement board at last and read and the analytical test result through this coupled

16 and 15 transmission of this lead; The transmission path of such test signal forms another high-

44 of this proving installation 1; Signal output solder joint with chip to be measured produces the source as above-mentioned signal; This

32 forms a HF link of this high-

44; This

34, coupled

16 and this

15 form a coupling circuit 46 of this high-

44, and the electrical measurement board is as above-mentioned signal receiving end.

Comprehensive above-mentionedly know; Proving installation provided by the present invention is the high-frequency signal that receives the source that produces from signal with HF link; And with coupling circuit output high-frequency coupling signal to signal receiving end; Be mainly the electric capacity that intercouples and the counter structure of inductance characteristic are arranged between the HF link that provided and the coupling circuit; Like above-mentioned embodiment the parallel construction of

32 with

34 is provided; Therefore can be through the coupling capacitance and the mutual inductance of this coupling circuit of adjustment and this HF link, the transport property adjustment high-frequency coupling signal that can respond chip to be measured makes the high-frequency coupling signal be able to have the required specific transmission frequency of high-frequency circuit running of chip to be measured to keep the characteristic impedance of mutual coupling; Therefore effectively promoted the frequency range adjustment function of high-frequency signal transmission; More can avoid in highdensity test circuit structure, constituting single transmission path with different transmission mediums is transmitted to the high-frequency test signal between tester table and the chip to be measured; Thereby effectively reduced the signal reflex consume on the transmission path, and then high-frequency transmission quality and transmitting bandwidth have been promoted.

What deserves to be mentioned is; The coupling capacitance between

32 and the

34 and the method for adjustment of mutual inductance; Except changing

34 in through

26,28 positions that

20 is worn; One proving installation 2 that also can be provided like Fig. 2 and the present invention shown in Figure 3 second preferred embodiment; A

200 wherein and the above-mentioned first preferred embodiment difference person cooperate Fig. 2 A reference at the

202 that on

24, is laid with a plurality of ring-types, respectively these

202 rings establish this

32 respectively and corresponding be positioned at

32 around on the adjacent through-holes 28.Like this; Respectively this

34 of establishing of these

32 adjacent loops only needs one of them to electrically connect coupled

16; This

34 that all the other rings are established can make this

32 and contiguous set these a plurality of

34 have the coupling capacitance and the mutual inductance of single equivalence through this corresponding

202 electrically short circuit each other; Thereby 2 need of this proving installation on

200, fixed via 26,28 positions of

22,24 are with the mode of plug

34; The contiguous

34 that changes

32 is provided with quantity, can change the coupling capacitance and the mutual inductance of coupling circuit and HF link.Certainly; Make these a plurality of

34 that adjacent loops establishes each other the conductive coating structure of short circuit be not defined as the enforcement aspect that is positioned at the

24 under the

20 that provides like present embodiment yet; Such as be located on 34 any structures that wear or contact of these a plurality of coupling metal needles, comprise the

135 of

10 bottoms or the upper and

22,24 of

20; Perhaps be located on a plurality of structures that these 34 of a plurality of coupling metal needles wear or contact; Shown in Fig. 2 B, be provided with conductive layer 202,204 at upper and

22,24 simultaneously; All can make 32 set these

34 mutual short circuits of electric metal pin; More increase the quality of high-frequency coupling, have equally the present invention the effect that will produce, thereby not subject to the limits.

Trickleer adjustment for the transmission frequency that realizes the high-frequency coupling signal; This proving installation 2 is provided with an

17 at the

11 of

10; Cooperate Fig. 3 reference; Be to be electric capacity, inductance or both composition elements, and make

15 or the coupled

16 that this

34 electrically connected electrically connect these

17 that the numerical value that changes electric capacity or the inductance of this

17 then can further be adjusted the transmission frequency of this high-frequency coupling signal.

In addition; See also the proving installation 3 that the present invention's the 3rd preferred embodiment as shown in Figure 4 is provided; Compared to the mode of above-mentioned each embodiment with the quantity of the spacing of adjustment

32 and

34 or plug

34; The difference of this proving installation 3 is; Be to provide

20 that

32 and

34 are set like first preferred embodiment; Also provide a high

18 and

32 to electrically connect and be set up in parallel with coupled

16, the length through changing this high

18 or with the neighbor distance of this coupled

16 to reach the coupling capacitance and the mutual inductance of adjustment coupling circuit and HF link; Further; An adjustment part 19 that also provides similar the foregoing description and provided; Be electric capacity, inductance or both composition elements; Make this coupled

16 and high

18 simultaneously and this adjustment part 19 electrically connect, the numerical value that changes electric capacity or the inductance of this

17 then can further be adjusted the coupling capacitance and the mutual inductance of coupling circuit and HF link, more effectively adjusts the transmission frequency of this high-frequency coupling signal.

As for above-mentioned each embodiment of the present invention provide coupled

16 or high

18 are laid in the structure of

10, also are not limited to and are laid in

10 outsides and pass

13 to

10 belows and

20 or 200 again and connect the mode of establishing; See also the proving installation 4 that the present invention's the 4th preferred embodiment as shown in Figure 5 is provided; Be to have a circuit substrate 50 and the

20 that is provided like above-mentioned first preferred embodiment,

32 and

34; The circuit special plate of this circuit substrate 50 for having specific circuit architecture, the difference that is provided with above-mentioned first preferred embodiment is:

One upper surface 51 of this circuit substrate 50 is provided with a plurality of electrical contacts 52 for the some contact that is electrically connected to the electrical measurement board; A lower surface 53 of this circuit substrate 50 is provided with this

20, and the inside of this circuit substrate 50 is laid with a plurality of adjacent high frequency transmission lines arranged side by side 54 and coupled transmission line 56 electrically connects this

32 and

34 at this lower surface 53 respectively; This coupled transmission line 56 electrically connects this electrical contact 52 at this upper surface 51; Therefore through laying mode at these circuit substrate 50 inner integrated circuit; The high frequency transmission line 54 of laying and these coupled transmission line 56 specific distance arranged side by side can obtain the specific transmission frequency that this proving installation 4 transmits required high-frequency coupling signal.What is more; In order to make testing engineering be applied to the chip to be measured of multiple different circuit specification widely; The adjustment part 58 that the upper surface 51 of this circuit substrate 50 also is provided with similar the foregoing description and is provided; Be electric capacity, inductance or both composition elements; Make this coupled transmission line 56 and high frequency transmission line 54 simultaneously and this adjustment part 58 electrically connect, the numerical value that changes electric capacity or the inductance of this adjustment part 58 then can further be adjusted the coupling capacitance and the mutual inductance of coupling circuit and HF link, more effectively adjusts the transmission frequency of this high-frequency coupling signal; Certainly the adjustment part of being set up and arbitrary this coupled transmission line 56 or high frequency transmission line 54 or the effect that both electrically connect simultaneously; All in order to realize changing the characteristic impedance function of high-frequency signal transmission in high frequency transmission line 54; Therefore adjustment part is located at the set-up mode that circuit substrate 50 upper surfaces 51 electrically connect arbitrary this coupled transmission line 56 or high frequency transmission line 54; For example adjustment part is located at circuit substrate 50 upper surfaces 51; The two ends of adjustment part electrically connect this coupled transmission line 56 and earth terminal respectively, and perhaps the two ends with adjustment part electrically connect this high frequency transmission line 54 and earth terminal respectively, with the impedance of adjustment characteristics of signals; Have concurrently equally the present invention the effect that will bring into play, thereby not subject to the limits.

Certainly; As long as be close to constant spacing around the high frequency transmission line 54 and show a plurality of coupled transmission lines 56; The lower surface 53 of circuit substrate 50 also can be provided with the

200 that is provided like second preferred embodiment; Make

34 electrically connect coupled transmission lines 56, then change the coupling capacitance and the mutual inductance of coupling circuit and HF link for the mode of

34 plugs that can supply to be coupled.

In addition; The circuit function structure that the above-mentioned circuit substrate of processing with the special plate of circuit 50 is had; Also desirable on behalf of the space convertor that generally has the circuit space translation function with the public plate collocation of circuit; The present invention's the 5th preferred embodiment as shown in Figure 6 provides a proving installation 5; Be have a

60, a

70 and as above-mentioned second preferred

200,

32 and the

34 that are provided, the difference that is provided with above-mentioned the 4th preferred embodiment is:

The

61 of this

60 is provided with a plurality of

62 for the some contact that is electrically connected to the electrical measurement board, and extension cloth is provided with a plurality of first coupled

64 between the

61 of this

60 and the

63.

One

71 of this

70 electrically connects with this

60; One

73 of this

70 is provided with this

200 and

32 that wears this

200 and

34, second coupled

74 that the inside of this

70 is laid with a plurality of high

72 and lays with these high

72 contiguous constant spacings respectively; Respectively this high

72 electrically connects this

32, and respectively this second coupled

74 is used for electrically connecting respectively this

34.

Detailed description according to above-mentioned second preferred embodiment; Establish the respectively

204 or 202 of this

32 owing to be laid with ring on last or

22 or 24 of this

200; And respectively this

32 encircles this

202 or 204 electrically short circuits each other that this

34 of establishing can pass through correspondence, so make second coupled

74 of respectively these high

72 vicinity settings be similarly electrically short circuit each other; So respectively these high

72 second contiguous coupled

74 only need one of them to electrically connect first coupled

64 of this

60; Then this proving installation 5 not only has with above-mentioned second preferred embodiment and is similarly the mode with plug

34; The contiguous

34 that changes

32 is provided with coupling capacitance and the mutual inductance of quantity with adjustment coupling circuit and HF link; Also can be through lay the high

72 and second coupled

74 of particular electrical circuit transmission standard with the

70 of little technology; The

34 that makes corresponding plug is the high-frequency coupling signal adjustment function of high precision more; Can omit the setting of extra capacitor or inductance adjustment part thus, increase the remaining circuit space requirement on the

60.

What deserves to be mentioned is; Proving installation that present embodiment provides 5 makes the high-frequency coupling effect between

32 and

34, extend to generation in the

70; Certainly, if further extend to

60, make to have the convenience that is provided with above-mentioned the 4th preferred embodiment and above

60, set up any adjustment part; With transmission frequency and the transport property impedance that further changes high-frequency signal; Also can

60 cloth be made as the architectural characteristic same with the 4th circuit substrate that preferred embodiment provides 50, all can realize the present invention the effect that will bring into play, thereby not subject to the limits.

In addition; Because the present invention is mainly in coupling capacitance and mutual inductance that adjustment coupling circuit and HF link are provided; Therefore on the circuit structure of circuit substrate; Like the use coupled transmission line of the 3rd and the 4th embodiment high

18 arranged side by side or 54, cooperate Fig. 4 to Fig. 6 reference, all between coupled transmission line and high frequency transmission line, produce the electrical couplings effect; So even the

20 that the foregoing description is provided only is provided for a little touching the

32 of chip to be measured; Still can obtain the high-frequency coupling signal through the laying arranged side by side of coupled transmission line and high frequency transmission line; The proving installation 6 that the present invention's the 6th preferred embodiment as shown in Figure 7 is provided; The proving installation that is provided compared to above-mentioned the 3rd preferred embodiment; Difference is to omit the setting of coupling metal needle, the coupling capacitance and the mutual inductance of therefore only reaching adjustment coupling circuit and HF link with the numerical value of the electric capacity that changes adjustment part 19 or inductance, have equally the present invention the effect that will provide.

1. high-frequency coupling signal adjusting method, this method includes following steps:

Prepare an electric metal pin and a coupled transmission line, process a HF link with one in this electric metal pin or this coupled transmission line, another processes a coupling circuit;

Make this HF link electrically connect a signal and produce the source, make this coupling circuit electrically connect a signal receiving end; And

Receive above-mentioned high-frequency coupling signal at this signal receiving end, coupling capacitance and the mutual inductance of adjusting this coupling circuit and this HF link are to adjust the transmission frequency of high-frequency coupling signal.

2. high-frequency coupling signal adjusting method according to claim 1; Also prepare a coupling metal needle; Electrically connect with this coupled transmission line and be set up in parallel with this electric metal pin, the neighbor distance that changes this coupling metal needle and this electric metal pin is to adjust the transmission frequency of this high-frequency coupling signal.

3. high-frequency coupling signal adjusting method according to claim 2; Also prepare a circuit substrate; Be used to lay this coupled transmission line; This coupled transmission line electrically connects this signal receiving end at a upper surface of this circuit substrate, and electrically connects the metal needle that should be coupled at a lower surface of this circuit substrate, makes this coupled transmission line and this coupling metal needle process this coupling circuit.

4. high-frequency coupling signal adjusting method according to claim 2; Also prepare a circuit substrate; Be used to lay this coupled transmission line; This coupled transmission line electrically connects this signal generation source at a upper surface of this circuit substrate, and electrically connects the metal needle that should be coupled at a lower surface of this circuit substrate, makes this coupled transmission line and this coupling metal needle process this HF link.

5. according to each described high-frequency coupling signal adjusting method in the claim 1,2,3 or 4; Also prepare a plurality of coupling metal needles and make electrically short circuit each other; And be set up in parallel with this electric metal pin respectively; Wherein one be somebody's turn to do coupling metal needle and the electric connection of this coupled transmission line, the quantity that changes these a plurality of coupling metal needles is to adjust the transmission frequency of this high-frequency coupling signal.

6. high-frequency coupling signal adjusting method according to claim 5; Also prepare a probe base; Be that the through hole that is equipped with a plurality of adjacent fixed spacings is used to supply this electric metal pin and coupling metal needle to wear, these a plurality of coupling metal needles be located in contiguous this electric metal pin around through hole.

7. high-frequency coupling signal adjusting method according to claim 1; Also prepare a high frequency transmission line; Electrically connect and should be set up in parallel with this electric metal pin with coupled transmission line, change this high frequency transmission line length or with the neighbor distance of this coupled transmission line to adjust the transmission frequency of this high-frequency coupling signal.

8. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate; Be laid with this high frequency transmission line and coupled transmission line; This coupled transmission line electrically connects this signal receiving end at a upper surface of this circuit substrate, and this high frequency transmission line electrically connects this electric metal pin at a lower surface of this circuit substrate, makes this high frequency transmission line and electric metal pin process this HF link.

9. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate; Be laid with this high frequency transmission line and coupled transmission line; This coupled transmission line electrically connects this signal generation source at a upper surface of this circuit substrate, and this high frequency transmission line electrically connects this electric metal pin at a lower surface of this circuit substrate, makes this high frequency transmission line and electric metal pin process this coupling circuit.

10. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate and a space convertor; This space convertor is stacked in a lower surface of this circuit substrate; This coupled transmission line is laid in this circuit substrate and space convertor, and electrically connects this signal receiving end at a upper surface of this circuit substrate, and this high frequency transmission line is laid in this space convertor; And electrically connect this electric metal pin at a lower surface of this space convertor, make this high frequency transmission line and electric metal pin process this HF link.

11. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate and a space convertor; This space convertor is stacked in a lower surface of this circuit substrate; This coupled transmission line is laid in this circuit substrate and space convertor, and electrically connects this signal generation source at a upper surface of this circuit substrate, and this high frequency transmission line is laid in this space convertor; And electrically connect this electric metal pin at a lower surface of this space convertor, make this high frequency transmission line and this electric metal pin process this coupling circuit.

12. the proving installation of a high-frequency coupling signal is used to connect the electrical measurement board so that IC chip is carried out testing electrical property, this proving installation has:

One circuit substrate is laid with a coupled transmission line and is used to receive the test signal that above-mentioned electrical measurement board is exported;

One probe base, it is equipped with the through hole of a plurality of adjacent fixed spacings, and

An one electric metal pin and a coupling metal needle; It wears respectively this through hole respectively; This electric metal pin is used for a little touching the said integrated circuit chip, and the coupling metal needle is adjacent is set up in parallel with this, and this coupling metal needle electrically connects this coupled transmission line; After filtering, this electric metal pin output high-frequency coupling signal is to carry out testing electrical property to the said integrated circuit chip certainly between this coupling metal needle and electric metal pin for above-mentioned test signal.

13. proving installation according to claim 12; One upper surface of this circuit substrate has an electrical contact; Be used to electrically connect above-mentioned electrical measurement board; The inside of this circuit substrate is laid with a lead inwardly radially extends from the periphery of this circuit substrate, and the two ends of this lead electrically connect this electrical contact and this coupled transmission line respectively.

14. proving installation according to claim 13 also has a high frequency transmission line, this high frequency transmission line and this electric metal pin electrically connect and are set up in parallel with this coupled transmission line.

15. proving installation according to claim 13; The central authorities of this circuit substrate are equipped with a holder; This probe base is located at the bottom of this holder; One end of this coupled transmission line is located at the upper surface of this circuit substrate, and the other end wears this holder and connects in the bottom of this holder establishes this coupling metal needle.

16. proving installation according to claim 12; The inside of this probe base is provided with a conductive layer; Be located on the contiguous on every side through hole of this electric metal pin; This probe base is provided with a plurality of coupling metal needles and passes this conductive layer and electrically connect with this conductive layer, and wherein this coupling metal needle and this coupled transmission line join.

17. the proving installation of a high-frequency coupling signal is used to connect the electrical measurement board so that IC chip is carried out testing electrical property, this proving installation includes:

One circuit substrate has relative a upper surface and a lower surface, and this upper surface is provided with an electrical contact, is used to electrically connect above-mentioned electrical measurement board;

One high frequency transmission line and a coupled transmission line; This coupled transmission line and this high frequency transmission line are set up in parallel; The electrical contact that this coupled transmission line electrically connects this circuit substrate is used to receive the test signal that above-mentioned electrical measurement board is exported; After filtering, this high frequency transmission line is exported high-frequency coupling signal to above-mentioned test signal certainly between this coupled transmission line and high frequency transmission line; And,

One electric metal pin electrically connects this high frequency transmission line and is used for a little touching the said integrated circuit chip, to export above-mentioned high-frequency coupling signal to this IC chip.

18. proving installation according to claim 17; The inside of this circuit substrate is laid with a lead and inwardly radially extends from the periphery of this circuit substrate; The two ends of this lead electrically connect this electrical contact and this coupled transmission line respectively; The central authorities of this circuit substrate are equipped with a holder, and the bottom of this holder is provided with a probe base, and this probe base is to wear this electric metal pin; One end of this coupled transmission line is located at the upper surface of this circuit substrate, and the other end wears the bottom of this holder to this holder.

19. proving installation according to claim 17; Have a probe base, this probe base is equipped with this an electric metal pin and a coupling metal needle, and this coupling metal needle is adjacent with this electric metal pin arranged side by side and electrically connect this coupled transmission line; The inside of this probe base is provided with a conductive layer; Be located at this electric metal pin around, this probe base is provided with a plurality of coupling metal needles and passes this conductive layer and electrically connect with this conductive layer, wherein this coupling metal needle and this coupled transmission line join.

20. proving installation according to claim 17; Have a probe base and a space convertor; This probe base is equipped with this an electric metal pin and a coupling metal needle, and this coupling metal needle is adjacent with this electric metal pin arranged side by side and electrically connect this coupled transmission line, and this space convertor is located at the lower surface of this circuit substrate; This probe base is located at the bottom of this space convertor; This coupled transmission line is to distinguish one first and one second coupled transmission line is arranged, and extension cloth is located at the inside of this circuit substrate and space convertor respectively, and this high frequency transmission line and this second coupled transmission line are set up in parallel.