CN103630453B - One can control high-precision grinding study mechanism experimental provision - Google Patents

本发明涉及一种可控制高精度磨削机理研究实验装置，该实验装置包括以下特征：基体上的结构互差120°分布；上T形滑块和下T形滑块相对设置于基体的滑槽中；金刚石工具与下T形滑块精密间隙配合；圆口夹具放置于基体上，毗邻上T形滑块；轴向螺旋测微仪（分辨率为1μm）放置于上T形滑块上，与圆口夹具相互配合；三个径向螺旋测微仪（分辨率为10μm）互差120°分布在基体上；基于该装置可控制、高精度等特性，提出了单颗磨粒、双颗磨粒及多颗磨粒多角度全方位研究磨削机理的新思路，尤其是研究相邻磨粒与磨粒之间不同的轴向间距与径向间距对表面形成机理和材料去除机理的影响规律。本发明结构简单，操作方便，研究方法新颖独特，实用性较强，测试精度高。

The invention relates to a controllable high-precision grinding mechanism research experimental device, which includes the following features: the structure on the substrate is distributed with a mutual difference of 120°; the upper T-shaped slider and the lower T-shaped slider are relatively arranged on the slider of the substrate In the groove; the diamond tool and the lower T-shaped slider have a precise clearance fit; the round jig is placed on the base, adjacent to the upper T-shaped slider; the axial screw micrometer (with a resolution of 1 μm) is placed on the upper T-shaped slider , cooperate with the round fixture; three radial spiral micrometers (with a resolution of 10 μm) are distributed on the substrate with a mutual difference of 120°; It is a new idea to study the grinding mechanism from multiple angles and comprehensive angles of granular abrasive grains and multi-grain abrasive grains, especially to study the effect of different axial and radial spacings between adjacent abrasive grains on the surface formation mechanism and material removal mechanism. Influence the law. The invention has the advantages of simple structure, convenient operation, novel and unique research method, strong practicability and high testing precision.

一种可控制高精度磨削机理研究实验装置A controllable high-precision grinding mechanism research experimental device

技术领域technical field

本发明涉及一种材料测试技术和机械工程精密加工领域的可控制高精度磨削机理研究实验装置和研究方法，尤其涉及的是磨削加工中砂轮线速度大于30m/s时相邻磨粒与磨粒之间的干涉作用对难加工材料精密/超精密表面形成机理和材料去除机理研究的实验装置和方法。The invention relates to a controllable high-precision grinding mechanism research experimental device and research method in the field of material testing technology and mechanical engineering precision machining, especially relates to the contact between adjacent abrasive grains when the grinding wheel linear velocity is greater than 30m/s in grinding processing. Experimental devices and methods for the study of the formation mechanism and material removal mechanism of the precision/ultra-precision surface of difficult-to-machine materials by the interference between abrasive particles.

背景技术Background technique

随着科学技术和工业生产的发展，对机械产品及其零部件使用性能的要求越来越高，如要求材料的比强度高、耐高温、耐腐蚀、低应变及表面/亚表面低损伤甚至无损伤等。为此，出现了许多新型难加工材料，如新型结构陶瓷、功能陶瓷、现代光学材料、光学晶体及单晶硅片等。由于这些难加工材料具有一系列优良的机械物理性能，所以它在激光技术、光通讯、光电子、航空航天航海及国防工业领域中均得到了广泛应用。然而，这些难加工材料在磨削加工时往往易产生磨削力大、磨削温度高、砂轮易磨损、磨削比较低、表面完整性差等缺陷。如果精密加工的零件在磨削加工后存在表面划伤、表面粗糙等有害的加工痕迹和较大的表面/亚表面损伤、大的残余拉应力或压应力、表面硬化及污染层、晶格畸变层等缺陷，势必会造成高性能要求的精密零件疲劳寿命降低乃至灾难性的后果。其中，是否深入理解难加工材料的磨削机理及是否合理选择了磨削工艺参数都将会对磨削加工后零件的表面完整性产生至关重要的影响，表面形成机理和材料去除机理是由材料特性、磨料几何形状、磨料切入运动及作用在工件和磨粒上的机械及热载荷等因素交互作用决定的，而磨削工艺参数是由砂轮线速度、工作台进给速度及磨削深度等因素综合作用的结果。此外，砂轮是磨削加工过程中的关键执行元件，砂轮的表面状况对已加工表面质量具有重大影响，材料的高效去除、磨削表面的高质量成形以及冷却液的有效供给都要求砂轮表面上的磨粒必须具有合理的切削刃间距、表面等高性及足够的容屑空间，否则，易造成工件加工效率低，加工质量难以保证，表面/亚表面损伤大等不足。With the development of science and technology and industrial production, the requirements for the performance of mechanical products and their parts are getting higher and higher, such as high specific strength of materials, high temperature resistance, corrosion resistance, low strain and low surface/subsurface damage or even No damage etc. For this reason, many new difficult-to-process materials have emerged, such as new structural ceramics, functional ceramics, modern optical materials, optical crystals, and single crystal silicon wafers. Because these difficult-to-process materials have a series of excellent mechanical and physical properties, they have been widely used in the fields of laser technology, optical communications, optoelectronics, aerospace, navigation and defense industries. However, these difficult-to-machine materials are often prone to defects such as large grinding force, high grinding temperature, easy wear of the grinding wheel, low grinding ratio, and poor surface integrity during grinding. If the precision machined parts have surface scratches, surface roughness and other harmful processing marks after grinding, large surface/subsurface damage, large residual tensile or compressive stress, surface hardening and contamination layer, lattice distortion Layer and other defects will inevitably lead to reduced fatigue life and even catastrophic consequences of precision parts requiring high performance. Among them, whether to deeply understand the grinding mechanism of difficult-to-machine materials and whether to choose the grinding process parameters reasonably will have a crucial impact on the surface integrity of the ground parts. The surface formation mechanism and material removal mechanism are determined by Material properties, abrasive geometry, abrasive cutting motion, and mechanical and thermal loads acting on the workpiece and abrasive particles are determined by the interaction of factors, while the grinding process parameters are determined by the grinding wheel linear speed, table feed speed and grinding depth result of a combination of factors. In addition, the grinding wheel is a key actuator in the grinding process. The surface condition of the grinding wheel has a significant impact on the quality of the machined surface. The abrasive grains must have a reasonable cutting edge spacing, surface contour and sufficient chip space, otherwise, it is easy to cause low processing efficiency of the workpiece, difficulty in processing quality, and large surface/subsurface damage.

磨削机理一直以来都是精密/超精密加工研究中的难点。作为砂轮磨削过程的一种简化模型，单颗磨粒磨削是探讨复杂磨削机理的有效方法。然而，一方面，与砂轮的磨削试验相比，单颗磨粒磨削试验要求试验装置必须具有很高的精度，同时满足高转速条件下的强度要求；另一方面，磨削过程是由大量磨粒同时与被加工材料相互作用并完成材料的去除，在此过程中，由于参与磨削的磨粒数量多、磨粒切削刃形状及位置的随机性大、磨削速度高等多种因素相互影响，仅仅依靠单颗磨粒磨削来研究表面形成机理和材料去除机理是不够的。由于砂轮表面磨粒的分布是杂乱无章的，在磨削过程中磨粒与磨粒之间存在干涉作用，这在一定程度上势必会对表面成形和材料去除造成影响，为了多角度全方位地研究磨削机理，双颗磨粒和多颗磨粒磨削将成为系统研究表面形成机理和材料去除机理必不可少的研究方法。因此，为了提高难加工材料的加工效率、获得较高的磨削加工性及高质量的工件表面完整性，通过金刚石单颗磨粒、双颗磨粒及多颗磨粒磨削试验研究，深入分析磨削参数及磨粒与磨粒之间的干涉作用对表面形成机理和材料去除机理的影响规律是研究难加工材料磨削机理、工艺优化和指导砂轮设计与制造阶段及磨削过程中砂轮修整等的重要途径。The grinding mechanism has always been a difficult point in the research of precision/ultra-precision machining. As a simplified model of grinding wheel grinding process, single grain grinding is an effective method to investigate complex grinding mechanism. However, on the one hand, compared with the grinding test of the grinding wheel, the single abrasive grain grinding test requires that the test device must have high precision, and at the same time meet the strength requirements under high speed conditions; on the other hand, the grinding process is composed of A large number of abrasive grains interact with the processed material at the same time and complete the material removal. In this process, due to many factors such as the large number of abrasive grains participating in the grinding, the randomness of the shape and position of the abrasive grain cutting edge, and the high grinding speed, etc. It is not enough to rely on single grain grinding to study the surface formation mechanism and material removal mechanism. Since the distribution of abrasive grains on the surface of the grinding wheel is chaotic, there is interference between abrasive grains during the grinding process, which will inevitably affect the surface forming and material removal to a certain extent. Grinding mechanism, dual-grain and multi-grain grinding will become an indispensable research method for systematically studying the mechanism of surface formation and material removal. Therefore, in order to improve the processing efficiency of difficult-to-machine materials, obtain high grinding processability and high-quality workpiece surface integrity, through the experimental research of diamond single abrasive grain, double abrasive grain and multi-grain abrasive grain, in-depth Analyzing the influence of grinding parameters and the interference between abrasive grains on the surface formation mechanism and material removal mechanism is the basis for studying the grinding mechanism of difficult-to-machine materials, process optimization, and guiding the design and manufacturing stages of grinding wheels and grinding wheels during the grinding process. An important way to trim and so on.

目前，进行表面形成机理和材料去除机理研究的成熟设备主要集中于划擦试验装置：如美国MTS公司的生产的NanoIndenter XP划痕仪、美国Hysitron公司生产的TriboIndenter划痕仪、美国NANOVEA公司生产的SMT划痕仪、英国MML公司生产的NanoTestTM Vantage纳米力学测试系统、印度Ducom公司生产的ModelTR-102-M3划痕仪和瑞士CSM公司生产的Nano Scratch Tester(NST)划痕仪等。这些应用于材料测试领域的专用划擦试验装置具有较高的试验精度和良好的稳定性及实时监测功能，然而，这些划擦试验装置的划擦速度较低，且最大的划擦速度为60mm/min，远远低于磨削加工时的砂轮线速度(通常大于15m/s)，与高速/超高速磨削情况下的砂轮线速度更是无法比拟。因此，在研究工程应用性较强的磨削加工材料磨削机理时，此类划擦试验装置无法准确模拟砂轮磨削加工时工件表面的物理变化过程。At present, the mature equipment for the study of surface formation mechanism and material removal mechanism mainly focuses on scratch test devices: such as the NanoIndenter XP scratch instrument produced by MTS Company of the United States, the TriboIndenter scratch instrument produced by Hysitron Company of the United States, and the scratch tester produced by NANOVEA Company of the United States. SMT scratch tester, NanoTestTM Vantage nanomechanical testing system produced by British MML company, ModelTR-102-M3 scratch tester produced by Indian Ducom company, and Nano Scratch Tester (NST) scratch tester produced by Swiss CSM company, etc. These special scratch test devices used in the field of material testing have high test accuracy, good stability and real-time monitoring functions. However, the scratch speed of these scratch test devices is low, and the maximum scratch speed is 60mm /min, which is far lower than the grinding wheel linear velocity during grinding (usually greater than 15m/s), and it is even more incomparable with the grinding wheel linear velocity in the case of high-speed/ultra-high-speed grinding. Therefore, when studying the grinding mechanism of grinding materials with strong engineering application, this kind of scratch test device cannot accurately simulate the physical change process of the workpiece surface during grinding wheel grinding.

此外，虽然国内外学者在实验研究过程中自行设计了一些简单的单颗磨粒磨削装置，而且这些单颗粒磨削装置可以达到磨削时砂轮的线速度，甚至可以模拟高速/超高速磨削，例如：经对现有专利与文献的检索发现，专利申请号：US7302831B2，Moyse Allan H公开了一种Scratch testing device；专利申请号：201010300985.1，姚振强等人公开了一种光学玻璃测试装置；文献检索号：J.Am.Ceram.Soc.88(2005)918-925，G.Subhash等人公开了一种A new scratch resistance measure for structuralceramics；文献检索号：J.Am.Ceram.Soc.88(2005)918-925，G.Subhash等人公开了一种Sensitivity of scratch resistance to grinding-induced damage anisotropy in siliconnitride；日本熊本大学T.Matsuo等设计了单颗磨粒微观切削与划擦试验装置，采用粒度为14/20#的CBN和金刚石磨粒对钢和氧化铝进行了微观切削和划擦试验；Y.Ohbuchi采用负前角为-45°、-60°、-75°的CBN和金刚石磨粒分别对S50C钢进行了正交切削试验；法国学者Matthieu等用车刀代替单颗磨粒进行划擦试验，研究磨削过程中材料的塑性变形和去除机理；东京工业大学Zhang Bi等研究了金刚石的顶锥角分别为85°、108°、128°和65°时单颗金刚石磨粒划擦的方法对氧化铝的表面破碎的影响；德国不莱梅大学E.Brinksmeier研究了低速条件下单颗磨粒划擦时磨削速度和磨屑厚度对淬火钢磨屑的形成机理的影响；西北工业大学黄奇、任敬心等最早开展了单颗磨粒磨削的试验研究；华侨大学林思煌、徐西鹏开展了单颗金刚石磨粒划擦普通玻璃的表面形貌和磨削力研究……这些公开的发明专利和经典的单颗磨粒划擦试验为我们研究单颗磨粒的切削行为提供了富有意义的指导。In addition, although scholars at home and abroad have designed some simple single-grain grinding devices in the course of experimental research, and these single-grain grinding devices can reach the linear speed of the grinding wheel during grinding, and can even simulate high-speed/ultra-high-speed grinding Cutting, for example: found through searching existing patent and literature, patent application number: US7302831B2, Moyse Allan H discloses a kind of Scratch testing device; Patent application number: 201010300985.1, Yao Zhenqiang et al. Literature retrieval number: J.Am.Ceram.Soc.88 (2005) 918-925, G.Subhash et al. disclosed a new scratch resistance measure for structural ceramics; Literature retrieval number: J.Am.Ceram.Soc.88 (2005) 918-925, people such as G.Subhash disclose a kind of Sensitivity of scratch resistance to grinding-induced damage anisotropy in siliconnitride; Japan Kumamoto University T.Matsuo etc. have designed single abrasive particle microscopic cutting and scratch test device, CBN and diamond abrasive grains with a particle size of 14/20# were used for micro-cutting and scratching tests on steel and alumina; Y. Ohbuchi used CBN and diamond with negative rake angles of -45°, -60°, -75° Abrasive particles carried out orthogonal cutting tests on S50C steel; French scholar Matthieu et al. used turning tools instead of single abrasive grains to conduct scratch tests to study the plastic deformation and removal mechanism of materials in the grinding process; Tokyo Institute of Technology Zhang Bi et al. The influence of single diamond abrasive grain scratching method on the surface fracture of alumina when the diamond cone angles are 85°, 108°, 128° and 65° respectively; E.Brinksmeier of the University of Bremen in Germany studied the low speed The influence of grinding speed and abrasive debris thickness on the formation mechanism of hardened steel abrasive debris when a single abrasive grain is scratched; Huang Qi and Ren Jingxin of Northwestern Polytechnical University were the first to carry out experimental research on single abrasive grain grinding; Lin Sihuang of Huaqiao University , Xu Xipeng carried out the research on the surface morphology and grinding force of ordinary glass scratched by single diamond abrasive grains...These published invention patents and classic single abrasive grain scratch tests provide us with a basis for studying the cutting behavior of single abrasive grains. meaningful guidance.

然而，无论从试验装置还是从研究方法来看都存在一定的局限性：从试验装置来说，一种是金刚石磨粒通过粘接或钎焊的方法与基体固结，另一种是单颗磨粒固定不动，工件装在砂轮盘上并随砂轮一起作回转运动，这两种试验装置中的金刚石磨粒都处于固结状态，不能根据试验所需进行可控的调节，更为重要的是，不能同时安装多颗磨粒；从研究方法来说，通常的单颗粒磨粒划擦试验是基于单颗磨粒切厚等于磨削深度，但是在实际的磨削过程中单颗磨粒切厚远小于实际磨削深度，更为重要的是，这些研究仅仅考虑到了单颗磨粒对表面形成机理和材料去除机理的影响，并不能从根本上解释实际磨削过程中砂轮上双颗磨粒或多颗磨粒之间的干涉作用对表面形成机理和材料去除机理的影响，从理论上分析，双颗磨粒或多颗磨粒之间的干涉作用将会对单颗磨粒最大未变形切削厚度h_m产生影响，而单颗磨粒最大未变形切削厚度h_m对磨削过程中的磨削力、磨削温度有直接的影响关系，容易造成砂轮磨损、磨削加工质量不佳等问题。对于双颗磨粒磨削试验研究，即使有这方面的相关报道，如上海交通大学的顾伟彬博士对光学玻璃BK7进行了划擦试验研究，结果表明：磨粒之间存在一个最佳间距使得材料去除体积达到最大值；但是，该研究中的两次划擦是基于不可忽略的时间间隔情况下产生的，而硬脆材料在加工时裂纹的形成源于局部应力集中，一旦裂纹成核和扩展完成后，局部的应力集中将会减弱，所以划擦过程的开始和裂纹的形成必须基于有限时间间隔内，否则将有别于砂轮磨削时材料的去除机理，因此，该方法将不利于说明砂轮上磨粒与磨粒之间的径向间距对磨削机理的影响。However, there are certain limitations both in terms of the test device and the research method: from the test device, one is that the diamond abrasive grains are consolidated with the matrix by bonding or brazing, and the other is that a single The abrasive grains are fixed, and the workpiece is mounted on the grinding wheel disc and rotates together with the grinding wheel. The diamond abrasive grains in these two test devices are in a consolidated state, which cannot be controlled and adjusted according to the test requirements, which is more important. The most important thing is that multiple abrasive grains cannot be installed at the same time; from the research method, the usual single abrasive grain scratch test is based on the single abrasive grain cutting thickness equal to the grinding depth, but in the actual grinding process, the single abrasive grain The grain cut thickness is far smaller than the actual grinding depth. More importantly, these studies only considered the influence of a single abrasive grain on the surface formation mechanism and material removal mechanism, and cannot fundamentally explain the double grain on the grinding wheel in the actual grinding process. The influence of the interference between abrasive grains or multiple abrasive grains on the surface formation mechanism and material removal mechanism, from theoretical analysis, the interference between double abrasive grains or multiple abrasive grains will affect the single abrasive grain The maximum undeformed cutting thickness h _m has an influence, and the maximum undeformed cutting thickness h _m of a single abrasive grain has a direct impact on the grinding force and grinding temperature during the grinding process, which is likely to cause grinding wheel wear and grinding quality Poor and other issues. Even if there are related reports on double-grain grinding experiments, for example, Dr. Gu Weibin of Shanghai Jiaotong University conducted a scratch test on optical glass BK7. The results show that there is an optimal distance between the abrasive particles so that the material The removal volume reached the maximum; however, the two scratches in this study were generated based on a non-negligible time interval, and the formation of cracks in hard and brittle materials originated from local stress concentration during processing, once the crack nucleation and propagation After completion, the local stress concentration will be weakened, so the initiation of the scratching process and the formation of cracks must be based on a finite time interval, otherwise it will be different from the material removal mechanism when grinding with a grinding wheel, so this method will not be conducive to explaining The effect of the radial spacing between abrasive grains on the grinding wheel on the grinding mechanism.

此外，意大利学者Alberto Carpinteri和Stefano Invernizzi从数值仿真的角度研究了两个压头之间的径向间距对脆性材料材料去取机理的影响规律，结果表明：当两个压头之间的间距为3～4倍压头尺寸时，在获得高的材料去除率及低的比磨削能的同时还将大大降低表面/亚表面的损伤，从而为最优化超硬磨料工具提供有效的指导；但是，该研究仅仅基于数值仿真而未进行有效的实验验证，更没有一套可以真实模拟砂轮上磨粒与磨粒之间干涉作用的实验装置。In addition, Italian scholars Alberto Carpinteri and Stefano Invernizzi studied the influence of the radial distance between two indenters on the removal mechanism of brittle materials from the perspective of numerical simulation. The results show that: when the distance between two indenters is When the size of the indenter is 3 to 4 times, the damage of the surface/subsurface will be greatly reduced while obtaining high material removal rate and low specific grinding energy, so as to provide effective guidance for optimizing superabrasive tools; but , this research is only based on numerical simulation without effective experimental verification, and there is no set of experimental devices that can truly simulate the interference between abrasive grains on the grinding wheel.

针对以上现状，急需研制出一种构造简单、价格低廉、操作方便、控制精密、真实模拟高速磨削的多功能高精度难加工材料磨削机理研究装置，尤其是双颗磨粒或多颗磨粒磨削时磨粒与磨粒之间的干涉作用对表面形成机理和材料去除机理的影响。In view of the above status quo, there is an urgent need to develop a multi-functional high-precision grinding mechanism research device for difficult-to-machine materials with simple structure, low price, convenient operation, precise control, and real simulation of high-speed grinding, especially for double-grain or multi-grain grinding. The influence of the interference between abrasive grains and abrasive grains on the surface formation mechanism and material removal mechanism during grain grinding.

发明内容Contents of the invention

针对上述技术问题，本发明通过提出一种可控制高精度磨削机理研究实验装置及研究方法，克服现有技术的弊端，实现砂轮磨削线速度大于30m/s的难加工材料单颗磨粒磨削机理研究；同时该装置解决了因磨粒过小(50μm～200μm)而不能靠近安装的难题，便于重点考察双颗磨粒和多颗磨粒在磨削过程中相邻磨粒与磨粒之间不同的轴向间距与径向间距的干涉作用对表面形成机理和材料去除机理的影响，从而为深入研究难加工材料磨削时的表面形成机理和材料去除机理、提高材料的加工效率与表面完整性及进一步为超硬磨料砂轮地貌的设计与制造及磨削过程中的砂轮修整提供可靠依据。In view of the above technical problems, the present invention overcomes the drawbacks of the prior art by proposing a controllable high-precision grinding mechanism research experimental device and research method, and realizes a single abrasive grain of difficult-to-machine materials with a grinding wheel grinding line speed greater than 30m/s Grinding mechanism research; at the same time, the device solves the problem that the abrasive grains are too small (50 μm ~ 200 μm) and cannot be installed close to it, and it is convenient to focus on the relationship between adjacent abrasive grains and multiple abrasive grains during the grinding process. The influence of the interference of different axial spacing and radial spacing between grains on the surface formation mechanism and material removal mechanism, so as to further study the surface formation mechanism and material removal mechanism during grinding of difficult-to-machine materials, and improve the processing efficiency of materials And surface integrity and further provide a reliable basis for the design and manufacture of superabrasive grinding wheel topography and grinding wheel dressing in the grinding process.

本发明所采取的技术方案是：The technical scheme that the present invention takes is:

一种可控制高精度磨削机理研究的实验装置，主要包括基体、上T形滑块、下T形滑块、金刚石工具、轴向螺旋测微仪、径向螺旋测微仪、圆口夹具，其中基体与机床主轴连接杆连接，并通过防松平垫圈和六角螺母固定，所述基体的轴线与机床主轴连接杆的轴线高度重合，所述基体上的结构互差120°分布，其上开有通槽，通槽顶面和底面的两侧有对称分布的直线滑轨，用于上T形滑块和下T形滑块的运动；通槽内侧开有用于安装弹簧的盲孔，所述弹簧的另一端与下T形滑块上的凹槽相连接，构成微小的反向预紧力，用于平衡径向螺旋测微仪的作用力；通槽外侧开有用于安装径向螺旋测微仪的螺纹孔和光孔；所述光孔外侧为一平面，用于定位径向螺旋测微仪；所述基体中心孔位置顶部设有凸孔，底部设有阶梯孔；所述基体顶面靠近通槽部分标有刻度，与上T形滑块上的刻度相对应。An experimental device capable of controlling high-precision grinding mechanism research, mainly including a substrate, an upper T-shaped slider, a lower T-shaped slider, a diamond tool, an axial spiral micrometer, a radial spiral micrometer, and a circular fixture , wherein the base body is connected with the connecting rod of the machine tool spindle and fixed by a flat washer and a hexagonal nut. The axis of the base body is highly coincident with the axis of the connecting rod of the machine tool spindle. There is a through slot, and there are symmetrically distributed linear slide rails on both sides of the top and bottom of the slot, which are used for the movement of the upper T-shaped slider and the lower T-shaped slider; the inner side of the slot is opened with a blind hole for installing the spring. The other end of the spring is connected with the groove on the lower T-shaped slider to form a small reverse pre-tightening force, which is used to balance the force of the radial screw micrometer; The threaded hole and light hole of the micrometer; the outside of the light hole is a plane for positioning the radial spiral micrometer; the top of the central hole of the base is provided with a convex hole, and the bottom is provided with a stepped hole; the top of the base is There is a scale on the surface close to the through groove, which corresponds to the scale on the upper T-shaped slider.

此外，上T形滑块和下T形滑块相对设置于基体的通槽中，通过内六角圆柱螺钉连接，其中上T形滑块中心部位开有通孔，用于与轴向螺旋测微仪配合使用；上T形滑块上表面部分标有刻度，与基体顶面上的刻度相对应，构成游标卡尺，金刚石工具在径向位置的调节精度可达12.5μm；上T形滑块在基体上的运动可满足平滑移动，无爬行现象产生。In addition, the upper T-shaped slider and the lower T-shaped slider are relatively arranged in the through groove of the base body, and are connected by hexagon socket head screws, wherein a through hole is opened in the center of the upper T-shaped slider, which is used for micrometering with the axial screw. The upper surface of the upper T-shaped slider is marked with a scale, which corresponds to the scale on the top surface of the substrate, forming a vernier caliper. The adjustment accuracy of the diamond tool in the radial position can reach 12.5 μm; the upper T-shaped slider is on the substrate. The movement on the surface can meet the smooth movement without crawling phenomenon.

根据本发明的另一方面，下T形滑块中心开有阶梯通孔，上阶梯孔用于与轴向螺旋测微仪配合使用，下阶梯孔用于与金刚石工具高精度间隙配合使用；其左侧开有凹槽，用于与弹簧配合使用；其右侧开有螺纹阶梯孔，用于安装紧定螺钉来固定金刚石工具。According to another aspect of the present invention, a stepped through hole is opened in the center of the lower T-shaped slider, the upper stepped hole is used for cooperating with the axial spiral micrometer, and the lower stepped hole is used for cooperating with the high-precision clearance of the diamond tool; The left side is grooved for use with a spring and the right side is threaded with a stepped hole for a set screw to hold the diamond tool.

根据本发明的另一方面，上T形滑块和下T形滑块构成一个滑块组，该滑块组在基体上沿径向的滑动距离可达2mm，足以用来表征砂轮上磨粒与磨粒之间的径向间距。According to another aspect of the present invention, the upper T-shaped slider and the lower T-shaped slider constitute a slider group, and the radial sliding distance of the slider group on the substrate can reach 2mm, which is enough to characterize the abrasive grains on the grinding wheel. Radial distance between abrasive grains.

根据本发明的另一方面，金刚石工具与下T形滑块精密间隙配合，通过内六角圆柱螺钉紧固，其中金刚石工具在基体上的布置采用同心圆布置方法；可以通过旋转金刚石工具在下T形滑块的位置，来选择金刚石工具在磨削过程中的切入角；通过选择金刚石工具上的磨粒数来实现更多磨粒磨削试验。According to another aspect of the present invention, the diamond tool is closely matched with the lower T-shaped slider, and fastened by hexagon socket head screws, wherein the arrangement of the diamond tool on the substrate adopts the method of concentric circle arrangement; the diamond tool can be rotated in the lower T-shaped The position of the slider is used to select the cutting angle of the diamond tool during the grinding process; more abrasive grinding experiments can be realized by selecting the number of abrasive grains on the diamond tool.

根据本发明的另一方面，圆口夹具放置于基体上，毗邻上T形滑块，其中圆口夹具与基体的相对位置固定不变，当上T形滑块和下T形滑块及金刚石工具整体在通槽上移动后，轴向螺旋测微仪的位置也需要随之变动，此时圆口夹具可以实现轴向螺旋测微仪的弹性制装夹。According to another aspect of the present invention, the circular jig is placed on the substrate, adjacent to the upper T-shaped slider, wherein the relative position of the circular jig and the substrate is fixed, when the upper T-shaped slider and the lower T-shaped slider and the diamond After the tool as a whole moves on the through groove, the position of the axial spiral micrometer also needs to change accordingly. At this time, the round mouth clamp can realize the elastic clamping of the axial spiral micrometer.

根据本发明的另一方面，轴向螺旋测微仪贯穿于圆口夹具，其上的一个端面置于上T形滑块上，通过互差120°分布的三个内六角圆柱螺钉夹紧，用于精密调节金刚石工具在轴向的相对位置；径向螺旋测微仪互差120°分布在基体1上，由自身螺纹与基体连接，通过调节径向螺旋测微仪上的微调旋钮，使测微螺杆与上T型滑块接触并产生作用力，推动相互连接的上T形滑块、下T形滑块及金刚石工具整体在基体通槽中滑动，从而调节金刚石工具在径向的相对位置。According to another aspect of the present invention, the axial screw micrometer runs through the round mouth fixture, and one end surface on it is placed on the upper T-shaped slider, and is clamped by three hexagon socket head screws distributed with a mutual difference of 120°. It is used to precisely adjust the relative position of the diamond tool in the axial direction; the radial screw micrometers are distributed on the base body 1 with a mutual difference of 120°, and are connected to the base body by its own thread. By adjusting the fine-tuning knob on the radial screw micrometer, the The micrometer screw is in contact with the upper T-shaped slider and generates force to push the interconnected upper T-shaped slider, lower T-shaped slider and diamond tool to slide in the through groove of the substrate as a whole, thereby adjusting the relative radial direction of the diamond tool. Location.

根据本发明的另一方面，为了保证轴向螺旋测微仪随滑块组在基体上沿径向的位置变动而变动，圆口夹具的通孔为轴向螺旋测微仪留有2mm的移动空间，当金刚石工具在获得了精确的磨粒轴向间距和磨粒径向间距后，将轴向螺旋测微仪和圆口夹具从基体上卸下。According to another aspect of the present invention, in order to ensure that the axial screw micrometer changes with the radial position of the slider group on the base body, the through hole of the round mouth fixture leaves a 2mm movement for the axial screw micrometer. Space, when the diamond tool has obtained the precise axial spacing of abrasive grains and radial spacing of abrasive grains, the axial spiral micrometer and the round mouth fixture are removed from the substrate.

本发明相比现有技术具有如下优点：本发明装置结构简单，操作方便，研究方法新颖独特，实用性较强，测试精度高。本发明采用轻量化的结构设计、结构互差120°的分布模式、螺旋测微微调技术、游标卡尺原理、金刚石工具同心圆布置等方法设计并制造了一种创新性强的多功能高精度磨削机理研究的装置，基于该装置可控制、高精度等特性，提出了单颗磨粒、双颗磨粒及多颗磨粒多角度全方位研究磨削机理的新思路。本发明可以通过调节机床主轴的速度来得到不同的磨削速度，且磨削速度可达30m/s；通过调节机床Z轴的进给来获得不同的磨削深度，且分辨率可达0.1μm；此外，本发明最重要的创新在于：为深入研究难加工材料磨削时的表面形成机理和材料去除机理、提高材料的加工效率与表面完整性及进一步为超硬磨料砂轮地貌的设计与制造及磨削过程中的砂轮修整提供可靠依据。Compared with the prior art, the present invention has the following advantages: the device of the present invention has simple structure, convenient operation, novel and unique research method, strong practicability and high test precision. The present invention designs and manufactures an innovative multi-functional high-precision grinding machine by adopting methods such as light-weight structural design, 120° distribution pattern, spiral measuring fine-tuning technology, vernier caliper principle, diamond tool concentric circle arrangement, etc. The mechanism research device, based on the characteristics of the device such as controllability and high precision, puts forward a new idea of researching the grinding mechanism from multiple angles with single abrasive grains, double abrasive grains and multiple abrasive grains. The present invention can obtain different grinding speeds by adjusting the speed of the main shaft of the machine tool, and the grinding speed can reach 30m/s; by adjusting the Z-axis feed of the machine tool, different grinding depths can be obtained, and the resolution can reach 0.1 μm In addition, the most important innovation of the present invention is: for in-depth study of the surface formation mechanism and material removal mechanism when grinding difficult-to-machine materials, improve the processing efficiency and surface integrity of materials and further design and manufacture of superabrasive grinding wheel topography And the dressing of the grinding wheel in the grinding process provides a reliable basis.

附图说明Description of drawings

现在将描述如本发明的优选但非限制性的实施例，本发明的这些和其他特征、方面和优点在参考附图阅读如下详细描述时将变得显而易见，其中：These and other features, aspects and advantages of the invention will now be described as preferred but non-limiting embodiments of the invention will become apparent when the following detailed description is read with reference to the accompanying drawings in which:

图1是本发明的实验装置的正视图；Fig. 1 is the front view of experimental device of the present invention;

图2是本发明的实验装置的俯视图；Fig. 2 is the top view of experimental device of the present invention;

图3是本发明的实验装置的游标卡尺部分的局部放大图。Fig. 3 is a partially enlarged view of the vernier caliper part of the experimental device of the present invention.

图中：1—基体；2—圆口夹具；3—内六角圆柱螺钉；4—金刚石工具；5—六角螺母；6—平垫圈；7—主轴连接杆；8—弹簧；9—下T形滑块；10—上T形滑块；11—轴向螺旋测微仪；12—内六角圆柱螺钉；13—内六角圆柱螺钉；14—内六角圆柱螺钉；15—径向螺旋测微仪。In the figure: 1—base body; 2—round mouth fixture; 3—hexagon socket head screw; 4—diamond tool; 5—hex nut; 6—flat washer; 7—spindle connecting rod; 8—spring; 9—lower T shape Slider; 10—T-shaped slider; 11—axial screw micrometer; 12—hexagon socket screw; 13—hexagon socket screw; 14—hexagon socket screw; 15—radial screw micrometer.

具体实施方式Detailed ways

下面结合附图对本发明的实施例做详细的说明，以下给出了详细的实施方式和具体的操作过程，但本发明的保护范围不限于下述的实施例。以下的说明本质上仅仅是示例性的而并不是为了限制本公开、应用或用途。应当理解的是，在全部附图中，对应的附图标记表示相同或对应的部件和特征。The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the detailed implementation and specific operation process are given below, but the protection scope of the present invention is not limited to the following embodiments. The following description is merely exemplary in nature and not intended to limit the disclosure, application or use. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

如图1和图2所示：本实施例包括：基体1、上T形滑块10、下T形滑块9、金刚石工具4、轴向螺旋测微仪11、径向螺旋测微仪15、圆口夹具2。为了便于描述，对装置上互差120°分布的相同结构或组件进行顺序标号定义：如图2所示，把装置上的某一部分定义为A，按顺时针方向转动，分别定义B和C。如金刚石工具4A、金刚石工具4B、金刚石工具4C。As shown in Figures 1 and 2: this embodiment includes: a substrate 1, an upper T-shaped slider 10, a lower T-shaped slider 9, a diamond tool 4, an axial spiral micrometer 11, and a radial spiral micrometer 15 , Round mouth fixture 2. For the convenience of description, the sequence labels are defined for the same structures or components distributed on the device with a mutual difference of 120°: as shown in Figure 2, a certain part of the device is defined as A, rotate clockwise, and define B and C respectively. Such as diamond tool 4A, diamond tool 4B, and diamond tool 4C.

基体1与机床主轴连接杆7连接，并通过防松平垫圈6和六角螺母5固定，基体1的轴线与机床主轴连接杆7的轴线高度重合。其中，基体1上的结构互差120°分布，其上开有通槽，通槽顶面和底面的两侧有对称分布的直线滑轨，用于上T形滑块10和下T形滑块9的运动；通槽内侧(靠近轴心)开有用于安装弹簧8的盲孔，弹簧8的另一端与下T形滑块9上的凹槽相连接，构成微小的反向预紧力，用于平衡径向螺旋测微仪15的作用力；通槽外侧(远离轴心)开有用于安装径向螺旋测微仪15的螺纹孔和光孔；光孔外侧为一平面，用于定位径向螺旋测微仪15；基体1中心孔位置顶部设有凸孔，底部设有阶梯孔；在设计装置结构时，考虑到该装置高速回转产生的巨大离心力作用，确保其在离心力作用下安全可靠运行，本发明对基体1采用轻量化的结构设计，挖空基体上非工作部分，如圆周侧面上下凹槽部分和互差120°分布的扇形槽部分；基体1顶面靠近通槽部分标有刻度，与上T形滑块10上的刻度相对应。The base body 1 is connected with the connecting rod 7 of the machine tool spindle, and is fixed by the anti-loose flat washer 6 and the hex nut 5. The axis of the base body 1 coincides with the axis height of the connecting rod 7 of the machine tool spindle. Among them, the structures on the substrate 1 are distributed with a mutual difference of 120°, and there is a through groove on it, and there are symmetrically distributed linear slide rails on both sides of the top and bottom of the through groove, which are used for the upper T-shaped slider 10 and the lower T-shaped slider. The movement of the block 9; a blind hole for installing the spring 8 is opened on the inside of the through groove (near the axis), and the other end of the spring 8 is connected with the groove on the lower T-shaped slider 9 to form a small reverse pre-tightening force , used to balance the force of the radial spiral micrometer 15; there are threaded holes and light holes for installing the radial spiral micrometer 15 on the outside of the through groove (away from the axis); the outside of the light hole is a plane for positioning Radial spiral micrometer 15; the top of the central hole of the base body 1 is provided with a convex hole, and the bottom is provided with a stepped hole; when designing the structure of the device, the huge centrifugal force generated by the high-speed rotation of the device is taken into account to ensure its safety under the action of centrifugal force Reliable operation, the present invention adopts a lightweight structural design for the base 1, and hollows out the non-working parts on the base, such as the upper and lower grooves on the circumferential side and the fan-shaped grooves with a mutual difference of 120°; There is a scale corresponding to the scale on the upper T-shaped slide block 10.

上T形滑块10和下T形滑块9相对设置于基体的通槽中，通过内六角圆柱螺钉12连接。其中，上T形滑块10中心部位开有通孔，用于与轴向螺旋测微仪15配合使用；上T形滑块10上表面部分标有刻度，与基体1顶面上的刻度相对应，构成简单的游标卡尺，由游标卡尺原理可知，金刚石工具4在径向位置的调节精度可达12.5μm；上T形滑块10在基体1上的运动可满足平滑移动，无爬行现象产生。下T形滑块9中心开有阶梯通孔，上阶梯孔用于与轴向螺旋测微仪11配合使用，下阶梯孔用于与金刚石工具4高精度间隙配合使用；其左侧开有凹槽，用于与弹簧8配合使用；其右侧开有螺纹阶梯孔，用于安装紧定螺钉14来固定金刚石工具4。此外，上T形滑块10和下T形滑块9构成一个滑块组，该滑块组在基体1上沿径向的滑动距离可达2mm，足以用来表征砂轮上磨粒与磨粒之间的径向间距。The upper T-shaped slider 10 and the lower T-shaped slider 9 are relatively arranged in the through groove of the base body, and are connected by hexagon socket head cap screws 12 . Wherein, there is a through hole in the center of the upper T-shaped slider 10, which is used to cooperate with the axial screw micrometer 15; Correspondingly, a simple vernier caliper is formed. According to the principle of the vernier caliper, the adjustment accuracy of the diamond tool 4 in the radial position can reach 12.5 μm; the movement of the upper T-shaped slider 10 on the base 1 can satisfy smooth movement without crawling phenomenon. There is a stepped through hole in the center of the lower T-shaped slider 9, the upper stepped hole is used to cooperate with the axial screw micrometer 11, and the lower stepped hole is used to cooperate with the diamond tool 4 with high precision clearance; The groove is used to cooperate with the spring 8; its right side has a threaded stepped hole for installing a set screw 14 to fix the diamond tool 4. In addition, the upper T-shaped slider 10 and the lower T-shaped slider 9 constitute a slider group, and the sliding distance of the slider group on the base 1 in the radial direction can reach 2mm, which is enough to characterize the abrasive grains and abrasive grains on the grinding wheel. radial distance between.

若需要研究单颗磨粒磨削试验对表面形成机理和材料去除机理的影响，即三个金刚石工具中只有一个进行磨削，其余两个只起平衡作用；若需要研究双颗磨粒在磨削过程中对表面形成机理和材料去除机理的影响，即第三个金刚石工具起平衡作用，此时可以通过调节轴向螺旋测微仪11来精确控制金刚石工具4在轴向的相对位置，即可获得金刚石工具4A和与之互差120°分布的金刚石工具4B之间的轴向间距，通过径向螺旋测微仪15的作用和弹簧8的反方向作用来平稳推动相互连接的上T形滑块10、下T形滑块9及金刚石工具4整体在基体1通槽中滑动，精确调整金刚石工具4在径向的相对位置，即可获得金刚石工具4A和金刚石工具4B之间的径向间距；同理，研究多颗磨粒在磨削过程中对表面形成机理和材料去除机理的影响类似双颗磨粒的情况。If it is necessary to study the effect of the single abrasive grain grinding test on the surface formation mechanism and material removal mechanism, that is, only one of the three diamond tools is ground, and the other two only play a balancing role; The impact on the surface formation mechanism and material removal mechanism during the cutting process, that is, the third diamond tool plays a balancing role. At this time, the relative position of the diamond tool 4 in the axial direction can be precisely controlled by adjusting the axial screw micrometer 11, namely The axial distance between the diamond tool 4A and the diamond tool 4B distributed with a mutual difference of 120° can be obtained, and the interconnected upper T-shaped The slider 10, the lower T-shaped slider 9 and the diamond tool 4 slide in the through groove of the substrate 1 as a whole, and the relative position of the diamond tool 4 in the radial direction can be precisely adjusted to obtain the radial distance between the diamond tool 4A and the diamond tool 4B. In the same way, the study of the effect of multiple abrasive grains on the surface formation mechanism and material removal mechanism during the grinding process is similar to the case of double abrasive grains.

金刚石工具4与下T形滑块9精密间隙配合，通过内六角圆柱螺钉14紧固。其中，金刚石工具4在基体1上的布置采用同心圆布置方法，可以解决因磨粒过小(50μm～200μm)而不能靠近安装的难题，而且可以自由调节金刚石工具4A和金刚石工具4B之间的径向间距和轴向间距；考虑到试验中金刚石工具4的更换问题，为提高效率，该装置能方便地实现单颗磨粒的快装快卸功能；可以通过旋转金刚石工具4在下T形滑块9的位置，来选择金刚石工具4在磨削过程中的切入角；通过选择金刚石工具4上的磨粒数来实现更多磨粒磨削试验。The diamond tool 4 is matched with the lower T-shaped slide block 9 with precise clearance, and is fastened by the hexagon socket head cap screw 14 . Among them, the arrangement of the diamond tools 4 on the substrate 1 adopts a concentric circle arrangement method, which can solve the problem that the abrasive grains are too small (50 μm to 200 μm) and cannot be installed close to each other, and can freely adjust the distance between the diamond tools 4A and the diamond tools 4B. Radial spacing and axial spacing; considering the replacement of the diamond tool 4 in the test, in order to improve efficiency, the device can conveniently realize the quick loading and unloading function of a single abrasive grain; the diamond tool 4 can be rotated in the lower T-shaped slide The position of the block 9 is used to select the cutting angle of the diamond tool 4 in the grinding process; by selecting the number of abrasive grains on the diamond tool 4, more abrasive grain grinding tests can be realized.

圆口夹具2放置于基体1上，毗邻上T形滑块10。其中，圆口夹具2与基体1的相对位置固定不变，当上T形滑块10和下T形滑块9及金刚石工具4这个整体在通槽上移动后，轴向螺旋测微仪11的位置也需要随之变动，此时圆口夹具2可以实现轴向螺旋测微仪11的弹性制装夹。The circular jig 2 is placed on the base 1 and adjacent to the upper T-shaped slider 10 . Wherein, the relative position of the round mouth fixture 2 and the base body 1 is fixed, and when the whole body of the upper T-shaped slider 10, the lower T-shaped slider 9 and the diamond tool 4 moves on the through groove, the axial screw micrometer 11 The position of the micrometer also needs to be changed accordingly. At this time, the round mouth clamp 2 can realize the elastic clamping of the axial screw micrometer 11.

轴向螺旋测微仪11(分辨率为1μm)贯穿于圆口夹具2，其上的一个端面置于上T形滑块10上，通过互差120°分布的三个内六角圆柱螺钉13夹紧，用于精密调节金刚石工具4在轴向的相对位置；径向螺旋测微仪15(分辨率为10μm)互差120°分布在基体1上，由自身螺纹与基体1连接，通过调节径向螺旋测微仪15上的微调旋钮，使测微螺杆与上T型滑块10接触并产生作用力，推动相互连接的上T形滑块10、下T形滑块9及金刚石工具4整体在基体1通槽中滑动，从而调节金刚石工具4在径向的相对位置。为了保证轴向螺旋测微仪11随T形滑块在基体1上沿径向的位置变动而变动，圆口夹具2的通孔为轴向螺旋测微仪11留有2mm的移动空间。当金刚石工具4在获得了精确的磨粒轴向间距和磨粒径向间距后，将轴向螺旋测微仪11和圆口夹具2从基体1上卸下。An axial screw micrometer 11 (with a resolution of 1 μm) runs through the round fixture 2, and one end surface on it is placed on the upper T-shaped slider 10, and is clamped by three hexagon socket head screws 13 with a mutual difference of 120°. It is used to precisely adjust the relative position of the diamond tool 4 in the axial direction; the radial spiral micrometer 15 (with a resolution of 10 μm) is distributed on the base body 1 with a mutual difference of 120°, and is connected to the base body 1 by its own thread, and is adjusted by adjusting the diameter To the fine-tuning knob on the screw micrometer 15, the micrometer screw rod is contacted with the upper T-shaped slide block 10 and generates an active force, and promotes the interconnected upper T-shaped slide block 10, the lower T-shaped slide block 9 and the diamond tool 4 as a whole Sliding in the through groove of the base body 1, thereby adjusting the relative position of the diamond tool 4 in the radial direction. In order to ensure that the axial spiral micrometer 11 changes with the radial position of the T-shaped slider on the substrate 1, the through hole of the round fixture 2 leaves a 2mm moving space for the axial spiral micrometer 11. After the diamond tool 4 obtains the precise axial spacing and radial spacing of the abrasive grains, the axial spiral micrometer 11 and the round mouth fixture 2 are removed from the base body 1 .

本实施例在湖南大学国家高效磨削工程中心的精密数控坐标磨床MK2945C上完成，加工对象为BK7光学玻璃，金刚石工具4选用维氏压头V-2。由于单颗磨粒磨削试验过程比较简单，基本无需对金刚石工具进行过多的调整，而且部分操作步骤类似于双颗磨粒磨削试验，同理，多颗磨粒磨削操作步骤亦类似于双颗磨粒磨削试验。This embodiment is completed on the precision numerical control coordinate grinding machine MK2945C of the National High Efficiency Grinding Engineering Center of Hunan University, the processing object is BK7 optical glass, and the diamond tool 4 is Vickers indenter V-2. Since the single-grain grinding test process is relatively simple, there is basically no need to make too many adjustments to the diamond tool, and some operating steps are similar to the double-grain grinding test. Similarly, the multi-grain grinding operation steps are also similar In the double-grain grinding test.

因此，本实施例选择双颗磨粒磨削试验进行讲解，具体试验步骤如下：Therefore, this embodiment selects the double-grain grinding test for explanation, and the specific test steps are as follows:

(1)将测力仪固定在机床工作台上，真空吸盘固定于测力仪上，BK7光学玻璃放置于真空吸盘上并开启真空泵吸紧，双颗磨粒磨削试验之前对工件表面进行精密磨削，以保证工件具有一定的平面度，其表面粗糙度Ra≤0.3μm，并用丙酮清洗磨削后的工件表面；(1) Fix the dynamometer on the machine tool table, fix the vacuum suction cup on the dynamometer, place the BK7 optical glass on the vacuum suction cup and turn on the vacuum pump to suck it tightly. Grinding to ensure that the workpiece has a certain flatness, and its surface roughness Ra≤0.3μm, and clean the surface of the workpiece after grinding with acetone;

(2)将基体1与主轴连接杆7相连，套上垫圈6，锁紧六角螺母5，并将主轴连接杆7安装在机床主轴上；(2) Connect the base body 1 with the main shaft connecting rod 7, put on the washer 6, lock the hex nut 5, and install the main shaft connecting rod 7 on the machine tool main shaft;

(3)将弹簧8放入基体1的对应位置；将上T形滑块10和下T形滑块9放入基体1的通槽中，并用内六角圆柱螺钉12连接，同时保证弹簧8与下T形滑块9上的凹槽相配合；(3) Put the spring 8 into the corresponding position of the base body 1; put the upper T-shaped slider 10 and the lower T-shaped slider 9 into the through groove of the base body 1, and connect them with the hexagon socket head screw 12, and at the same time ensure that the spring 8 and the lower T-shaped slider 9 The groove on the lower T-shaped slide block 9 matches;

(4)将径向螺旋测微仪15通过螺纹连接于基体1上，把金刚石工具4装入到下T形滑块9中，调节径向螺旋测微仪15A和径向螺旋测微仪15B，设置磨粒初始径向间距L₀，初始径向间距L₀的值尽量偏大，以保证两颗磨粒磨削后的沟槽不产生干涉，该初始径向间距L₀通过基体1和上T形滑块10构成的游标卡尺上的刻度值来表示；(4) Connect the radial spiral micrometer 15 to the substrate 1 by threads, put the diamond tool 4 into the lower T-shaped slider 9, and adjust the radial spiral micrometer 15A and the radial spiral micrometer 15B , set the initial radial spacing L ₀ of the abrasive grains, the value of the initial radial spacing L ₀ should be as large as possible to ensure that the grooves after the grinding of the two abrasive grains do not interfere, the initial radial spacing L ₀ passes through the matrix 1 and The scale value on the vernier caliper that upper T-shaped slide block 10 constitutes represents;

(5)设置好初始径向间距L₀后，拧紧内六角圆柱螺钉12，将上T形滑块10和下T形滑块9固定于基体1的通槽中；(5) After setting the initial radial distance _L0 , tighten the hexagon socket head screw 12, and fix the upper T-shaped slider 10 and the lower T-shaped slider 9 in the through groove of the base 1;

(6)将圆口夹具2放置于基体1上，并用内六角圆柱螺钉3锁紧；(6) Place the round clamp 2 on the base 1 and lock it with the hexagon socket head screw 3;

(7)将轴向螺旋测微仪11贯穿于圆口夹具2、上T形滑块10和下T形滑块9，锁紧内六角圆柱螺钉13；通过目测，调节轴向螺旋测微仪11使得金刚石工具4A和金刚石工具4B在轴向方向的距离尽量靠近(以金刚石工具4A顶尖的磨粒为参考点)，使得金刚石工具4A和金刚石工具4B都能够在BK7光学玻璃表面留下沟槽，此时金刚石工具4A和金刚石工具4B存在一个轴向间距，用D₀表示，金刚石工具4C滞空；(7) Put the axial screw micrometer 11 through the round mouth fixture 2, the upper T-shaped slider 10 and the lower T-shaped slider 9, and lock the hexagon socket head screw 13; through visual inspection, adjust the axial screw micrometer 11 Make the distance between the diamond tool 4A and the diamond tool 4B in the axial direction as close as possible (with the abrasive grains at the top of the diamond tool 4A as a reference point), so that both the diamond tool 4A and the diamond tool 4B can leave grooves on the surface of the BK7 optical glass , now there is an axial distance between the diamond tool 4A and the diamond tool 4B, represented by D ₀ , the diamond tool 4C is in the air;

(8)金刚石工具4A和金刚石工具4B所需的轴向间距的表征方法如下：在步骤(7)之后，将圆口夹具2和轴向螺旋测微仪11从基体1上卸下，调节内六角圆柱螺钉14锁紧金刚石工具4，然后进行双颗磨粒预磨削试验，得到与金刚石工具4A和金刚石工具4B相对应的两个沟槽，分别表示为沟槽a和沟槽b，将工件至于显微镜下测量沟槽a和沟槽b的深度，得到一初始深度差值ΔD，该初始深度差值D₀₁即为初调轴向螺旋测微仪11后得到的金刚石工具4A和金刚石工具4B的初始轴向间距D₀；(8) The characterization method of the required axial distance between the diamond tool 4A and the diamond tool 4B is as follows: after step (7), the round mouth clamp 2 and the axial screw micrometer 11 are removed from the base body 1, and the internal The hexagonal cylindrical screw 14 locks the diamond tool 4, and then performs a double-grain pre-grinding test to obtain two grooves corresponding to the diamond tool 4A and the diamond tool 4B, which are respectively denoted as groove a and groove b. As for the workpiece, measure the depth of groove a and groove b under the microscope to obtain an initial depth difference _ΔD , which is the initial adjustment of the axial spiral micrometer 11 after the diamond tool 4A and diamond tool 4B initial axial spacing D ₀ ;

(9)在初始轴向间距D₀的情况下，将圆口夹具2和轴向螺旋测微仪11重新安装到基体1上，调节轴向螺旋测微仪11设置金刚石工具4A和金刚石工具4B的轴向间距D₁。从理论上分析，砂轮表面同一深度上的微刃数量越多、等高性越好，将有利于材料高效去除及表面质量改善；然而，砂轮实际磨削过程中其表面磨粒分布杂乱无章，其磨粒等高性难以保证，而且分布在砂轮表层的微刃一般由砂轮精细修整而成。因此，可以通过研究磨粒与磨粒之间轴向间距D₁的变化对磨削机理的影响规律，从而为超硬磨料砂轮地貌的设计与制造及磨削过程中的砂轮修整提供可靠依据。调节完毕后，锁紧内六角圆柱螺钉14；(9) In the case of the initial axial distance D ₀ , reinstall the round mouth fixture 2 and the axial screw micrometer 11 on the substrate 1, adjust the axial screw micrometer 11 to set the diamond tool 4A and the diamond tool 4B The axial spacing D ₁ . Theoretically, the more microblades on the surface of the grinding wheel at the same depth and the better the contour, it will be beneficial to the efficient removal of materials and the improvement of surface quality; The equal height of the abrasive grains is difficult to guarantee, and the micro-blades distributed on the surface of the grinding wheel are generally finely trimmed by the grinding wheel. Therefore, by studying the influence _of the change of the axial distance D1 between the abrasive grains on the grinding mechanism, a reliable basis can be provided for the design and manufacture of the superabrasive grinding wheel topography and the dressing of the grinding wheel during the grinding process. After the adjustment is completed, lock the hexagon socket head screw 14;

(10)在获得了精确的磨粒轴向间距D₁后，再设置所需的磨粒径向间距L₁；将圆口夹具2和轴向螺旋测微仪11从基体1上卸下，拧松内六角圆柱螺钉12，调节径向螺旋测微仪15A和径向螺旋测微仪15B设置所需的磨粒径向间距L₁，设置完成后，拧紧内六角圆柱螺钉12；(10) After obtaining the accurate abrasive grain axial spacing D ₁ , set the required abrasive grain radial spacing L ₁ ; the round mouth clamp 2 and the axial screw micrometer 11 are unloaded from the base body 1, Loosen the inner hexagonal cylindrical screw 12, adjust the radial screw micrometer 15A and the radial screw micrometer 15B to set the required radial spacing L ₁ of abrasive grains, and tighten the inner hexagonal cylindrical screw 12 after the setting is completed;

(11)至此，在获得了精确的磨粒轴向间距D₁和磨粒径向间距L₁后，整个试验装置调节完毕；(11) So far, after obtaining the precise abrasive grain axial spacing D ₁ and abrasive grain radial spacing L ₁ , the adjustment of the entire test device is completed;

(12)设置磨削参数，试验过程中可控制的工艺参数包括：主轴转速n(4500r/min—20000r/min)、工作台进给速度V_w(30mm/min—5000mm/min)、磨削深度a_p(调节分辨率为0.1μm)；通过设置不同的磨削工艺参数，采用正交实验法进行深入系统的试验研究；(12) Set the grinding parameters. The process parameters that can be controlled during the test include: spindle speed n (4500r/min—20000r/min), table feed speed V _w (30mm/min—5000mm/min), grinding Depth a _p (adjustment resolution is 0.1μm); By setting different grinding process parameters, an in-depth and systematic experimental research is carried out by using the orthogonal experiment method;

(13)启动数控坐标磨床MK2945C，装置在机床主轴的作用下高速旋转，金刚石工具4以立轴磨削的磨削方式在待测K9光学玻璃表面进行磨削加工，从而在一次试验中产生两条呈同心圆分布的圆弧沟槽；在同一参数下条件下，调节工作台在XY面内的位置，重复两次；(13) Start the CNC coordinate grinding machine MK2945C, the device rotates at a high speed under the action of the main shaft of the machine tool, and the diamond tool 4 is ground on the surface of the K9 optical glass to be tested in the grinding mode of vertical axis grinding, thereby producing two in one test. Arc grooves distributed in concentric circles; under the same parameters, adjust the position of the worktable in the XY plane and repeat twice;

(14)若要研究不同的磨粒径向间距L₂…L_n和磨粒轴向间距D₂…D_n对表面形成机理和材料去除机理的影响，返回步骤(9)；记录好每次试验完成后磨粒径向间距L_n和磨粒轴向间距D_n，以备作为下次试验的初始值L₀和D₀，避免了步骤(4)—(8)的多次重复；(14) If you want to study the influence of different abrasive grain radial spacing L ₂ ... L _n and abrasive grain axial spacing D ₂ ... D _n on the surface formation mechanism and material removal mechanism, return to step (9); record each time After the test is completed, the radial spacing L _n of abrasive grains and the axial spacing D _n of abrasive grains are used as the initial values L ₀ and D ₀ of the next test, avoiding multiple repetitions of steps (4)-(8);

(15)采集磨削过程中的磨削力，处理分析数据；(15) Collect the grinding force in the grinding process, process and analyze the data;

(16)磨削试验完毕后，收集磨屑，并用超景深显微镜和扫描电子显微镜观察分析磨屑形态；(16) After the grinding test is completed, the grinding debris is collected, and the morphology of the grinding debris is observed and analyzed with an ultra-depth microscope and a scanning electron microscope;

(17)为了便于观察沟槽形貌，将磨削后的BK7光学玻璃放入超声波清洗机中用丙酮清洗，接着将清洗完的样件置于65％的浓磷酸中腐蚀17小时，将样件清洗干净，最后将烘干的试件放在超景深显微镜和扫描电子显微镜下观测沟槽表面形貌及表面裂纹；(17) In order to facilitate the observation of the groove morphology, put the ground BK7 optical glass into an ultrasonic cleaner and clean it with acetone, then put the cleaned sample in 65% concentrated phosphoric acid for 17 hours, and the sample The parts are cleaned, and finally the dried samples are placed under an ultra-depth microscope and a scanning electron microscope to observe the groove surface morphology and surface cracks;

(18)为了便于观察磨削过程中产生的亚表面裂纹，对磨削后的BK7光学玻璃在Nanopoli-100型纳米抛光机进行研磨抛光，将抛光后的BK7光学玻璃与(17)做相似的处理，观测亚表面裂纹形态及亚表面裂纹深度。(18) In order to facilitate the observation of the subsurface cracks produced in the grinding process, the ground BK7 optical glass is ground and polished on a Nanopoli-100 nano-polishing machine, and the polished BK7 optical glass is similar to (17) treatment, observe the subsurface crack morphology and subsurface crack depth.