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CN108601253A - Production method, housing unit and the electronic device of housing unit - Google Patents

️Fri Sep 28 2018

Specific implementation mode

Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.

In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature. In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.

In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.

In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower" It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.

Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.

It please refers to Fig.1 to Fig.4, the housing unit 10 of embodiment of the present invention includes shell 12, decoration element 13, panel group Part 14, connection adhesive tape 15 and joint filling adhesive tape 18.

Shell 12 includes bottom wall 124 and the side wall 126 that the side from bottom wall 124 extends, and bottom wall 124 is surrounded with side wall 126 Fluted 122.Shell 12 includes inwardly projecting from side wall 126 and along the anti-overflow item 16 of the circumferentially extending of side wall 126.Panel assembly 14 are housed in groove 122.Anti-overflow item 16 seals the gap 11 between side wall 126 and panel assembly 14.Decoration element 13 surrounds Panel assembly 14.Joint filling adhesive tape 18 between decoration element 13 and panel assembly 14 by being arranged joint filling glue and being formed by curing. Joint filling adhesive tape 18 is fixedly connected with decoration element 13 and panel assembly 14.Connection adhesive tape 15 is fixedly connected with shell 12 and decoration element 13。

The housing unit 10 of embodiment of the present invention by first panel assembly 14 is connect with decoration element 13 again with shell 12 connections, and when panel assembly 14 to be connect with decoration element 13, panel assembly 14 is inverted with from lower surface 143 to upper table Joint filling glue is arranged in the direction in face 142 in gap so that joint filling glue will not flow to 14 bottom of panel assembly pollution panel group Part 14, and making can be with timely processing when joint filling glue spots are to panel assembly 14.

Shell 12 includes bottom wall 124 and the side wall 126 from the extension of bottom wall 124, and bottom wall 124 surrounds groove with side wall 126 122.Shell 12 is substantially in cuboid, and shell 12 is the load-bearing part of electronic device 100, for carrying the big of electronic device 100 Part.Shell 12 may be used plastics and be made, and can also be made of metal material, or be passed through using plastics and metal The technique of in-mould injection forms integral structure.In one example, the material of bottom wall 124 is metal, and the material of side wall 126 is modeling Bottom wall 124, can first be put into mold by material, then by injecting the plastic cement of melting into mold, be formed after plastic cement solidification Side wall 126, to obtain shell 12.

In some embodiments, anti-overflow item 16 and side wall 126 are separate structure, circumferential direction of the anti-overflow item 16 along side wall 126 It is mounted on the inside of side wall 126.

Certainly, in some other embodiments, anti-overflow item 16 is structure as a whole with side wall 126, for example, anti-overflow item 16 It can be formed by Shooting Technique with side wall 126.

In some embodiments, when anti-overflow item 16 and side wall 126 are separate structure, anti-overflow item 16 includes foam.This When, foam can be mounted in by double faced adhesive tape on the inside of side wall 126.Foam has elasticity, using foam as anti-overflow item 16 can not only prevent from subsequently connecting glue infiltration groove 122 pollution shell 12 and/or panel assembly 14, be also used as buffering Material, the protection panels component 14 when shell 12 and/or panel assembly 14 are impacted.In addition, foam is simple and easy to get and weight Gently, while improving production efficiency and reducing cost, the weight of shell 12 and panel assembly 14 can be mitigated.

In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222 Bottom surface 1228, medial surface 1222 are the plane perpendicular to bottom surface 1228.

Medial surface 1222 can be vertical with bottom surface 1228, can also upwards extend outwardly from the edge of bottom surface 1228, shell Component 10 can select specific structure as needed.

In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144 146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144.Anti-overflow item 16 seals side wall 126 and touch panel Gap 11 between 144.Joint filling adhesive tape 18 is fixedly connected with cover board 146 and side wall 126.

In this way, the side wall 126 of cover board 146 and groove 122 is able to connect by joint filling adhesive tape 18, so that panel assembly 14 are fixedly connected with shell 12.

Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146 Due to the input part as electronic device 100, cover board 146 is often subject to the contacts such as collide or scratch.For example, user is by electronics When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146 The larger material of hardness, such as above sapphire material may be used.Or hardened layer is formed to carry on the surface of cover board 146 The anti-scratch ability of high cover board 146.

Specifically, touch panel 144 includes that display module (not shown) and the touch control layer being arranged in display module (are schemed not Show).Display module is, for example, liquid crystal display die set (LCD Module, LCM), and certainly, display module may be flexible aobvious Show module.Touch control layer is used to receive the touch-control input of user, to generate the signal for controlling the content that display module is shown.

Touch panel 144 is for example bonded by optical cement (Optically Clear Adhesive, OCA) with cover board 146 It is fixed together, optical cement is not only adhesively fixed touch panel 144 and cover board 146, can also penetrate what touch panel 144 be sent out Light.

In one example, panel assembly 14 can be formed by following steps：Touch panel 144 and cover board are first provided 146, then cover board 146, is finally fitted on optical cement by the coated optical glue on touch panel 144, so that cover board 146 It is fixed together with touch panel 144.

In some embodiments, side wall 126 includes long side wall 1224 and connects the short side wall 1226 of long side wall 1224, is prevented The item 16 that overflows is arranged along the length direction of long side wall 1224 on the inside of long side wall 1224.In this way, the size of long side wall 1224 compared with Greatly, anti-overflow item 16 be arranged along the length direction of long side wall 1224 be conducive on the inside of long side wall 1224 seal side wall 126 with Gap 11 between panel assembly 14.

Also referring to Fig. 5 and Fig. 6, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes long side The short side wall 1226 of wall 1224 and connection long side wall 1224, short side wall 1226 are formed with step 128, and panel assembly 14 is supported on platform It is adhesively fixed on rank 128 and with step 128.In this way, step 128 plays the role of a support to panel assembly 14, be conducive to Panel assembly 14 is steadily connect with shell 12.Specifically, in present embodiment, cover board 146 be supported on step 128 and with platform Rank 128 is adhesively fixed, and touch panel 144 is located at the side of step 128.

In other embodiment, short side wall 1226 can save step 128 and have with long side wall 1224 same Structure, and equally mount anti-overflow item 16.

The present invention also provides a kind of production method of housing unit, the making sides of the housing unit of embodiment of the present invention Method can be used for manufacturing the housing unit 10 for forming embodiment of the present invention.It specifically, below will be to embodiment of the present invention The production method of housing unit is described in detail.

Fig. 7 and Fig. 8 are please referred to, the production method of the housing unit of embodiment of the present invention includes the following steps：

S12：There is provided decoration element 13, panel assembly 14 and shell 12, shell 12 includes bottom wall 124 and from bottom wall 124 The side wall 126 that side extends, bottom wall 124 surround fluted 122 with side wall 126；

S14：Panel assembly 14 is fitted into decoration element 13 and makes the upper surface 142 of panel assembly 14 downward；

S16：Joint filling glue is arranged in gap 11 between panel assembly 14 and decoration element 13；

S18：Cure joint filling glue to be fixedly connected with panel assembly 14 and decoration element 13；With

S20：Decoration element 13 with panel assembly 14 is fixedly connected with shell 12 and the setting of panel assembly 14 is made to exist In groove 122.

The production method of the housing unit 10 of embodiment of the present invention is by first connecting panel assembly 14 and decoration element 13 It connects and is connect again with shell 12, and when panel assembly 14 to be connect with decoration element 13, panel assembly 14 is inverted with from following table Joint filling glue is arranged in the direction of face 143 to upper surface 142 in gap 11 so that joint filling glue will not flow to 14 bottom of panel assembly Portion pollutes panel assembly 14, and making can be with timely processing when joint filling glue spots are to panel assembly 14.

It is appreciated that joint filling glue is arranged after panel assembly 14 is inverted in gap 11 again, joint filling glue is from panel In the direction merging gap 11 of lower surface 143 to the upper surface 142 of component 14, joint filling glue will not be flow to face by the effect of gravity The bottom of board group part 14 is to pollute panel assembly 14.But during dispensing, joint filling glue is possible to be put to panel assembly On 14.And decoration element 13 is usually integrally formed with shell 12, in the fabrication process, panel assembly 14 is generally first set up directly on The decoration element 13 of one is fixedly connected by mode for dispensing glue again in shell 12, since panel assembly 14 has been housed at this time In the groove 122 of shell 12, the glue put to panel assembly 14 can not be handled so as to cause 14 quilt of panel assembly in time Pollution.Decoration element 13 is first connect with panel assembly 14 by gap-filling glue hydropexis by the dispensing method of embodiment of the present invention, Since panel assembly 14 is not placed into the groove 122 of shell 12 also at this time, if joint filling glue spots to panel assembly 14, can be with The joint filling glue put to panel assembly 14 is handled in time, prevents it from polluting panel assembly 14.

Specifically, panel assembly 14 can be drawn by sucker, be then charged into decoration element 13, and joint filling glue can lead to Dispenser point is crossed to be located in the top in gap 11.Joint filling glue can also can by other means be cured with spontaneous curing.Example Such as, when joint filling glue is UV glue, glue can be irradiated by ultraviolet light so that glue curing.

Joint filling glue is arranged in gap 11 between cover board 146 and decoration element 13；

Step S18 includes：

Cure joint filling glue to be fixedly connected with cover board 146 and decoration element 13.

In this way, decoration element 13 and cover board 146 are connected and are fixed by the joint filling adhesive tape 18 formed by joint filling glue curing, To make panel assembly 14 be fixed in decoration element 13.Note that due in step S14 by the upper table of panel assembly 14 Downward, " setting joint filling glue ", which will refer to the direction from the lower surface 143 of panel assembly 14 to upper surface 142, herein to fill out in face 142 It stitches in glue setting to gap 11.

In some embodiments, gap 11 is formed with towards upper opening 112, in panel assembly 14 and decoration element 13 Between gap 11 be arranged joint filling glue the step of include the following steps：

It is placed in gap 11 from opening 112 by joint filling glue.

Joint filling glue can be placed in gap 11 by Glue dripping head generally in needle-shaped by opening 112.In one example, may be used First to fix the decoration element 13 for enclosing panel assembly 14 using fixture, then Glue dripping head was moved along one week of gap 11, Joint filling glue is placed in gap 11 by opening 112.In this way, realizing the filling of joint filling glue.It note that due in step S14 In by the upper surface 142 of panel assembly 14 downward, in other words, the lower surface 143 of panel assembly 14 upward, herein " upward Opening 112 " refer to opening 112 directions towards upper surface 142 to the lower surface 143 of panel assembly 14.

In some embodiments, step S18 includes the following steps：

Cure joint filling glue in 20-25 DEG C of environment.

In one example, cure joint filling glue in 20 DEG C of environment；In another example, in 22 DEG C of environment Cure joint filling glue；In another example, cure joint filling glue in 25 DEG C of environment.Herein not in 20-25 DEG C of range Interior solidification temperature does concrete restriction.

In this way, realizing the solidification of joint filling glue.It is appreciated that after joint filling glue is fully cured, joint filling glue loses Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that follow-up removal is located at panel assembly 14 and decoration element 13 joint filling glue is inconvenient, it could even be possible to damaging panel assembly 14 and decoration element 13 in removal process.At 20-25 DEG C Environment in the state that is also not up to fully cured of joint filling glue of the solidification more than five minutes, be conducive to subsequently remove positioned at panel The joint filling glue of component 14 and decoration element 13.In addition, 20-25 DEG C is normal temperature environment, cure joint filling glue in normal temperature environment So that the condition of cure of joint filling glue is simple, and it is easy to implement, to reduce the manufacturing cost of housing unit 10.

In some embodiments, the production method of housing unit is further comprising the steps of after step S18：

Removal is positioned at panel assembly 14 and the joint filling glue of decoration element 13.

During by joint filling glue from 112 points of opening into gap 11, since gap 11 is very narrow, when from Glue dripping head When the dispensing amount of outflow is excessive, joint filling glue 13 is easy to spill into decoration element 13 and panel assembly 14.In addition, in operating process In, it is possible to by 13 points of joint filling glue to panel assembly 14.Therefore, it after curing joint filling glue, also needs to wipe in joint filling glue It goes so that there is no joint filling glue for decoration element 13 and panel assembly 14.

In some embodiments, removal positioned at the step of joint filling glue of panel assembly 14 and decoration element 13 include with Lower step：

Using non-dust cloth erasing positioned at panel assembly 14 and the joint filling glue of decoration element 13.

Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface While board group part 14 and decoration element 13, higher cleaning efficiency can be obtained.In one example, fixture can first be used Fixed housing unit 10, then by manipulator clamping non-dust cloth, last control machinery hand movement is located at panel assembly to wipe 14 and decoration element 13 joint filling glue.

Referring to Fig. 9, in some embodiments, step S20 includes the following steps：

Connection glue is arranged at the top of side wall 126 1262 in circumferential along side wall 126；

Decoration element 13 is connect with shell 12；With

Solidification connection glue is so that the connection adhesive tape 15 after solidification is fixedly connected with decoration element 13 and shell 12.

In this way, the fixation of decoration element 13 and shell 12 with panel assembly 14 is realized, to make panel assembly 14 set It sets in groove 122.It note that top 1262 herein refers to the end face that side wall 126 is connect with decoration element 13, rather than side wall The top of 126 medial surface 1222 is arranged due to that will connect glue on end face, and the flowing for connecting glue is restricted, no The bottom of the inside and panel assembly susceptible to gravitational forces for flowing to side wall 126.Furthermore it is possible to using connection glue connection decoration Element 13 and shell 12 can also use two-sided glue connection decoration element 13 and shell 12.

In some embodiments, step S20 further includes step：

Anti-overflow glue is arranged in circumferential direction along side wall 126 on the inside of side wall 126；

Cure anti-overflow glue to form at least one anti-overflow item 16；With

Decoration element 13 is fixedly connected with shell 12 and anti-overflow item 16 is made to seal between side wall 126 and panel assembly 14 Gap 11.

By the way that anti-overflow item 16 is arranged so that anti-overflow item 16 seals the gap 11 between side wall 126 and panel assembly 14, to When preventing that the connection glue for connecting shell 12 and decoration element 13 is subsequently arranged again, connection glue penetrates into groove 122 and pollutes shell 12 and/or panel assembly 14.It is appreciated that even if connection glue due to mobility being arranged on end face by larger limitation, It is not easy to flow to the bottom of the inside and panel assembly 14 of shell 12, however when in the setting to shell 12 of decoration element 13, connection Glue is squeezed, and has certain possibility to flow to the bottom of the inside and panel assembly 14 of shell 12.It, can by the way that anti-overflow item is arranged Further to prevent from connecting the bottom of inside and panel assembly 14 that glue flow to shell 12.

In some embodiments, anti-overflow glue includes silicone adhesive.

The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue Leakproofness and the moisture resistance for changing the anti-overflow item 16 formed are more preferable.In addition, silicone adhesive also adapts to larger temperature change, to make Sealing effect will not be reduced because of temperature change by obtaining anti-overflow item 16.Certainly, sealing glue may be silicone adhesive.Anti-overflow glue and It may be the preferable glue of other mobility such as UV glue to seal glue.

In some embodiments, it includes following step to cure anti-overflow glue to be formed the step of at least one anti-overflow item 16 Suddenly：

It is more than five minutes to cure anti-overflow glue in 20-25 DEG C of environment.

In one example, cure anti-overflow glue in 20 DEG C of environment, hardening time is 15 minutes；In another example In, cure anti-overflow glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment Cure anti-overflow glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes Hardening time in range does concrete restriction.

In this way, 20-25 DEG C is normal temperature environment, cure the condition of cure that anti-overflow glue makes anti-overflow glue in normal temperature environment Simply, easy to implement, to reduce the manufacturing cost of housing unit 10.

In some embodiments, the time is fully cured less than anti-overflow glue in the hardening time of anti-overflow glue.

In one example, the time that is fully cured of anti-overflow glue is more than 25min, and in the present invention, anti-overflow glue is consolidated The change time is 10min.

In this way, anti-overflow glue curing for a period of time after, by panel assembly 14 be arranged in groove 122, can make Panel assembly 14 is arranged in groove when anti-overflow glue is also uncured for tight ness rating ratio between panel assembly 14 and groove 122 Tight ness rating in the case of in 122 is small, facilitates the dismounting during subsequent maintenance.In addition, before anti-overflow glue is fully cured, Panel assembly 14 is arranged in groove 122, it can be to avoid since anti-overflow glue is fully cured and reduces close caused by mobility It is poor to seal effect.

It is appreciated that after anti-overflow glue is fully cured, anti-overflow glue loses mobility, at this time sets panel assembly 14 It sets in groove 122, anti-overflow glue can not be deformed upon according to the extruding of panel assembly 14 and groove 122 and be obtained preferably close Seal effect.In addition, the anti-overflow item 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, can cause When panel assembly 14 is placed into groove 122, obstruction is generated.

In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144 146, the lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144, and decoration element 13 is fixedly connected simultaneously with shell 12 The step of making anti-overflow item 16 seal gap 11 between side wall 126 and panel assembly 14 includes：

Decoration element 13 is fixedly connected with shell 12 and anti-overflow item 16 is made to seal between side wall 126 and touch panel 144 Gap 11.

In this way, realizing that anti-overflow item 16 seals the gap 11 between side wall 126 and touch panel 144.It can prevent subsequently again When the connection glue for connecting shell 12 and decoration element 13 is arranged, connection glue penetrates into groove 122 and pollutes shell 12 and/or panel Component 14.

In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes medial surface 1222, and medial surface 1222 wraps It includes long side surface 1223 and connects the short sides 1225 of long side surface 1223, short sides 1225 are formed with step 128, and step 128 includes Step surface 1282, connection step surface 1282 and long side surface 1223 rank below 1284 and connect step surface 1282 rank above 1286, circumferential along side wall 126 includes the following steps the step of anti-overflow glue is arranged on the inside of side wall 126：

1284 length direction is continuously provided anti-overflow glue below rank.

In this way, continuously distributed on can making adhesive-spill-preventing water 1284 below the rank so that anti-overflow after anti-overflow glue curing Item 16 1284 below the rank on be continuous, prevent from causing anti-overflow item 16 that cannot be formed due to the discontinuous spot printing of anti-overflow item 16 Continuous sealing ring makes the effect for sealing the gap 11 between side wall 126 and panel assembly 14 poor.

It is appreciated that the anti-overflow glue being coated in long side wall 1224 and short side wall 1226 is continuous, in this way, along side wall The anti-overflow item 16 formed after the 126 anti-overflow glue curing being circumferentially coated with can form the sealing ring of a closure.

Referring to Fig. 10, in some embodiments, groove 122 is generally rectangular shaped, side wall 126 includes medial surface 1222, Medial surface 1222 includes long side surface 1223 and connects the short sides 1225 of long side surface 1223, and short sides 1225 are formed with step 128, Step 128 include step surface 1282, connection step surface 1282 and long side surface 1223 rank below 1284 and connection step surface 1282 Rank above 1286, step S20 includes the following steps：

The setting bonding glue on step surface 1282；

Panel assembly 14 is supported on step surface 1282；With

Solidification bonding glue is to be bonded step surface 1282 and panel assembly 14.

In this way, panel assembly 14 is able to bear against and is fixed on step surface by being bonded the bonding adhesive tape 19 that glue curing is formed On 1282.Step 128 plays the role of a support to panel assembly 14, is conducive to decoration element 13 and steadily connects with shell 12 It connects.

Specifically, bonding glue can be identical with the ingredient of anti-overflow glue, such as is above-mentioned silicone adhesive.In addition, face Board group part 14 includes touch panel 144 and the cover board 146 being covered on touch panel 144, and the longitudinal size of cover board 146, which is more than, to be touched The longitudinal size of panel 144 is controlled, the cover board 146 of panel assembly 14 is born against on step surface 1282, the touch surface of panel assembly 14 Plate 144 is connect with below rank 1284 by the anti-overflow item 16 that anti-overflow glue curing is formed.

1 is please referred to Fig.1, the housing unit 10 of embodiment of the present invention can be applied to electronic device 100.Electronic device 100 include ontology 20, and housing unit 10 is arranged on ontology 20.Electronic device 100 include but not limited to mobile phone, tablet computer or Wearable device.

Specifically, electronic device 100 further includes battery cover (not shown), and battery cover is located at shell 12 and panel assembly On 14 opposite sides.

In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.

While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that： Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become Type, the scope of the present invention are limited by claim and its equivalent.