CN110097828A - Flexible display panels - Google Patents

Specific embodiment

The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side] Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.

The present invention provides a kind of flexible display panels, and buffer layer is easy to damage when alleviating the bending of existing flexible display panels The technical issues of.

As shown in Figure 1, being the first structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40.

Flexible substrate 10 prevents moisture or impurity from spreading by flexible substrates for stopping oxygen and moisture.To realize display Thin film transistor (TFT) and display device are usually made in flexible substrate 10 by the characteristics such as bending, the curling of device, flexible substrate 10 It is extensible, can roll over and replace, is flexible or rollable so that flexible display panels are also extensible, foldable, flexible or rollable.

Flexible substrate 10 can be by forming with any appropriate insulating materials flexible, such as can be by polyimides (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), the polymer materials such as polyarylate (PAR) or fiberglass reinforced plastics (FRP) are formed, and flexible substrate 10 can be with It is transparent, translucent or opaque.

In the present embodiment, flexible substrate 10 is polyimides.Since polyimides has flexible, good toughness spy Point can not use in device fabrication processes as bearing substrate, need polyimide coating on the glass substrate, to complete aobvious After showing element manufacturing, then with laser lift-off technique flexible substrate 10 is separated from glass substrate, obtains flexible display panels.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

Flexible display panels include viewing area 100 and non-display area 200.With the development of flexible display technologies, in order to make Flexible display screen reaches screen display effect comprehensively, generallys use the method for bending non-display area 200 and realizes, i.e., by Flexible Displays The non-display area 200 of panel is folded into the back side of flexible display panels, to reduce screen body border width, improves screen accounting.

Non-display area 200 includes bent area 210 and non-bent area 220, the non-display area 200 of flexible display panels is curved When folding to the back side of flexible display panels, curved part be bent area 210, be folded into the flexible display panels back side and with display The parallel region of flexible display panels in area 100 is non-bent area 220, the flexibility in postorder processing procedure, in non-bent area 220 Display panel is bound with driving IC.

Inorganic buffer layer 20 is arranged in flexible substrate 10, and through-hole 21 is formed in bent area 210,30 shape of line layer At on inorganic buffer layer 20.

In one embodiment, through-hole 21 corresponds to the land setting in line layer 30.Line layer 30 is by various lines Road composition, there are gap between each route, i.e., line layer 30 include be provided with route land and not set route it is non- Land, through-hole 21 corresponds to the land setting in line layer 30, namely in bent area 210, route is directly formed In in flexible substrate 10.

In one embodiment, through-hole 21 is arranged corresponding to bent area 210.Inorganic buffer layer 20 is whole in flexible substrate 10 Face covering, forms through-hole 21, i.e., in entire bent area 210, line layer 30 is formed directly into flexibility in entire bent area 210 On substrate 10.

In the present embodiment, inorganic 20 whole face of buffer layer is arranged in flexible substrate 10, is formed in bent area 210 logical Hole 21 is provided with inorganic buffer layer 20 in viewing area 100 and non-bent area 220.

Since the quality of inorganic buffer layer 20 is more crisp, film easily occurs in bending and splits, especially in small curvature radius bend When even can generate peeling phenomenon.In flexible display panels, influence of the non-display area 200 for steam is not so good as viewing area 100 Sensitivity, steam invasion non-display area 200 do not influence flexible display panels entirety display effect.In the present embodiment, inorganic buffering Layer 20 is arranged in flexible substrate 10, and through-hole 21 is formed in bent area 210, i.e., not set inorganic slow in bent area 210 Layer 20 is rushed, therefore improves the bending characteristic of flexible display panels, is conducive to bend flexible display panels in non-display area 200 To the back side, realizes flexible display panels narrow frame, promote the screen accounting of flexible display panels.

In viewing area 100, other film layers are additionally provided on inorganic buffer layer 20, are with the thin film transistor (TFT) of top gate structure Example, including active layer, gate insulating layer, grid, interlayer insulating film, source electrode, drain electrode and the passivation being located on inorganic buffer layer 20 Layer (figure is not shown).

Active layer include the source region formed by doped N-type foreign ion or p type impurity ion and drain region, And the channel region between source region and drain region.Active layer can be amorphous silicon material, polycrystalline silicon material or Metal oxide materials etc., wherein active layer is used and can be formed using low temperature amorphous silicon technology when polycrystalline silicon material, i.e., will be non- Crystal silicon material forms polycrystalline silicon material by the laser melting.Further, it is also possible to using such as rapid thermal annealing (RTA) method, consolidate Mutually crystallization (SPC) method, quasi-molecule laser annealing (ELA) method, crystallization inducing metal (MIC) method, metal induced lateral crystallization (MILC) the various methods such as method or continuously transverse solidifying (SLS) method.

The material of gate insulating layer is usually silica, silicon nitride etc., and can be single or multi-layer structure.Grid position In on gate insulating layer, grid be can be including gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminium (Al), the single or multi-layer structure of molybdenum (MO) or chromium (Cr), or such as aluminium (Al): neodymium (Nd) alloy and molybdenum (MO): tungsten (W) The alloy of alloy.

Interlayer insulating film is located on grid, and interlayer insulating film can be formed by insulating materials such as silicon oxide or silicon nitrides.

Source electrode and drain electrode is located on interlayer insulating film, and source electrode and drain electrode is respectively by running through gate insulating layer and layer insulation The via hole of layer is electrically connected to source region and drain region.

Passivation layer is located in source electrode and drain electrode, and passivation layer can be formed by inorganic material such as silicon oxide or silicon nitrides.

It should be noted that film layer structure is not limited, other structures, such as bottom grating structure etc. can also be.

In bent area 210, line layer 30 is also formed with encapsulated layer 40 far from the side of flexible substrate 10, for route Layer 30 is protected, and prevents line layer 30 from damaging.

In one embodiment, the material of encapsulated layer 40 is ultraviolet light-sensitive emulsion.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms flexible substrate 10, Then inorganic buffer layer 20 is deposited in flexible substrate 10, inorganic 20 whole face of buffer layer covers flexible substrate 10, then passes through light shield It is exposed, develops, retain the inorganic buffer layer 20 in viewing area 100 and non-bent area 220, by being dry-etched in bent area Through-hole 21 is formed in 210, line layer 30 and other film layers is then made by film forming, exposure, development and etching technics, and carry out Subsequent technique, laser lift-off glass substrate after completing, then the flexible display panels in non-display area 200 are bent to back Face, completes the production of narrow frame flexible display panels, and the structure of the flexible display panels under bending state is as shown in Figure 2.

In the present embodiment, not set inorganic buffer layer 20 in the bent area 210 of flexible display panels, also it is not set other Buffer layer, therefore line layer 30 is formed directly into flexible substrate 20.When flexible display panels are bent, due to bent area 210 not set inorganic buffer layers 20, will not generate the phenomenon that film is split, and the film layer in bent area 210 reduces, and film thickness reduces, also Crooked process radius can be reduced, flexible display panels narrow frame is realized, promote the screen accounting of flexible display panels.

As shown in figure 3, being second of structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40, in addition, flexible display panels include viewing area 100 and non-display area 200, non-display area 200 includes bent area 210 and non-bent area 220.

The difference is that, flexible substrate 10 includes the first flexible substrate 11 and the second flexible substrate with the structure in Fig. 1 12, inorganic buffer layer 20 is arranged in the first flexible substrate 10, and is formed in bent area 210 through-hole (not shown go out), the Two flexible substrates 12 are filled in through-hole, and line layer 30 is formed on inorganic buffer layer 20, and cover the second flexible substrate 12, envelope Dress layer 40 is formed in side of the line layer 30 far from the second flexible substrate 12, and is located in bent area 210.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

In one embodiment, the deep equality of the thickness and through-hole of the second flexible substrate 12, i.e. viewing area 100 and non-curved The height of inorganic buffer layer 20 and the second flexible substrate 12 in folding area 220 is equal, and the two is far from the first flexible substrate 10 Side forms a plane.

In one embodiment, the through-hole in bent area 210 can be completely covered in the second flexible substrate 12, can also only cover logical The a part in hole.

In one embodiment, the first flexible substrate 11 is identical with the material of the second flexible substrate 12.First flexible substrate 11 and second flexible substrate 12 be polyimides, the first flexible substrate 11 is identical with the material of the second flexible substrate 12, soft Property display panel bending when, bending ability it is consistent, improve the bending performance and service life of product.

In one embodiment, the first flexible substrate 11 is different with the material of the second flexible substrate 12.First flexible substrate 11 material is polyimides, and the material of the second flexible substrate 12 is poly terephthalic acid diethyl alcohol ester (PET), triacetate fiber Organic materials such as plain (TAC).

Coating, CVD (chemical vapour deposition technique) or IJP (ink jet printing molding) technique shape can be used in second flexible substrate 12 At, wherein CVD is the steam containing the gaseous reactant or liquid reactants for constituting film element and to react required other gas Body introduces reaction chamber, and the process that chemical reaction generates film occurs in substrate surface；IJP is then directly to be ejected into particles of ink The process of output is completed on substrate.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms the first flexible liner Bottom 11, then deposits inorganic buffer layer 20 in the first flexible substrate 11, and inorganic 20 whole face of buffer layer covers the first flexible substrate 11, then be exposed by light shield, developed, retain the inorganic buffer layer 20 in viewing area 100 and non-bent area 220, by dry Method etching forms through-hole in bent area 210, the second flexible substrate 12 is formed in bent area 210 by being coated with, toasting, then Line layer 30 and other film layers are made by film forming, exposure, development and etching technics, and carries out subsequent technique, after completing Laser lift-off glass substrate, then the flexible display panels in non-display area 200 are bent to the back side, complete narrow frame Flexible Displays The production of panel.

Since the quality of inorganic buffer layer 20 is more crisp, film easily occurs in bending and splits, especially in small curvature radius bend When even can generate peeling phenomenon.In flexible display panels, influence of the non-display area 200 for steam is not so good as viewing area 100 Sensitivity, steam invasion non-display area 200 do not influence flexible display panels entirety display effect.In the present embodiment, inorganic buffering Layer 20 is arranged in the first flexible substrate 10, and through-hole 21 is formed in bent area 210, and the second flexible liner is provided in through-hole Bottom 20, i.e., not set inorganic buffer layer 20 in bent area 210, therefore the bending characteristic of flexible display panels is improved, be conducive to Flexible display panels in non-display area 200 are bent to the back side, realize flexible display panels narrow frame, promote Flexible Displays face The screen accounting of plate.

As shown in figure 4, being the third structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40, in addition, flexible display panels include viewing area 100 and non-display area 200, non-display area 200 includes bent area 210 and non-bent area 220.

In the present embodiment, flexible substrate 10 includes the first flexible substrate 11 and the second flexible substrate 12, inorganic buffer layer 20 are arranged in the first flexible substrate 10, and are formed in bent area 210 through-hole (not shown go out), 12 shape of the second flexible substrate Side at inorganic buffer layer 20 far from the first flexible substrate 10, and be filled in through-hole, line layer 30 is formed in the second flexibility On substrate 12, encapsulated layer 40 is formed in side of the line layer 30 far from the second flexible substrate 12, and is located in bent area 210.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

In one embodiment, the first flexible substrate 11 is identical with the material of the second flexible substrate 12.First flexible substrate 11 and second flexible substrate 12 be polyimides, the first flexible substrate 11 is identical with the material of the second flexible substrate 12, soft Property display panel bending when, bending ability it is consistent, improve the bending performance and service life of product.

In one embodiment, the first flexible substrate 11 is different with the material of the second flexible substrate 12.First flexible substrate 11 material is polyimides, and the material of the second flexible substrate 12 is poly terephthalic acid diethyl alcohol ester (PET), triacetate fiber Organic materials such as plain (TAC).

Coating, CVD (chemical vapour deposition technique) or IJP (ink jet printing molding) technique shape can be used in second flexible substrate 12 At, wherein CVD is the steam containing the gaseous reactant or liquid reactants for constituting film element and to react required other gas Body introduces reaction chamber, and the process that chemical reaction generates film occurs in substrate surface；IJP is then directly to be ejected into particles of ink The process of output is completed on substrate.

In one embodiment, the through-hole in bent area 210 can be completely covered in the second flexible substrate 12, can also only cover logical The a part in hole.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms the first flexible liner Bottom 11, then deposits inorganic buffer layer 20 in the first flexible substrate 11, and inorganic 20 whole face of buffer layer covers the first flexible substrate 11, then be exposed by light shield, developed, retain the inorganic buffer layer 20 in viewing area 100 and non-bent area 220, by dry Method etching forms through-hole in bent area 210, the second flexible substrate 12 is formed in bent area 210 by being coated with, toasting, then Line layer 30 and other film layers are made by film forming, exposure, development and etching technics, and carries out subsequent technique, after completing Laser lift-off glass substrate, then the flexible display panels in non-display area 200 are bent to the back side, complete narrow frame Flexible Displays The production of panel.

Wherein, the second flexible substrate 12 can be integrally formed, i.e., first in inorganic buffer layer 20 and bent area 210 is flexible Whole face is coated with organic material on substrate 11, forms the second flexible substrate 12；It can also independently form, i.e., first in bent area 210 Be coated with organic material in first flexible substrate 11, toasted and etc. molding, then in inorganic buffer layer 20 and bent area 210 at Whole face is coated with organic material on the organic material layer of type, and by independent forming step twice, it is flexible to ultimately form complete second Substrate 12.

Since the quality of inorganic buffer layer 20 is more crisp, film easily occurs in bending and splits, especially in small curvature radius bend When even can generate peeling phenomenon.In flexible display panels, influence of the non-display area 200 for steam is not so good as viewing area 100 Sensitivity, steam invasion non-display area 200 do not influence flexible display panels entirety display effect.In the present embodiment, inorganic buffering Layer 20 is arranged in the first flexible substrate 10, and through-hole 21 is formed in bent area 210, and the second flexible liner is provided in through-hole Bottom 20, i.e., not set inorganic buffer layer 20 in bent area 210, therefore the bending characteristic of flexible display panels is improved, be conducive to Flexible display panels in non-display area 200 are bent to the back side, realize flexible display panels narrow frame, promote Flexible Displays face The screen accounting of plate.

As shown in figure 5, being the 4th kind of structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40, in addition, flexible display panels include viewing area 100 and non-display area 200, non-display area 200 includes bent area 210 and non-bent area 220.

In the present embodiment, inorganic buffer layer 20 is formed in flexible substrate 10, and inorganic buffer layer 20 is in bent area 210 With through-hole (not shown go out) is each formed in non-bent area 220, line layer 30 is formed in inorganic buffer layer 20 and non-display area 200 In interior flexible substrate 10, encapsulated layer 40 is formed in side of the line layer 30 far from flexible substrate 10, and is located at bent area 210 It is interior.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms flexible substrate 10, Then inorganic buffer layer 20 is deposited in flexible substrate 10, inorganic 20 whole face of buffer layer covers flexible substrate 10, then passes through light shield It is exposed, develops, retain the inorganic buffer layer 20 in viewing area 100, led to by being dry-etched in be formed in non-display area 200 Then hole makes line layer 30 and other film layers by film forming, exposure, development and etching technics, and carries out subsequent technique, make Laser lift-off glass substrate after the completion, then the flexible display panels in non-display area 200 are bent to the back side, it is soft to complete narrow frame The production of property display panel.

In flexible display panels, influence of the non-display area 200 for steam is sensitive not as good as viewing area 100, steam invasion Non-display area 200 does not influence flexible display panels entirety display effect.Since inorganic buffer layer 20 is arranged in non-display area 200 There is through-hole, i.e., not set inorganic buffer layer 20, improves the bending characteristic of non-display area 200 in bent area 210, and being conducive to will be non- Flexible display panels in display 200 are bent to the back side, realize flexible display panels narrow frame, promote flexible display panels Shield accounting.

As shown in fig. 6, being the 5th kind of structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40, in addition, flexible display panels include viewing area 100 and non-display area 200, non-display area 200 includes bent area 210 and non-bent area 220.

In the present embodiment, flexible substrate 10 includes the first flexible substrate 11 and the second flexible substrate 12, inorganic buffer layer 20 are arranged in the first flexible substrate 10, and are formed in bent area 210 and non-bent area 220 through-hole (not shown go out), the Two flexible substrates 12 are filled in through-hole, and line layer 30 is formed on inorganic buffer layer 20, and cover the second flexible substrate 12, envelope Dress layer 40 is formed in side of the line layer 30 far from the second flexible substrate 12, and is located in bent area 210.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

In one embodiment, the deep equality of the thickness and through-hole of the second flexible substrate 12, i.e. nothing in viewing area 100 The height of machine buffer layer 20 and the second flexible substrate 12 is equal, and the two forms one far from the side of the first flexible substrate 10 Plane.

In one embodiment, the through-hole in non-display area 200 can be completely covered in the second flexible substrate 12, can also only cover A part of through-hole.

In one embodiment, the first flexible substrate 11 is identical with the material of the second flexible substrate 12.First flexible substrate 11 and second flexible substrate 12 be polyimides, the first flexible substrate 11 is identical with the material of the second flexible substrate 12, soft Property display panel bending when, bending ability it is consistent, improve the bending performance and service life of product.

In one embodiment, the first flexible substrate 11 is different with the material of the second flexible substrate 12.First flexible substrate 11 material is polyimides, and the material of the second flexible substrate 12 is poly terephthalic acid diethyl alcohol ester (PET), triacetate fiber Organic materials such as plain (TAC).

Coating, CVD (chemical vapour deposition technique) or IJP (ink jet printing molding) technique shape can be used in second flexible substrate 12 At, wherein CVD is the steam containing the gaseous reactant or liquid reactants for constituting film element and to react required other gas Body introduces reaction chamber, and the process that chemical reaction generates film occurs in substrate surface；IJP is then directly to be ejected into particles of ink The process of output is completed on substrate.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms the first flexible liner Bottom 11, then deposits inorganic buffer layer 20 in the first flexible substrate 11, and inorganic 20 whole face of buffer layer covers the first flexible substrate 11, then be exposed by light shield, developed, retain the inorganic buffer layer 20 in viewing area 100 and non-bent area 22, passes through dry method Etching forms through-hole in non-display area 200, the second flexible substrate 12 is formed in non-display area 200 by being coated with, toasting, so Line layer 30 and other film layers are made by film forming, exposure, development and etching technics afterwards, and carry out subsequent technique, are completed Laser lift-off glass substrate afterwards, then the flexible display panels in non-display area 200 are bent to the back side, it is aobvious to complete narrow frame flexibility Show the production of panel.

Since the quality of inorganic buffer layer 20 is more crisp, film easily occurs in bending and splits, especially in small curvature radius bend When even can generate peeling phenomenon.In flexible display panels, influence of the non-display area 200 for steam is not so good as viewing area 100 Sensitivity, steam invasion non-display area 200 do not influence flexible display panels entirety display effect.In the present embodiment, inorganic buffering Layer 20 is arranged in the first flexible substrate 10, and through-hole 21 is formed in non-display area 200, and the second flexibility is provided in through-hole Substrate 20, i.e., not set inorganic buffer layer 20 in bent area 210, therefore the bending characteristic of flexible display panels is improved, favorably Flexible display panels are bent to the back side in by non-display area 200, realize flexible display panels narrow frame, promote Flexible Displays The screen accounting of panel.

As shown in fig. 7, being the 6th kind of structural schematic diagram of flexible display panels provided in an embodiment of the present invention.Flexible Displays Panel includes flexible substrate 10, inorganic buffer layer 20, line layer 30, encapsulated layer 40, in addition, flexible display panels include viewing area 100 and non-display area 200, non-display area 200 includes bent area 210 and non-bent area 220.

In the present embodiment, flexible substrate 10 includes the first flexible substrate 11 and the second flexible substrate 12, inorganic buffer layer 20 are arranged in the first flexible substrate 10, and are formed in bent area 210 and non-bent area 220 through-hole (not shown go out), the Two flexible substrates 12 form side of the inorganic buffer layer 20 far from the first flexible substrate 10, and are filled in through-hole, line layer 30 It is formed in the second flexible substrate 12, encapsulated layer 40 is formed in side of the line layer 30 far from the second flexible substrate 12, and is located at In bent area 210.

Inorganic buffer layer 20 can be by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminium oxide (AlOx) and at least one of aluminium nitride (AlNx) composition, it can be single or multi-layer structure.Inorganic buffer layer 20 can rise To the effect of isolation steam, the impurity in flexible substrate 10 can also be stopped to spread to other film layers.

In one embodiment, the first flexible substrate 11 is identical with the material of the second flexible substrate 12.First flexible substrate 11 and second flexible substrate 12 be polyimides, the first flexible substrate 11 is identical with the material of the second flexible substrate 12, soft Property display panel bending when, bending ability it is consistent, improve the bending performance and service life of product.

In one embodiment, the first flexible substrate 11 is different with the material of the second flexible substrate 12.First flexible substrate 11 material is polyimides, and the material of the second flexible substrate 12 is poly terephthalic acid diethyl alcohol ester (PET), triacetate fiber Organic materials such as plain (TAC).

Coating, CVD (chemical vapour deposition technique) or IJP (ink jet printing molding) technique shape can be used in second flexible substrate 12 At, wherein CVD is the steam containing the gaseous reactant or liquid reactants for constituting film element and to react required other gas Body introduces reaction chamber, and the process that chemical reaction generates film occurs in substrate surface；IJP is then directly to be ejected into particles of ink The process of output is completed on substrate.

In one embodiment, the through-hole in non-display area 200 can be completely covered in the second flexible substrate 12, can also only cover A part of through-hole.

In the present embodiment, it is first coated with polyimide solution on the glass substrate, and baking-curing forms the first flexible liner Bottom 11, then deposits inorganic buffer layer 20 in the first flexible substrate 11, and inorganic 20 whole face of buffer layer covers the first flexible substrate 11, then be exposed by light shield, developed, retain the inorganic buffer layer 20 in viewing area 100, it is non-display by being dry-etched in Form through-hole in area 200, form the second flexible substrate 12 in non-display area 200 by being coated with, toasting, then by film forming, Exposure, development and etching technics production line layer 30 and other film layers, and subsequent technique is carried out, laser lift-off glass after completing Glass substrate, then the flexible display panels in non-display area 200 are bent to the back side, complete the system of narrow frame flexible display panels Make.

Wherein, the second flexible substrate 12 can be integrally formed, i.e., first in inorganic buffer layer 20 and non-display area 200 is soft Property substrate 11 on whole face be coated with organic material, formed the second flexible substrate 12；It can also independently form, i.e., first in non-display area 200 It is coated with organic material in the first interior flexible substrate 11, toasted and etc. molding, then in inorganic buffer layer 20 and non-display area Whole face is coated with organic material on molding organic material layer in 200, by independent forming step twice, ultimately forms complete the Two flexible substrates 12.

Since the quality of inorganic buffer layer 20 is more crisp, film easily occurs in bending and splits, especially in small curvature radius bend When even can generate peeling phenomenon.In flexible display panels, influence of the non-display area 200 for steam is not so good as viewing area 100 Sensitivity, steam invasion non-display area 200 do not influence flexible display panels entirety display effect.In the present embodiment, inorganic buffering Layer 20 is arranged in the first flexible substrate 10, and through-hole 21 is formed in non-display area 200, and the second flexibility is provided in through-hole Substrate 20, i.e., not set inorganic buffer layer 20 in bent area 210, therefore the bending characteristic of flexible display panels is improved, favorably Flexible display panels are bent to the back side in by non-display area 200, realize flexible display panels narrow frame, promote Flexible Displays The screen accounting of panel.

According to above-described embodiment:

The present invention provides a kind of flexible display panels, including flexible substrate, inorganic buffer layer, line layer and encapsulated layer, nothing Machine buffer layer is formed on flexible substrates；Line layer is formed on inorganic buffer layer；Encapsulated layer is formed on line layer；Wherein, Inorganic buffer layer is formed with through-hole in bent area.Since in bent area, inorganic buffer layer is formed with through-hole in bent area, Line layer is formed directly into flexible substrate, is improved the technical issues of flexible display panels are easily ruptured in bending, is mentioned The bending characteristic of flexible display panels is risen.

In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention Decorations, therefore protection scope of the present invention subjects to the scope of the claims.