CN110331361A - Anti- electromagnetic interference matrix and preparation method thereof and electronic equipment - Google Patents

This application provides a kind of anti-electromagnetic interference matrix and preparation method thereof and electronic equipments.The anti-electromagnetic interference matrix preparation method, includes the following steps, provides substrate, determine and need to provide the shielding area of electromagnetic shielding on the substrate；Metalling particle on shielding area on the substrate makes to form the coat of metal on the shielding area；The metallic particles is one of copper particle, Argent grain, gold particle, copper alloy, silver alloy or billon.The application is by forming the coat of metal using the spraying plating of one of copper particle, Argent grain, gold particle, copper alloy, silver alloy or billon on the shielding area of substrate, so that shielding area can provide good electromagnetic shielding protection；And it can guarantee the quality of the coat of metal, be convenient for automatic batch production, be pasted without artificial, abnormal fitting will not occur, reduce waste；It especially can be adapted for that there is complicated, sharpened surface on substrate, adaptability is good.

Anti- electromagnetic interference matrix and preparation method thereof and electronic equipment

Technical field

The application belongs to electronic technology field, is to be related to a kind of anti-electromagnetic interference matrix and its preparation side more specifically Method and electronic equipment.

Background technique

The development of Current communications technology high-speed, magnetic field and electromagnetic wave are in people's local environment, various electronic equipments and electricity Machine equipment is also in such environment, it is therefore desirable to be shielded the interference of this kind of magnetic field and electromagnetic wave to equipment, be guaranteed that information passes It passs normally, flame is avoided to generate.The method for being usually used in shielding electromagnetic signal interference at present, usually direct copper foil piece Or copper facing diaphragm is pasted, interference of the electromagnetic signal to electronic device is shielded using the conductive layer constructed by it.However, due to copper film More soft, artificial stickup copper film operation is more frequent, especially for the special-shaped bottom surface of some substrates, often will cause copper film Paste askew, copper film fold causes to waste.

Summary of the invention

The embodiment of the present application is designed to provide a kind of anti-electromagnetic interference matrix preparation method, to solve in the prior art Existing manually the operation of stickup copper film is more frequent on substrate, easily causes copper film to be bonded extremely with substrate, causes to waste, increases The problem of cost.

To achieve the above object, the embodiment of the present application the technical solution adopted is that: a kind of anti-electromagnetic interference matrix system is provided Preparation Method includes the following steps:

Prepare substrate: substrate being provided, determines and needs to provide the shielding area of electromagnetic shielding on the substrate；

Sprayed metal layer: metalling particle on the shielding area on Xiang Suoshu substrate makes to be formed on the shielding area The coat of metal；The metallic particles is one of copper particle, Argent grain, gold particle, copper alloy, silver alloy or billon.

In one embodiment, it is further comprised the steps of: between the preparation substrate step and the sprayed metal layer step

Roughening treatment: roughening treatment is carried out to the shielding area.

In one embodiment, image controller auxiliary positioning is used in the roughening treatment step, and passes through laser carving side Formula is roughened the shielding area.

In one embodiment, the width range that laser carving forms wire casing on the shielding area is 0.02-0.05mm, adjacent The two line inter-alveolar distance ranges are 0.02-0.05mm, and the wire casing depth bounds are 0.01-0.03mm.

In one embodiment, it is further comprised the steps of: after the sprayed metal layer step

Sanding and polishing: sanding and polishing processing is carried out to the coat of metal, keeps the metal coating surface smooth bright and clean.

In one embodiment, it is further comprised the steps of: after the sprayed metal layer step

It coats protective coating: coating insulating protective layer in the metal coating surface.

In one embodiment, the insulating protective layer is insulating resin layer, ceramic coating or insulating oil paint layer.

In one embodiment, the thickness range of the coat of metal is 0.06-0.15mm.

In one embodiment, the substrate is one of metal base, plastic rubber substrate, glass baseplate, ceramic base material； Alternatively, the substrate is that arbitrarily two or more are mutually spliced into metal base, plastic rubber substrate, glass baseplate or ceramic base material Substrate.

In one embodiment, the spraying plating of arc spraying equipment, the metallic particles are used in the sprayed metal layer step Firing rate be 550-650m/s, the operating voltage range of the spraying plating equipment is 30-38V.

In one embodiment, the metallic particles magnitude range is 6-8 μm.

It in one embodiment, further include cleaning the shielding area in the preparation substrate step.

In one embodiment, it is used in the preparation substrate step and accounts for the spirituous non-dust cloth wiping blind zone Domain, so that the shielding area neat and tidy.

The another object of the embodiment of the present application is to provide anti-electromagnetic interference matrix, prevent as described in above-mentioned any embodiment The production of electromagnetic interference matrix preparation method.

The further object of the embodiment of the present application is to provide electronic equipment, dry including the anti-electromagnetism as described in above-described embodiment Disturb matrix.

One of said one or multiple technical solutions in the embodiment of the present application, at least have the following technical effect that:

The embodiment of the present application is by using copper particle, Argent grain, gold particle, copper alloy, silver on the shielding area of substrate The spraying plating of one of alloy or billon forms the coat of metal, so that shielding area can provide good electromagnetic shielding protection； And since the coat of metal is shielding area of the spraying plating in substrate, it is ensured that the quality of the coat of metal, it is raw convenient for automation batch It produces, is pasted without artificial, abnormal fitting will not occur, reduce waste；It especially can be adapted for that there is complicated, point on substrate Sharp surface, adaptability are good.

Detailed description of the invention

It in order to more clearly explain the technical solutions in the embodiments of the present application, below will be to embodiment or description of the prior art Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only some of the application Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these Figure obtains other attached drawings.

Fig. 1 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application one provides；

Fig. 2 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application one provides.

Fig. 3 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application two provides；

Fig. 4 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application two provides.

Fig. 5 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application three provides；

Fig. 6 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application three provides.

Fig. 7 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application four provides；

Fig. 8 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application four provides.

Fig. 9 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application five provides；

Figure 10 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application five provides.

Figure 11 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application six provides；

Figure 12 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application six provides.

Figure 13 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application seven provides；

Figure 14 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application seven provides.

Figure 15 is the flowage structure schematic diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application eight provides；

Figure 16 is the flow diagram for the anti-electromagnetic interference matrix preparation method that the embodiment of the present application eight provides.

Wherein, each attached drawing main mark in figure:

11- substrate；111- wire casing；The 12- coat of metal；13- insulating protective layer.

Specific embodiment

In order to which technical problems to be solved in this application, technical solution and beneficial effect is more clearly understood, tie below Accompanying drawings and embodiments are closed, the application is further elaborated.It should be appreciated that specific embodiment described herein is only To explain the application, it is not used to limit the application.

It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element On one element or indirectly on another element.When an element is known as " being connected to " another element, it can To be directly to another element or be indirectly connected on another element.

In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more of the features.In the description of the present application, the meaning of " plurality " is two or more, Unless otherwise specifically defined." several " are meant that one or more, unless otherwise specifically defined.

In the description of the present application, it is to be understood that term " center ", " length ", " width ", " thickness ", "upper", The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the application and simplifies description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage Solution is the limitation to the application.

In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with The concrete meaning of above-mentioned term in this application is understood as the case may be.

Fig. 1 and Fig. 2 is please referred to, now anti-electromagnetic interference matrix preparation method provided by the present application is illustrated.It is described anti- Electromagnetic interference matrix preparation method, includes the following steps:

Prepare substrate S1: substrate 11 is provided, determines that the shielding area for needing to provide electromagnetic shielding on the substrate 11 (is schemed not Mark)；

Metalling particle on shielding area on S3: Xiang Suoshu substrate 11 of sprayed metal layer, makes on the shielding area Form the coat of metal 12；The metallic particles is one in copper particle, Argent grain, gold particle, copper alloy, silver alloy or billon Kind.

In above-mentioned preparation substrate S1 step, shielding area is determined on substrate 11, it can be more targeted in substrate Metalling coating 12 on 11, can not only reduce waste, but also efficiency can be improved, to reduce cost.

In sprayed metal layer S3 step, made using copper particle, Argent grain, gold particle, copper alloy, silver alloy or billon Carry out spraying plating for metallic particles, it is ensured that the coat of metal 12 formed on substrate 11 has good effectiveness.Copper Alloy can be using copper-tin alloy, corronil, albronze or ormolu etc..Above-mentioned silver alloy can be closed using silver-colored tin Gold, silver nickel alloy, aerdentalloy or silver-colored zinc alloy etc..Above-mentioned billon can be using gold-tin alloy, golden nickel alloy, golden aluminium alloy Or golden kirsite etc..

By way of the shielding area metalling particle on substrate 11, make to be formed on the shielding area on substrate 11 The coat of metal 12 can make the coat of metal 12 is good to be attached on substrate 11, and can the good shape with substrate 11 Molding is electromagnetically shielded with good offer and is protected；It is not in paste abnormal, reduction waste, and be convenient for without manually pasting Industrial automation batch production.

The embodiment of the present application by the shielding area of substrate 11, using copper particle, Argent grain, gold particle, copper alloy, The spraying plating of one of silver alloy or billon forms the coat of metal 12, protects so that shielding area can provide good electromagnetic shielding Shield；And since the coat of metal 12 is shielding area of the spraying plating in substrate 11, it is ensured that the quality of the coat of metal 12, convenient for automatic Change batch production, is pasted without artificial, abnormal fitting will not occur, reduce waste；Especially it can be adapted on substrate 11 With complicated, sharpened surface, adaptability is good.

In one embodiment, Fig. 1 and Fig. 2 are please referred to, the thickness N range of the coat of metal 12 is 0.06-0.15mm. The coat of metal 12 that a layer thickness is 0.06-0.15mm will be formed on the shielding area of substrate 11, to guarantee the coat of metal 12 With good effectiveness.When 12 thickness N of the coat of metal is less than 0.06mm, in spraying plating, it is difficult to guarantee blind zone The coat of metal 12 is uniformly plated on domain, and is difficult to provide good effectiveness.And when 12 thickness N of the coat of metal is greater than When 0.15mm, the coat of metal 12 is too thick, and cost increases, spraying plating low efficiency, and when in use, in easy sticker to electronic device, leads Emission and ionization electronic device short circuit.

In one embodiment, please refer to Fig. 1 and Fig. 2, the substrate 11 is metal base, that is, use metal material as Substrate 11.Certainly, in further embodiments, substrate 11 or plastic rubber substrate, glass baseplate, ceramic base material etc..Certainly, In further embodiments, substrate 11 is also possible to a variety of matrixes and is spliced, and such as uses metal base, plastic rubber substrate, glass Two or more any substrates 11 for being mutually spliced into substrate or ceramic base material.It is prepared by the anti-electromagnetic interference matrix of the present embodiment Method, the substrate 11 for being adapted to different substrates 11, being also adapted to labyrinth.

In one embodiment, Fig. 1 and Fig. 2 are please referred to, uses arc spraying equipment in the sprayed metal layer S3 step Spraying plating, the firing rate of the metallic particles are 550-650m/s, and the operating voltage range of the spraying plating equipment is 30-38V.Using electricity Arc spraying plating equipment spraying plating, simple process, and fixed point spraying plating may be implemented, it is high-efficient, it is possible to reduce waste of material.And make metal The firing rate of particle is 550-650m/s, that is, guarantees good spraying plating efficiency, while well attached in substrate 11 convenient for metallic particles On, it is convenient for spraying plating.Furthermore it is also possible to according to the metal particle material of selection, to determine the firing rate of respective metal particle.By spraying plating The operating voltage of equipment is set as 30-38V, to melt metallic particles well in arc spraying, is convenient for metallic particles It is plated on substrate 11.It certainly, can also be according to the metal particle material of selection, to determine spraying plating equipment in some embodiments Operating voltage.

In one embodiment, Fig. 1 and Fig. 2 are please referred to, the metallic particles magnitude range is 6-8 μm.By metallic particles Size is selected as 6-8 μm, it can guarantees good efficiency when spraying plating, and is uniformly plated in the shielding of substrate 11 convenient for metallic particles On region.And when metallic particles selection is excessive, will lead to metallic particles is difficult to melt, it is difficult to well be plated on substrate 11.Work as gold Metal particles are difficult to control spraying position, and spraying plating low efficiency using too small.

In one embodiment, Fig. 1 and Fig. 2 are please referred to, further includes cleaning the shielding in the preparation substrate S1 step Region.Shielding area on substrate 11 is cleaned, can prevent having impurity on shielding area, well to be sprayed on substrate 11 Plating metal coating 12.

Further, in the above-described embodiments, it is used in the preparation substrate S1 step and accounts for spirituous non-dust cloth wiping The shielding area, so that the shielding area neat and tidy.Using alcohol wipe, it can well guarantee the blind zone of substrate 11 Domain neat and tidy, so as to spraying plating.Certainly in some other embodiment, substrate 11 can be directly placed in cleaning solution and is carried out Cleaning is convenient for batch processing, is improved efficiency.

In one embodiment, Fig. 3 and Fig. 4 are please referred to, the preparation substrate S1 step and the sprayed metal layer S3 are walked It is further comprised the steps of: between rapid

Roughening treatment S2: roughening treatment S2 is carried out to the shielding area.

By carrying out roughening treatment S2 to the shielding area on substrate 11, the roughness of shielding area can be increased, be convenient for In spraying plating, the coat of metal 12 and the better structure of shielding area improve the binding force of the coat of metal 12 and shielding area.

Further, in the above-described embodiments, image controller auxiliary positioning is used in the roughening treatment S2 step, and The shielding area is roughened by laser carving mode.Shielding area is roughened using laser carving mode, it can be according to need It is roughened, is improved efficiency, and can well controls roughening position.And image controller auxiliary positioning is used, Ke Yigeng Adequately determine laser carving position.

Certainly, in some embodiments, it is also possible to be roughened using other way to the shielding area on substrate 11, such as Directly polished using coarse sandpaper, handled using the grinding wheel of coarse grain etc..

Further, in the above-described embodiments, the width W range of laser carving formation wire casing 111 is on the shielding area 0.02-0.05mm, distance L range is 0.02-0.05mm between adjacent two wire casing 111, and the 111 depth H range of wire casing is 0.01-0.03mm.Distance is arranged between 0.02-0.05mm, adjacent two wire casing 111 in the 111 width W range of wire casing of laser carving L range is 0.02-0.05mm, i.e., line range is set as 0.02-0.05mm.The thick of shielding area on substrate 11 can be increased Rugosity so as in conjunction with metalling particle, and facilitates processing and fabricating.Make 111 depth H range 0.01-0.03mm of wire casing, Metallic particles can be made to facilitate filling wire casing 111, and be plated on shielding area, be convenient for spraying plating, improve efficiency, avoid to substrate 11 It generates compared with macrolesion.

In one embodiment, Fig. 5 and Fig. 6 are please referred to, is further comprised the steps of: after the sprayed metal layer S3 step

Sanding and polishing S4: carrying out sanding and polishing S4 processing to the coat of metal 12, keeps 12 surface of the coat of metal flat It is whole bright and clean.

Sanding and polishing S4 is carried out to sprayed metal coating 12, can preferably avoid adhering to impurity on the coat of metal 12, Also, when in use, it is also possible to prevent the damage electronic device of the burr on the coat of metal 12.

In one embodiment, Fig. 7 and Fig. 8 are please referred to, after above-mentioned sanding and polishing S4 step, is further comprised the steps of:

It coats protective coating S5: coating insulating protective layer 13 on 12 surface of the coat of metal.

Insulating protective layer 13 is set on the coat of metal 12, it can the protection coat of metal 12 can also be kept away when in use Exempt from the coat of metal 12 to contact with electronic device.And after sanding and polishing S4 step, coating protective coating S5 step is carried out, it can So that insulating protective layer 13 is more evenly covered on the coat of metal 12, and insulating protective layer 13 can be made relatively thin.

Further, in the above-described embodiments, the insulating protective layer 13 is insulating resin layer, is coated in metal to facilitate On coating 12, and the thickness of insulating protective layer 13 can be well controlled, insulating protective layer 13 is arranged relatively thin.At some other In embodiment, insulating protective layer 13 can be ceramic coating or insulating oil paint layer.Preferably, insulating resin layer can use propylene Acid resin.

In one embodiment, Fig. 9 and Figure 10 are please referred to, is further comprised the steps of: after the sprayed metal layer S3 step

It coats protective coating S5: coating insulating protective layer 13 on 12 surface of the coat of metal.

Insulating protective layer 13 is set on the coat of metal 12, it can the protection coat of metal 12 can also be kept away when in use Exempt from the coat of metal 12 to contact with electronic device.In addition, directly carrying out coating protective coating S5 step after sprayed metal layer S3 step Suddenly, it is not necessarily to above-mentioned sanding and polishing S4 step, it is possible to reduce process improves efficiency.

In one embodiment, Figure 11 and Figure 12 are please referred to, sprayed metal layer can be carried out after preparing substrate S1 step Then S3 step carries out coating protective coating S5 step again, is not necessarily to above-mentioned roughening treatment S2 step and sanding and polishing S4 step, work Sequence is simple, high-efficient.

In one embodiment, Figure 13 and Figure 14 are please referred to, sprayed metal layer can be carried out after preparing substrate S1 step Then S3 step carries out sanding and polishing S4 step again, obtain anti-electromagnetic interference matrix and improved efficiency with reducing process.

In one embodiment, Figure 15 and Figure 16 are please referred to, sprayed metal layer can be carried out after preparing substrate S1 step Then S3 step carries out sanding and polishing S4 step again, then carry out coating protective coating S5 step, obtains anti-electromagnetic interference matrix.

The anti-electromagnetic interference matrix preparation method of the embodiment of the present application can spray on the complicated, substrate 11 with spine Plating metal coating 12, and waste of material can be reduced with region metalling coating 12, it is high-efficient, automation batch may be implemented Amount production.

The embodiment of the present application also provides a kind of anti-electromagnetic interference matrix.The anti-electromagnetic interference matrix uses above-mentioned any implementation The anti-electromagnetic interference matrix preparation method production of example.The anti-electromagnetic interference matrix can provide good electromagnetic shielding action, and And cost can be reduced, it is suitble to automatic batch production.

The anti-electromagnetic interference matrix can be applied in the terminal, as the anti-electromagnetic interference matrix can be smart phone Middle frame structure, to prevent the electromagnetic interference to the screen of smart phone.Certainly, in some embodiments, the anti-electromagnetic interference base Body can be the dorsal shield of mobile phone, to carry out electromagnetic shielding protection to electronic device special on mobile phone, such as inductance.Certainly, this is anti- Electromagnetic interference matrix can also be applied in the electronic equipments such as transformer, power device, filter.

The embodiment of the present application also provides a kind of electronic equipment, which includes that anti-electromagnetism described in embodiment as above is dry Disturb matrix.The electronic equipment has used above-mentioned anti-electromagnetic interference matrix, it can to the device for needing to be electromagnetically shielded in electronic equipment Part carries out shielding protection, and can reduce cost, conveniently manufactures.

The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within mind and principle.