CN111520794A - Heat recovery heating system - Google Patents
- ️Tue Aug 11 2020
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, operations, and/or components, but do not preclude the presence or addition of one or more other features, operations, or components.
All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.
Where a convention analogous to "at least one of A, B and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a device having at least one of A, B and C" would include but not be limited to devices having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a convention analogous to "A, B or at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a device having at least one of A, B or C" would include but not be limited to devices having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).
An embodiment of the present disclosure provides a heat recovery heating system, for recovering indoor heat and using the recovered heat for heating, including a heat source subsystem and a heating subsystem, wherein: the heat source subsystem includes: the cooling unit comprises a heat recovery device, wherein the heat recovery device is used for cooling the indoor air by using cooling fluid and acquiring heat in the air; the heat pump unit is used for outputting heat supply fluid with a preset temperature by utilizing the heat acquired by the cooling fluid; the heating subsystem is capable of providing heat using at least the heating fluid at the predetermined temperature.
According to the heat recovery and supply system disclosed by the embodiment of the disclosure, indoor air is circularly cooled through the cooling unit, and the heat recovery device is additionally arranged in the cooling unit. In this way, not only can the air be cooled, but also the waste heat in the data center room can be recovered, the absorbed low-grade energy (low-grade energy) is converted into high-grade energy (high-grade energy) by using a heat pump, and then the high-grade energy is used for heating, wherein the grade of the energy refers to the percentage of the energy containing useful components, and the higher the percentage of the useful components is, the higher the grade is, in the embodiment of the disclosure, the waste heat in the indoor air is lower in temperature, less in energy and not easy to be directly used, and is called as low-grade energy; the heat supply fluid obtained by the heat pump has higher temperature and higher energy, is easy to be utilized and is called high-grade energy. The heat recovery heating system of the embodiment of the disclosure realizes a high-efficiency data center waste heat recovery heating technology, improves the energy utilization efficiency, and reduces the pollution of the traditional heating mode to the environment.
Fig. 1 schematically shows an exemplary application scenario in which a heat recovery heating system may be applied according to an embodiment of the present disclosure. It should be noted that fig. 1 is only an example of an application scenario in which the embodiments of the present disclosure may be applied to help those skilled in the art understand the technical content of the present disclosure, but does not mean that the embodiments of the present disclosure may not be applied to other devices, systems, environments or scenarios.
As shown in fig. 1, the heat recovery heating system according to the embodiment of the present disclosure may be used to recover waste heat in a building such as a
data center110 and use the recovered heat for heating of a surrounding
building120, a
building130, and the like. Further, the heat recovery heating system of the embodiment of the present disclosure may be applied to any indoor space such as a building or a room provided with equipment that continuously generates heat during operation, for example, a data center, a machine room, or a high-temperature production plant.
In the operation process of the data center, a large amount of heat generated by IT equipment is dissipated to the outdoor environment through a cooling system, and in high-altitude areas with low temperature throughout the year, auxiliary buildings such as offices, operation and maintenance and dormitories and peripheral civil buildings matched with the data center need a large amount of heat to meet the requirement of heat supply in winter. At present, a large amount of non-renewable energy sources such as coal, natural gas and the like are generally consumed for heating by using boiler combustion, and a large amount of emissions such as dust, acid gas and the like generated by combustion cause serious pollution to the environment. The heat recovery and supply system provided by the embodiment of the present disclosure recovers waste heat in the
data center110, and supplies heat to surrounding rooms or buildings by using the recovered waste heat, where the surrounding rooms or buildings include other rooms in the building where the data center is located, and also include other buildings surrounding the building where the data center is located, and may be connected to a heat supply station to supply heat to buildings located far away. Therefore, the energy utilization efficiency can be improved, and the environmental pollution caused by heating in winter can be effectively reduced.
The embodiment of the disclosure provides a heat recovery heating system, which is used for recovering indoor heat and using the recovered heat for heating.
Fig. 2 schematically shows a structural composition diagram of a heat recovery heating system according to an embodiment of the present disclosure.
As shown in fig. 2, the heat recovery heating system includes a
heat source subsystem200 and a
heating subsystem300. Wherein: the
heat source subsystem200 includes a
cooling unit210 and a
heat pump unit220. The
cooling unit210 is provided with a
heat recovery device211 inside, and the
heat recovery device211 is used for cooling the air in the
data center110 by using a cooling fluid and obtaining heat in the air; the
heat pump unit220 is configured to obtain a heating fluid at a predetermined temperature by using heat obtained from the cooling fluid and output the heating fluid; the
heating subsystem300 is configured to provide heat using at least a heating fluid at a predetermined temperature.
According to the embodiment of the present disclosure, the
heat recovery device211 may be, for example, a heat recovery coil, the heat recovery coil is connected to the
heat pump unit220, and water supply and return interfaces of the heat recovery coil are respectively connected to the water supply and
return pipes402 and 401 on the heat source side of the heat pump. The connection pipeline is also provided with a circulating
water pump501, and the circulating
water pump501 can be specifically arranged on the heat source side
water return pipeline401 of the heat pump unit. Under the action of the circulating
water pump501, the cooling circulating water with a low temperature delivered from the
heat source side221 of the
heat pump unit220 can be circulated to the heat recovery coil through the heat source side
water supply line402 of the heat pump unit. The heat recovery coil pipe cools all or part of the air in the machine room by using the cooling circulating water and absorbs the waste heat in the air, and the heat circulating water with higher temperature after absorbing the heat returns to the
heat source side221 of the
heat pump unit220 through the heat source side
water return pipeline401. The
heat pump unit220 performs work to utilize the heat carried by the thermal circulation water, and the heat is transferred to the heating fluid (for example, water) of the heat pump
unit heating side222, so as to obtain the heating fluid (for example, hot water with a temperature of 80 ℃) at a predetermined temperature on the
heating side222.
The
heat supply side222 of the heat pump unit is connected to the
heat supply subsystem300 through a heat pump unit heat supply side
water supply pipeline403 and a heat pump unit heat supply side
water return pipeline404. A circulating
water pump502 is arranged on the connecting pipeline, and the circulating
water pump502 is specifically arranged on the heat supply side
water return pipeline404 of the heat pump unit. Under the action of the circulating
water pump502, the heating fluid with the predetermined temperature obtained from the
heating side222 of the
heat pump unit220 can be circulated to the
heating subsystem300 through the heat pump unit hot side
water supply pipeline403. The
heating subsystem300 provides heat to the
end user120 using heat carried by the heating fluid, which is delivered back to the
heating side222 of the heat pump assembly after releasing the heat.
The water supply temperature of the
heat source side221 of the heat pump unit can be 16 ℃, and the water return temperature can be 21 ℃ so as to ensure that the air supply temperature of the heat pump unit reaches 25 ℃; the water supply temperature of the heat pump unit
heat supply side222 can be 80 ℃, and the water return temperature can be 40 ℃.
Fig. 3 schematically illustrates an application scenario diagram of a heat source subsystem according to an embodiment of the present disclosure.
As shown in fig. 3, a plurality of
cabinets111 and supporting facilities are provided in the
data center110, and after the data machine room is put into operation, the indoor hot return air temperature can be maintained at 35 to 37 ℃, which is a condition for long-term stable heat source. The indoor air of the
data center110 is circulated by using a circulating fan, a
cooling unit210 is arranged on the air circulating loop, and a return
air heat channel112, a hot
return air ceiling113, an air supply
static pressure box114, an air
supply cold channel115 and a heat
recovery equipment room116 are arranged in the data center. The heat dissipated by the
cabinet111 enters the
cooling unit210 through the return
air heat channel112 and the hot
return air ceiling113 along with the circulating air, and is cooled by the cooling effect of the
heat recovery device211 in the
cooling unit210 to obtain the cooled circulating air, and meanwhile, the
heat recovery device211 absorbs the heat carried in the air. The cooled circulating air is delivered to the
cabinet111 through the
blast plenum box114 and the
blast cooling duct115 to cool the
cabinet111. The air supply temperature of the
cooling unit210 may reach 25 ℃ or lower. The heat absorbed by the
heat recovery device211 is circulated and transferred to the
heat source side221 of the
heat pump unit220 through the heat pump heat source side supply and return
pipes402 and 401.
One or
more cooling units210 may be provided for one
data center110, and one or
more cooling units210 may be provided for one
heat pump unit220. In the embodiment of the present disclosure, the
data center110 is provided with not less than two cooling
units210, and the waste heat recovered by the not less than two cooling
units210 is transmitted to one
heat pump unit220.
According to the embodiment of the disclosure, indoor air of the data center is circularly cooled through the cooling unit, and the heat recovery device is additionally arranged in the cooling unit, so that the existing cooling unit arranged in the data center is simply improved, that is, waste heat in the data center can be recovered, the absorbed low-grade heat energy is converted into high-grade heat energy by the heat pump, and then the high-grade heat energy is utilized to realize heating. The high-efficiency data center waste heat recovery heating technology is realized, the energy utilization efficiency is improved, and the pollution of the traditional heating mode to the environment is reduced.
Fig. 4 schematically shows a structural composition diagram of a cooling unit according to an embodiment of the present disclosure.
As shown in fig. 4, according to an embodiment of the present disclosure, the
cooling unit210 includes an indoor-side circulation fan 212 and a
cooling device213 in addition to the
heat recovery device211 shown in, for example, fig. 2 and 3. As will be understood by those skilled in the art, since the
heat recovery device211 also has a cooling function, the
cooling device213 will be hereinafter referred to as "
second cooling device213" for the sake of distinction from the
heat recovery device211.
The
heat recovery device211, the indoor-side circulation fan 212, and the
second cooling device213 are provided in this order in the direction from the indoor return air side to the air supply side of the
cooling unit210. According to the embodiment of the present disclosure, in the first condition, the
heat recovery device211 and the circulation fan 212 are turned on, and the indoor air is cooled and heat recovered by the
heat recovery device211; in the second condition, the circulation fan 212 and the
second cooling device213 are turned on, and the indoor air is cooled by the
second cooling device213. Wherein the first condition includes being in a predetermined heating time period or the outdoor temperature being lower than a predetermined temperature, and the second condition includes being in a predetermined non-heating time period or the outdoor temperature being not lower than the predetermined temperature.
For example, a circulator blower may be disposed within the
cooling unit210 for circulating air within the data center compartment. The side of the
cooling unit210 receiving the high temperature air is the return air side, and the side discharged after cooling is the supply air side. The
heat recovery device211 may be disposed at an indoor air return side in the cooling unit, and the
heat recovery device211, the circulation fan 212, and the
second cooling device213 may be disposed in order from the return air side to the supply air side.
Under the condition that the temperature is lower in winter, a heating mode is started, the heat recovery working condition is adopted for operation, meanwhile, the
heat recovery device211, the circulating fan 212, the
heat pump unit220 and the circulating water pumps 501 and 502 are operated, indoor air is cooled and heat recovered by the
heat recovery device211 and the
heat pump unit220, and recovered waste heat is used for heating.
Under the condition that the temperature is higher in non-winter, the
second cooling device213 and the circulating fan 212 operate, the
heat recovery device211, the
heat pump unit220 and the circulating water pumps 501 and 502 are turned off, and the indoor air is cooled by the
second cooling device213.
According to an embodiment of the present disclosure, in a case where heat supply is required in winter, the heat recovery heating system cools and recovers heat from indoor air using the heat recovery device. And under the condition that heat supply is not needed in winter, the heat recovery device and the heat pump are turned off, and the heat recovery heat supply system utilizes the second cooling device to cool the indoor air. Therefore, different operation modes can be switched according to actual conditions, the operation is simple, and the adaptability to the environment is good.
According to an embodiment of the present disclosure, the
cooling unit210 may be, for example, an indirect evaporative cooling unit. In a high-altitude area with low ambient temperature all the year round, the indirect evaporative cooling unit can greatly reduce the energy consumption of the data center air conditioning system. The application prospect is wide at present. The heat recovery heating system provided by the embodiment of the disclosure can recover and supply heat to the waste heat of the data center based on the indirect evaporative cooling unit, namely, the heat recovery device is additionally arranged in the indirect evaporative cooling unit, so that the overall operation energy consumption of the data center can be further reduced.
The
second cooling device213 includes an air-to-
air heat exchanger2131 for cooling the indoor air with the outdoor air. The
second cooling device213 may further include an outdoor
side exhaust fan2132 and an outdoor side
air inlet grille2133, under the action of the outdoor
side exhaust fan2132, indoor circulating air in the data center enters the air-to-
air heat exchanger2131 through the outdoor side
air inlet grille2133, and indoor side air exchanges heat with outdoor side air in the air-to-
air heat exchanger2131 to cool indoor side air (to reach an indoor side air supply temperature of 25 ℃).
The
cooling unit210 may also include a
supplemental cooling device214. When the outdoor environment temperature is relatively high and the heat exchange capability of the
second cooling device213 is insufficient, for example, the heat exchange capability of the
second cooling device213 cannot guarantee that the indoor supply air temperature reaches 25 ℃, the
supplementary cooling device214 may be turned on to perform supplementary cooling on the indoor air to ensure that the supply air temperature reaches 25 ℃, and the
supplementary cooling device214 may be a DX (mechanical refrigeration) cooling coil, for example.
Fig. 5 schematically shows a structural composition diagram of a heat recovery heating system according to another embodiment of the present disclosure.
As shown in fig. 5, according to an embodiment of the present disclosure, the
heating subsystem300 includes a
heating station310 and a
heat exchange station320. The
heat supply station310 at least collects the heat supply fluid delivered by the plurality of
heat pump units220 and distributes the heat supply fluid to the
heat exchange station320. The
heat exchange station320 obtains a terminal circulating fluid of a predetermined temperature using the heating fluid delivered from the
heating station310 and delivers the terminal circulating fluid to the
corresponding end user120 for heating.
According to the embodiment of the present disclosure, one or more
heat pump units220 and one or more
heat exchange stations320 may be provided for each
heat supply station310.
For example, the
heating plant310 may be deployed within a data center campus. The
heating plant310 may be adapted with a number of
heat source subsystems200 to utilize a plurality of
heat source subsystems200 to deliver heat sources to the
heating plant310. Meanwhile, the
heating plant310 may be adapted with a plurality of user
heat exchange stations320 to supply heat to a plurality of
end users120.
The
heat source subsystem200 is responsible for waste heat recovery in the data center as part of the heat source for the heating system.
The
heat supply station310 is responsible for collecting heat from the
heat source subsystems200, and the
heat supply station310 is connected to the
heat pump units220 to collect heat and distribute heat (e.g., heat carried by hot water) to the user
heat exchange stations320 according to load demands and operation of the environmental control system.
The
heat exchange station320 is a control distribution part of the heating system and is responsible for producing end circulation fluid (for example, hot water with a temperature of 60 ℃ or 75 ℃) with different temperatures according to the actual demand of the
end user120, and the
end user120 is a heat consumption part of the heating system. The
heat exchange station320 is provided with a
heat exchanger321, primary side water supply and return
pipes431 and 432 of the
heat exchanger321 are connected to the
heat supply station310, and secondary side water supply and return
pipes433 and 434 of the
heat exchanger321 are connected to the
end user120. The heat supply fluid of the predetermined temperature collected by the
heat supply station310 enters one side of the
heat exchanger321 through the primary
water supply pipeline431 of the
heat exchanger321, the
heat exchange station320 exchanges heat with the heat supply fluid of the one side to obtain the terminal circulation fluid of the predetermined temperature of the other side, and the terminal circulation fluid is delivered to the
corresponding end user120 through the secondary
water supply pipeline433 for supplying heat.
The primary-side water supply/
return pipe431 is provided with a three-
way valve621. The opening of the electric three-
way valve621 can be controlled according to the load demand of the end heat user to adjust the water supply amount entering the
heat exchanger321. The surplus water supply is directly returned to the primary
water return line432 of the heat exchanger through the
bypass line435, thereby adjusting the heating output of the
heating plant310.
According to an embodiment of the present disclosure, the
heat source subsystem200 may be connected to a
heat supply station310, which applies heat to a building located at a relatively long distance, and a heat exchange station, which may produce hot water at different temperatures for delivery to the
end heat consumer120 according to the actual demand of the end heat consumer.
Fig. 6 schematically shows a structural composition schematic diagram of a heating plant according to an embodiment of the present disclosure.
As shown in fig. 6, according to an embodiment of the present disclosure, the
heat supply station310 may include a heat supply station
heat source device311 for being turned on in case the
heat source subsystem200 fails to supply heat or is insufficient in heat supply capacity, to supply heat to the
heat exchange station320 as a backup heat source. The heat supply plant
heat source device311 may be, for example, an electric boiler, and supplies heat as a backup heat source. As will be understood by those skilled in the art, since the
heat source subsystems200 each also have the function of a heat source, the heat supply station
heat source device311 will be hereinafter referred to as "second
heat source device311" for the sake of distinction from the
heat source subsystem200.
According to the embodiment of the present disclosure, the heat supply station may further include a
heat storage device312, configured to store heat by using the
heat pump unit220 or the second
heat source device311 during the period of low-ebb power supply of the power grid, and provide heat to the
heat exchange station320 during the period of peak power supply of the power grid. The
heat storage device312 may be, for example, a heat storage tank that stores hot water to regulate the operation of the heating system.
The
heating plant310 may also include a circulating water pump (511/512) and an electrically operated valve (611-.
According to embodiments of the present disclosure, the heat recovery heating system may be provided with the following operation modes:
A. the heat pump unit is in an independent heat supply mode;
B. a second heat source device independent heating mode;
C. the heat storage equipment is in an independent heat supply mode;
D. a thermal storage device thermal storage mode.
Wherein: in the heat pump unit heat supply mode, the
heat pump unit220 is used alone to supply heat to the
heat exchange station320; in the second heat-source device heat supply mode, the second heat-
source device311 is solely used to supply heat to the
heat exchange station320; in the thermal storage device heating mode, the
thermal storage device312 is utilized alone to provide heat to the
heat exchange station320; in the thermal storage device heat storage mode, the
heat pump unit220 or the second
heat source device311 supplies a part of the heat to the
heat exchange station320, and the other part of the heat is supplied to the
thermal storage device312, so that the
thermal storage device312 stores the heat.
Fig. 7 schematically shows a supply and return water flow path in an independent heating mode of a heat pump unit according to an embodiment of the disclosure.
As shown in fig. 7, in the heat pump unit independent heating mode, the fluid flow path in the
heating station310 is shown by the thick line in the heating station. In this case, the
heat supply station310 may collect a plurality of
heat pump units220 and then directly deliver the hot water to the
heat exchange station320.
When the
data center110 is in a stable service operation, the
heat pump unit220 can operate the heat pump unit independent heating mode a under the condition that a stable heat source can be provided. In the operation mode, the
cooling unit210 and the
heat pump unit220 in the data center are started to work, the heat pump unit heat source circulating
water pump501 and the heat supply circulating
water pump502 are operated, the
electric valve611 is opened, other electric valves are cut off, and the heat pump unit heat supply and return
water pipes403, 411 and 404 and the heat supply pipe network heat supply and return water
main pipes417 and 418 conveyed to the user
heat exchange station320 are connected.
Under the independent heat supply mode of heat pump set, the water supply route in the heat supply station is: the hot water output by the heat pump unit passes through the heat supply side
water supply pipelines403 and 411 of the heat pump unit, is connected to the water supply main 417, and then enters the
heat exchange station320. The hot water becomes cold water after heat is dissipated in the
heat exchange station320 through heat exchange, the heat exchange station conveys the heat
recovery pump unit220, and a return water path in the heat supply station is as follows: the cold water output by the heat exchange station returns to the
heat pump unit220 through the
water return header418 and the heat pump unit hot side
water return pipe404. The cold water is only low in temperature relative to the hot water before the heat exchanger, and does not mean water with a very low temperature.
Fig. 8 schematically illustrates a supply and return water flow path diagram of a second heat source apparatus independent heating mode according to an embodiment of the present disclosure.
As shown in fig. 8, when the
data center110 is in the initial operation of the service, and the
heat pump unit220 cannot provide a stable heat source or the
heat pump unit220 is in the maintenance failure condition, the second heat source device independent heating mode B may be turned on. In the second heat source equipment independent heating mode, the fluid flow path in the heating station is as shown by the thick line in the heating station. In the operation mode, the
cooling unit210, the
heat pump unit220, the heat pump unit heat source circulating
water pump501 and the heat supply circulating
water pump502 in the data center stop operating, the second
heat source equipment311 and the second heat source equipment heat supply circulating water pump 511 start operating, the
electric valves613 and 616 are opened, other electric valves are cut off, the second heat source equipment water supply and return pipelines (413, 415/414 and 416) are respectively communicated with the heat supply and return pipe network water supply and return
main pipes417 and 418, and the second
heat source equipment311 independently supplies heat to the user
heat exchange station320.
Under the independent heat supply mode of second heat source equipment, the water supply route in the heat supply station is: the hot water output from the second
heat source device311 passes through the second heat source device
water supply pipes413 and 415, is introduced into the
water supply manifold417, and then enters the
heat exchange station320 through the
water supply manifold417. The return water path in the heat supply station is as follows: cold water output from
heat exchange station320 is returned to second heat-
source device311 via
water return manifold418 and second heat-source device
water return lines416 and 414.
FIG. 9 schematically illustrates a supply and return water flow path for an independent heating mode of a thermal storage device according to an embodiment of the disclosure.
As shown in fig. 9, when the user
heat exchange station320 is under a condition of a small heat load or a power grid is in a peak power supply period, the heat storage device independent heating mode C is turned on. In the heat storage device independent heating mode, the fluid flow path in the heating station is as shown by the thick lines in the heating station. In the operation mode, the
cooling unit210, the
heat pump unit220, the heat pump unit heat source circulating
water pump501, the heat supply circulating
water pump502, the second
heat source equipment311 and the second heat source equipment heat supply circulating water pump 511 stop operating, the heat storage equipment heat supply circulating
water pump512 starts operating, the
electric valve617 is opened, other electric valves are cut off, the heat storage equipment heat supply and return
water pipes419 and 420 at the heat supply side are communicated with the heat supply and return water
main pipes417 and 418 of the heat supply pipe network, and the
heat storage equipment312 independently supplies heat to the user
heat exchange station320.
Under the independent heat supply mode of heat accumulation equipment, the water supply route in the heat supply station is: hot water output from the
thermal storage device312 enters the
heat exchange station320 through the thermal storage device heating-side
water supply pipe419 and the
water supply header417. The return water path is as follows: cold water output by the heat exchange station is returned to the
thermal storage device312 via a
water return manifold418 and a thermal storage device heat supply side
water return line420.
When the power supply is in the valley power supply period of the power grid, the heat storage mode D of the heat storage equipment can be started, and the operation mode can be started under the independent heat supply working condition of the heat pump unit or the independent heat supply working condition of the second heat source equipment.
FIG. 10 schematically illustrates a supply and return water flow path schematic of a thermal storage device in a thermal storage mode according to an embodiment of the disclosure.
As shown in fig. 10, if the heat storage mode of the heat storage device is started under the independent heat supply condition of the heat pump unit, the devices, the water pump and the valves in the independent heat supply mode of the original heat pump unit are all kept in the original state, and then the
electric valves612, 614, 615 and 616 are opened. A part of hot water in a hot water supply side
water supply pipe403 of the heat pump unit is connected to a water supply main 417 through a
pipeline411 to supply heat to the
heat exchange station320; another portion of the hot water is supplied to the thermal storage device through a portion of the piping 412 and the
piping413. The heat storage device return water is connected to a heat supply pipe network
return water header418 through a part of pipelines of the
pipeline414 and the
pipeline416, so that heat storage of the
heat storage device312 by the
heat pump unit220 and heat supply of the heat exchange station are realized.
FIG. 11 schematically illustrates a supply and return water flow path schematic of a thermal storage device in a thermal storage mode according to another embodiment of the disclosure.
As shown in fig. 11, if the heat storage mode of the heat storage device is turned on under the independent heat supply condition of the second heat source device, the water pump and the valve under the independent heat supply condition of the original second heat source device are all kept in the original state, and then the electrically operated
valves614 and 615 are opened. A part of the hot water in the second heat source equipment
water supply pipe413 is connected to a
water supply header417 through a
pipe415; the other part supplies water to the
thermal storage device312. The return water of the heat storage tank is connected to a
return water pipe414 of the second heat source device, so that the second heat source device can store heat in the heat storage and
storage device312 and supply heat to the heat exchange station.
As shown in fig. 6 to 11, according to an embodiment of the present disclosure, the heat recovery heating system further includes a pipe network, the pipe network including: the system comprises heat pump unit heat source side water supply and return
pipelines402 and 401, heat pump unit heat source side water supply and return
pipelines403 and 411, second heat source equipment water supply and return
pipelines413 and 414, heat storage equipment heat supply and return
pipelines419 and 420, water supply and return
main pipelines417 and 418, heat exchange station primary side water supply and return
pipelines431 and 432, and heat exchange station secondary side water supply and return
pipelines433 and 434.
The heat pump unit heat source side water supply and return
pipes402 and 401 connect the
cooling unit210 and the
heat pump unit220.
The heat pump unit heat supply and water supply and return
pipelines403, 411 and 404 are connected with the
heat pump unit220 and the water supply and return
main pipelines417 and 418, and are connected with the
heat pump unit220 and the
heat storage equipment312.
The second heat source equipment water supply and return
pipes413 and 414 and 416 are connected with the second
heat source equipment311 and the water supply and return
main pipes417 and 418, and are connected with the second
heat source equipment311 and the
heat storage equipment312.
Heat storage device hot and hot side water supply and return
pipes419 and 420 connect the
heat storage device312 and water supply and return
manifolds417 and 418.
The water supply and return
main pipelines417 and 418 are connected with primary side water supply and return
pipelines431 and 432 of the heat exchange station; secondary side water supply and return
conduits433 and 434 of the heat exchange station connect the
heat exchange station320 with end users.
According to the embodiment of the disclosure, the temperature of the supply water at the heat source side of the heat pump unit is 16 ℃, and the temperature of the return water is 21 ℃; the temperature of the water supply at the heat supply side of the heat pump unit is 80 ℃, and the temperature of the return water is 40 ℃; the water supply temperature of the second heat source equipment is 80 ℃, and the return water temperature is 40 ℃; the temperature of the water supply at the heat supply side of the heat storage equipment is 80 ℃, and the temperature of the return water is 40 ℃.
Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.