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CN112201760B - Display device and method for manufacturing the same - Google Patents

  • ️Fri Dec 03 2021

CN112201760B - Display device and method for manufacturing the same - Google Patents

Display device and method for manufacturing the same Download PDF

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Publication number
CN112201760B
CN112201760B CN202010928332.1A CN202010928332A CN112201760B CN 112201760 B CN112201760 B CN 112201760B CN 202010928332 A CN202010928332 A CN 202010928332A CN 112201760 B CN112201760 B CN 112201760B Authority
CN
China
Prior art keywords
groove
layer
flexible substrate
display device
organic
Prior art date
2020-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010928332.1A
Other languages
Chinese (zh)
Other versions
CN112201760A (en
Inventor
黄静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
2020-09-07
Filing date
2020-09-07
Publication date
2021-12-03
2020-09-07 Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
2020-09-07 Priority to CN202010928332.1A priority Critical patent/CN112201760B/en
2020-10-27 Priority to PCT/CN2020/124063 priority patent/WO2022047955A1/en
2021-01-08 Publication of CN112201760A publication Critical patent/CN112201760A/en
2021-12-03 Application granted granted Critical
2021-12-03 Publication of CN112201760B publication Critical patent/CN112201760B/en
Status Active legal-status Critical Current
2040-09-07 Anticipated expiration legal-status Critical

Links

  • 238000004519 manufacturing process Methods 0.000 title claims description 14
  • 238000000034 method Methods 0.000 title description 15
  • 239000010410 layer Substances 0.000 claims abstract description 89
  • 239000000758 substrate Substances 0.000 claims abstract description 64
  • 239000012044 organic layer Substances 0.000 claims abstract description 54
  • 230000002209 hydrophobic effect Effects 0.000 claims description 22
  • 239000011248 coating agent Substances 0.000 claims description 16
  • 238000000576 coating method Methods 0.000 claims description 16
  • 238000005538 encapsulation Methods 0.000 claims description 15
  • 239000010409 thin film Substances 0.000 claims description 15
  • 230000002093 peripheral effect Effects 0.000 claims description 13
  • 230000004888 barrier function Effects 0.000 claims description 12
  • 238000001035 drying Methods 0.000 claims description 2
  • 239000002346 layers by function Substances 0.000 claims description 2
  • 238000009832 plasma treatment Methods 0.000 claims description 2
  • 239000010408 film Substances 0.000 description 14
  • 238000007641 inkjet printing Methods 0.000 description 8
  • QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
  • 239000000463 material Substances 0.000 description 7
  • 229910052760 oxygen Inorganic materials 0.000 description 7
  • 239000001301 oxygen Substances 0.000 description 7
  • XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
  • 239000000243 solution Substances 0.000 description 6
  • 239000004642 Polyimide Substances 0.000 description 4
  • 239000003822 epoxy resin Substances 0.000 description 4
  • 229920000647 polyepoxide Polymers 0.000 description 4
  • 229920000139 polyethylene terephthalate Polymers 0.000 description 4
  • 239000005020 polyethylene terephthalate Substances 0.000 description 4
  • 229920001721 polyimide Polymers 0.000 description 4
  • -1 polyethylene terephthalate Polymers 0.000 description 3
  • 239000004925 Acrylic resin Substances 0.000 description 2
  • 239000004697 Polyetherimide Substances 0.000 description 2
  • 239000004698 Polyethylene Substances 0.000 description 2
  • XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
  • 239000000084 colloidal system Substances 0.000 description 2
  • 238000004891 communication Methods 0.000 description 2
  • 238000011049 filling Methods 0.000 description 2
  • 239000011521 glass Substances 0.000 description 2
  • 239000003999 initiator Substances 0.000 description 2
  • 238000002347 injection Methods 0.000 description 2
  • 239000007924 injection Substances 0.000 description 2
  • 238000004806 packaging method and process Methods 0.000 description 2
  • 229920001230 polyarylate Polymers 0.000 description 2
  • 229920000515 polycarbonate Polymers 0.000 description 2
  • 239000004417 polycarbonate Substances 0.000 description 2
  • 229920001601 polyetherimide Polymers 0.000 description 2
  • 229920000573 polyethylene Polymers 0.000 description 2
  • 239000002356 single layer Substances 0.000 description 2
  • 229920000178 Acrylic resin Polymers 0.000 description 1
  • 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
  • 229910052581 Si3N4 Inorganic materials 0.000 description 1
  • VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
  • XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
  • GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
  • 239000002253 acid Substances 0.000 description 1
  • PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
  • 238000005452 bending Methods 0.000 description 1
  • 230000000903 blocking effect Effects 0.000 description 1
  • 239000011247 coating layer Substances 0.000 description 1
  • 150000001875 compounds Chemical class 0.000 description 1
  • 238000001312 dry etching Methods 0.000 description 1
  • 150000002148 esters Chemical class 0.000 description 1
  • 230000005525 hole transport Effects 0.000 description 1
  • 230000005660 hydrophilic surface Effects 0.000 description 1
  • 230000005661 hydrophobic surface Effects 0.000 description 1
  • 229910010272 inorganic material Inorganic materials 0.000 description 1
  • 239000011147 inorganic material Substances 0.000 description 1
  • 238000003698 laser cutting Methods 0.000 description 1
  • 229910052751 metal Inorganic materials 0.000 description 1
  • 239000002184 metal Substances 0.000 description 1
  • 239000000203 mixture Substances 0.000 description 1
  • 239000011368 organic material Substances 0.000 description 1
  • RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
  • 238000002161 passivation Methods 0.000 description 1
  • 238000000059 patterning Methods 0.000 description 1
  • 229920000058 polyacrylate Polymers 0.000 description 1
  • 239000011112 polyethylene naphthalate Substances 0.000 description 1
  • 239000011347 resin Substances 0.000 description 1
  • 229920005989 resin Polymers 0.000 description 1
  • 229910052710 silicon Inorganic materials 0.000 description 1
  • 239000010703 silicon Substances 0.000 description 1
  • HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
  • 229910010271 silicon carbide Inorganic materials 0.000 description 1
  • HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
  • 229910052814 silicon oxide Inorganic materials 0.000 description 1
  • OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
  • 238000001039 wet etching Methods 0.000 description 1
  • 239000011787 zinc oxide Substances 0.000 description 1
  • 229910001928 zirconium oxide Inorganic materials 0.000 description 1

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides a display device, it includes: the flexible substrate is provided with a groove which is undercut; the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove; an organic layer covers the inner side wall of the groove.

Description

Display device and method for manufacturing the same

Technical Field

The present disclosure relates to display devices, and particularly to a display device and a method for manufacturing the same.

Background

In the known oled display device, in order to block the water and oxygen intrusion, a special structure is formed at some positions of the display panel, so that the organic light emitting layer is not connected at the special position, and the thin film encapsulation structure is connected. One of the methods is to etch the display panel to form a cavity structure. However, the water oxygen barrier properties of inorganic films are directly related to the underlying film layer morphology. When an inorganic film of a thin film encapsulation structure is formed on the cavity structure, the inorganic film has the problems of film layer discontinuity and poor film quality due to an excessively large taper angle, for example, exceeding 80 degrees, and failure such as crack (crack) is easy to occur after a bending test.

Disclosure of Invention

In view of the above, the present disclosure is directed to a display device and a method for manufacturing the same, which can improve the water and oxygen barrier performance and the film quality of a thin film encapsulation structure.

The application provides a display device, it includes:

the flexible substrate is provided with a groove which is undercut; and

the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove;

an organic layer covers the inner side wall of the groove.

In one embodiment, the inner surface of the recess is formed by a first portion and a second portion, the organic layer being disposed on the second portion, the first portion being opposite to the hydrophilic property of the organic layer.

In one embodiment, the first portion is a plasma treated hydrophilic flexible substrate or a hydrophobic flexible substrate.

In one embodiment, the first portion includes a hydrophilic coating or a hydrophobic coating formed on the flexible substrate.

In one embodiment, the display device further comprises a thin film encapsulation layer covering the display functional layer, the thin film encapsulation layer comprising at least one inorganic layer, the inorganic layer covering the organic layer and the first portion.

In one embodiment, the flexible substrate includes a barrier layer and first and second flexible substrates disposed on both sides of the barrier layer,

the groove comprises a first groove arranged in the first flexible substrate and a second groove arranged in the second flexible substrate, the first groove is communicated with the second groove, and an organic layer covers the inner side wall of the first groove and the inner side wall of the second groove.

In one embodiment, the display device includes a display area, a photosensitive area, and a peripheral area, the display area surrounds the photosensitive area, the peripheral area is disposed between the display area and the photosensitive area, the photosensitive area is used for disposing a photosensitive element, and the groove is disposed in the peripheral area.

The present application also provides a method of manufacturing a display device, which includes the steps of:

providing a flexible substrate, and forming a groove in an undercut shape on the flexible substrate;

forming an organic layer on the inner side wall of the groove;

forming a display function layer on the flexible substrate, the display function layer including an organic light emitting layer, the organic light emitting layer being broken at the groove.

In one embodiment, the step of forming an organic layer on the inner sidewall of the groove comprises:

carrying out hydrophilic or hydrophobic treatment on the inner surface of the groove to form a first part and a second part with hydrophilicity or hydrophobicity, dripping organic ink with the hydrophilicity opposite to that of the first part into the groove, and drying the organic ink to form an organic layer on the second part.

In one embodiment, the step of forming the first and second portions having hydrophilicity or hydrophobicity by subjecting the inner surfaces of the grooves to a hydrophilic or hydrophobic treatment includes plasma treatment or coating the flexible substrate with a hydrophilic coating or a hydrophobic coating.

Compared with the prior art, the display device and the manufacturing method thereof provided by the application reduce the taper angle of the groove by arranging the organic layer in the undercut groove, so that the formed inorganic film layer is more continuous and compact and has good water and oxygen barrier property when the inorganic film layer of the film packaging layer is deposited in the groove subsequently.

Drawings

In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic plan view of a display device according to a first embodiment of the present application.

Fig. 2 is a partially enlarged schematic view of the display device in fig. 1.

Fig. 3 is a schematic cross-sectional view of the display device of fig. 1 along the line a-a.

Fig. 4 is a schematic cross-sectional view of a groove of a display device according to a second embodiment of the present disclosure.

Fig. 5(a) to 5(g) are schematic cross-sectional views illustrating a method for manufacturing a display device according to a third embodiment of the present application.

Detailed Description

The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being directly adjacent or may comprise the first and second features being not in direct contact but in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 to fig. 3, a

display device

100 according to an embodiment of the present disclosure includes a

display panel

10 and a

photosensitive element

20. The

display panel

10 is an organic light emitting diode display panel. The

light sensing element

20 includes, but is not limited to, a front camera, a face recognition sensor, a gesture sensor, and the like.

The

display device

100 may be divided into a

display area

100a, a

photosensitive area

100b, and a

peripheral area

100 c. The

display area

100a surrounds the

photosensitive area

100 b. The

peripheral area

100c is located between the

display area

100a and the

photosensitive area

100 b. In other words, the

peripheral area

100c surrounds the

photosensitive area

100b, and the

display area

100a surrounds the

peripheral area

100 c.

The

display area

100a is used for displaying an image. The

display region

100a is provided with a plurality of light-emitting pixels (not shown) and a drive circuit (not shown) for driving the plurality of light-emitting pixels to emit light.

The

photosensitive region

100b is used to dispose the

photosensitive element

20. The

light sensing region

100b may be formed by forming a through hole or a blind hole in the

display device

100 by laser cutting. In the present embodiment, the

photosensitive region

100b is formed of the through hole TH. The shape of the

photosensitive region

100b is not limited in the present application, and may be a circle, a square, a triangle, or other polygons.

The

peripheral region

100c is used for water and oxygen blocking between the

display region

100a and the

photosensitive region

100 b.

The

display panel

10 includes a

flexible substrate

11, a

display function layer

12 disposed on the

flexible substrate

11, and a thin

film encapsulation layer

13 covering the

display function layer

12.

The

flexible board

11 may be formed of a single-layer flexible substrate, or may be formed of two or more layers of flexible substrates. The material of the flexible substrate is selected from one or more of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI) and Polyethersulfone (PES).

The

display function layer

12 includes an organic

light emitting layer

121. The organic

light emitting layer

121 is formed using inkjet printing. As the material of the organic

light emitting layer

121, organic electroluminescent materials commonly used in the art, such as high molecular or low molecular weight organic photo-or electroluminescent materials, and fluorescent and phosphorescent compounds, may be used. The

display function layer

12 may also include other elements of an Organic Light Emitting Device (OLED), such as an anode, a cathode, and a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, etc. The

display function layer

12 may further include a

driving circuit layer

122 and a planarization layer (not shown), a passivation layer (not shown), and the like.

The thin

film encapsulation layer

13 includes at least one inorganic layer and at least one organic layer alternately stacked. The inorganic layer may be selected from inorganic materials of alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The organic layer is an organic material selected from epoxy resin, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like. Only the first

inorganic layer

131, the

organic layer

132, and the second

inorganic layer

133 are illustrated in fig. 3, but the number of inorganic layers and organic layers of the thin

film encapsulation layer

13 of the present application is not limited thereto.

The

flexible substrate

11 is provided with a

groove

101 which is undercut. The

groove

101 is disposed in the

peripheral region

100 c. In this embodiment, only one

notch

101 is opened in the

flexible substrate

11, but in other embodiments, the number of

notches

101 may be two or more.

In other embodiments of the present application, the structure of the

groove

101 may also be located at other positions of the

display device

100 where water and oxygen barrier is required.

The

groove

101 may have a shape surrounding the through hole TH in a plan view. The

groove

101 may have an undercut shape. The

groove

101 having an undercut shape may be one of an opening, a slit (aperture), and a hole. The

groove

101 having the undercut shape may be formed using a wet etching method or a dry etching method. The

etched recess

101 has, for example, a semicircular, hexagonal or elliptical cross section. Since the organic

light emitting layer

121 is formed on the

flexible substrate

11 by inkjet printing, it may be broken at the

groove

101. However, an excessively large taper angle inside the

groove

101 having an undercut shape may affect the quality of an inorganic layer of the thin

film encapsulation layer

13 subsequently formed on the

groove

101. It should be noted that only the organic

light emitting layer

121 is disconnected at the

groove

101, although not shown in the figure, other film layers of the

display device

100, such as an inorganic layer and a metal layer, may be continuous at the

groove

101, and may also be removed by patterning.

To solve this problem, an

organic layer

102 is coated on the inner sidewall of the

groove

101. In one embodiment, the

organic layer

102 is formed in one turn around the inner sidewall of the

groove

101. In the present embodiment, the

organic layer

102 completely covers the inner sidewall of the

groove

101. However, the present application does not limit the position of the

organic layer

102 on the inner sidewall of the

groove

101 as long as the taper angle can be reduced. In another embodiment, the

organic layer

102 partially covers the inner sidewalls of the

groove

101 or the

organic layer

102 completely covers the inner sidewalls of the

groove

101 and also covers a portion of the bottom wall of the

groove

101.

The composition and fabrication method of the

organic layer

102 is not limited in this application. The

organic layer

102 may be formed by, for example, inkjet printing, coating or filling an organic solution, and forming an organic layer after the organic solution is dried, or by directly forming an organic colloid on the inner wall of the

groove

101.

In one embodiment, the material of the

organic layer

102 may be an epoxy resin, an acrylate resin, or the like. The

organic layer

102 is formed on the inner sidewall of the

groove

101 by means of inkjet printing. The organic ink of the

organic layer

102 used in the inkjet printing process is composed of, for example: epoxy resin, acrylic resin, olefinic resin, and photopolymerization initiator, but are not limited thereto.

In one embodiment, the inner surface of the

recess

101 is formed by a

first portion

101a and a

second portion

101 b. The

organic layer

102 is disposed on the

second portion

101 b. In one embodiment, the

second portion

101b may surround the

first portion

101 a. For example, as mentioned above, the

second portion

101b may be an inner sidewall of a part or all of the

groove

101, and may also include an inner sidewall and a part of the bottom wall of all of the

groove

101. The

first portion

101a may be opposite to the hydrophilic property of the

organic layer

102. For example, the

first portion

101a has hydrophobic properties, and the

organic layer

102 and the

second portion

101a have hydrophilic properties, or vice versa. Further, the

second portion

101b may have the same hydrophilic property as the

organic layer

102.

In one embodiment, the

first portion

101a is a hydrophilic flexible substrate formed by performing a plasma hydrophilic treatment on a flexible substrate, or a hydrophobic flexible substrate material formed by performing a plasma hydrophobic treatment on a flexible substrate.

In another embodiment, the

first portion

101a may include a hydrophilic coating or a hydrophobic coating formed on the

flexible substrate

11. Further, the

second portion

101b may also include a coating layer having the same hydrophilic property as the

organic layer

102.

Further, the inorganic layers of the thin

film encapsulation layer

13, specifically, the first

inorganic layer

131 and the second

inorganic layer

132 cover the

groove

101, that is, cover the

organic layer

102 and the

first portion

101 a.

Referring to fig. 4, a display device 100' according to a second embodiment of the present application has substantially the same structure as the

display device

100 according to the first embodiment, except that:

the flexible substrate 11' includes a

barrier layer

111 and first and second

flexible substrates

112 and 113 disposed at both sides of the

barrier layer

111. The

recess

101' includes a

first recess

1011 opening into the first

flexible substrate

113 and a

second recess

1012 opening into the second

flexible substrate

113. The

first recess

1011 is in communication with the

second recess

1012. The barrier layer protrudes between the

first recess

1011 and the

second recess

1012. The

organic layer

102 covers inner sidewalls of the first and

second grooves

1011 and 1012.

Referring to fig. 5(a) to 5(g), a method for manufacturing a display device according to a third embodiment of the present application includes:

s1: a

flexible substrate

11 is provided, and a

groove

101 with an undercut is formed on the

flexible substrate

100. The

flexible substrate

100 is disposed on the

glass substrate

200, and is peeled off from the

glass substrate

200 after the process is completed.

In the present embodiment, the

flexible board

11 is formed of a single-layer flexible substrate. In other embodiments, the

flexible substrate

11 may be formed of two or more layers of flexible substrates. When the

flexible substrate

11 is the flexible substrate 11' shown in fig. 4, a

first groove

1011 is formed in the first

flexible substrate

113, and a

second groove

1012 is formed in the second

flexible substrate

113.

S2: an

organic layer

102 is formed on the inner sidewall of the

groove

101.

The method for forming an

organic layer

102 on the inner sidewall of the

groove

101 may be, for example, ink-jet printing, or coating or filling an organic solution, forming an organic layer after the organic solution is dried, or directly forming an organic colloid on the inner sidewall of the

groove

101.

In one embodiment, the organic ink of the

organic layer

102 used in the inkjet printing process is comprised of: epoxy resin, organic olefine acid esters and photopolymerization initiator.

In one embodiment, the

organic layer

102 is formed in one turn around the inner sidewall of the

groove

101. In the present embodiment, the

organic layer

102 completely covers the inner sidewall of the

groove

101. However, the present application does not limit the position of the

organic layer

102 on the inner sidewall of the

groove

101 as long as the taper angle can be reduced. In another embodiment, the

organic layer

102 partially covers the inner sidewalls of the

groove

101 or the

organic layer

102 completely covers the inner sidewalls of the

groove

101 and also covers a portion of the bottom wall of the

groove

101.

In the present embodiment, step S2 further includes:

step S21: the inner surface of the

groove

101 is subjected to hydrophilic or hydrophobic treatment to form a

first portion

101a and a

second portion

101b having hydrophilic or hydrophobic surfaces. Dropping an

organic ink

300 having a hydrophilic property opposite to that of the

first portion

101a into the

groove

101; an

organic layer

102 is formed after the

organic ink

300 is dried in the

second portion

101 b. In this step, since the

organic ink

300 has the opposite hydrophilic property to the

first portion

101a, the

organic ink

300 repels the

first portion

101a and flows to the

second portion

101 b. The

organic layer

102 may be simply formed on the inner sidewall of the

groove

101.

In one embodiment, the

second portion

101b may surround the

first portion

101 a. As described above, the

second portion

101b may be an inner sidewall of a part or all of the

grooves

101, and may also include an inner sidewall and a part of the bottom wall of all of the

grooves

101. In one embodiment, the

first portion

101a has a hydrophobic property and the

organic layer

102 has a hydrophilic property, or vice versa.

Further, the

second portion

101b may have the same hydrophilic property as the

organic layer

102. Step S2 further includes step S22: the inner surface of the

groove

101 is subjected to hydrophilic or hydrophobic treatment to form a

second portion

101b having a hydrophilic property opposite to that of the

first portion

101 a.

In steps S21 and S22, the method of performing hydrophilic or hydrophobic treatment on the inner surface of the

groove

101 may be performing plasma hydrophilic or plasma hydrophobic treatment on the flexible substrate of the

flexible base plate

11, thereby forming a hydrophilic flexible substrate or a hydrophobic flexible substrate. In another embodiment, the inner surface of the

groove

101 may be treated to be hydrophilic or hydrophobic by coating a hydrophilic or hydrophobic coating on the

flexible substrate

11.

S3: a

display function layer

12 is formed on the

flexible substrate

11. The

display function layer

12 includes an organic

light emitting layer

121. Among them, the organic

light emitting layer

121 is formed on the

flexible substrate

11 by inkjet printing. The organic

light emitting layer

121 is disconnected at the

groove

101.

Further, the method of manufacturing a display device further includes step S4: a thin

film encapsulation layer

13 is formed on the

display function layer

12. The structure and material of the thin

film encapsulation layer

13 refer to the above embodiments, and are not described in detail herein. The inorganic layers of the thin

film encapsulation layer

13, specifically, the first

inorganic layer

131 and the second

inorganic layer

132 cover the

groove

101, i.e., cover the

organic layer

102 and the

first portion

101 a. It should be noted that fig. 5(a) to 5(g) only show the cross-sectional views of the

peripheral region

100c, and reference may be made to fig. 3 for the structures of the

display region

100a and the

photosensitive region

100 b.

The display device 100' in fig. 4 can also be manufactured by the same manufacturing method, and will not be described again.

Compared with the prior art, the display device and the manufacturing method thereof provided by the application reduce the taper angle of the groove by arranging the organic layer in the undercut groove, so that the formed inorganic film layer is more continuous and compact and has good water and oxygen barrier property when the inorganic film layer of the film packaging layer is deposited in the groove subsequently.

The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (8)

1. A display device, comprising:

the flexible substrate is provided with an undercut groove, and the inner surface of the groove is composed of a first part and a second part; and

the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove;

the inner side wall of the groove is covered with an organic layer, the organic layer is arranged on the second part, and the hydrophilic performance of the first part is opposite to that of the organic layer.

2. The display device according to claim 1, wherein the first portion is a hydrophilic flexible substrate or a hydrophobic flexible substrate which is plasma-treated.

3. The display device according to claim 1, wherein the first portion includes a hydrophilic coating or a hydrophobic coating formed on the flexible substrate.

4. The display device of claim 1, further comprising a thin film encapsulation layer covering the display functional layer, the thin film encapsulation layer comprising at least one inorganic layer, the inorganic layer covering the organic layer and the first portion.

5. The display device according to any one of claims 1 to 4, wherein the flexible substrate includes a barrier layer and a first flexible substrate and a second flexible substrate provided on both sides of the barrier layer,

the groove comprises a first groove arranged in the first flexible substrate and a second groove arranged in the second flexible substrate, the first groove is communicated with the second groove, and an organic layer covers the inner side wall of the first groove and the inner side wall of the second groove.

6. The display device according to claim 1, wherein the display device includes a display area, a photosensitive area, and a peripheral area, the display area surrounds the photosensitive area, the peripheral area is disposed between the display area and the photosensitive area, the photosensitive area is used for disposing a photosensitive element, and the recess is disposed in the peripheral area.

7. A method of manufacturing a display device, comprising the steps of:

providing a flexible substrate, and forming a groove in an undercut shape on the flexible substrate;

carrying out hydrophilic or hydrophobic treatment on the inner surface of the groove to form a first part and a second part with hydrophilicity or hydrophobicity, dripping organic ink with the hydrophilicity opposite to that of the first part into the groove, and drying the organic ink to form an organic layer on the second part;

forming a display function layer on the flexible substrate, the display function layer including an organic light emitting layer, the organic light emitting layer being broken at the groove.

8. The method of manufacturing a display device according to claim 7, wherein the step of forming the first portion and the second portion having hydrophilicity or hydrophobicity by subjecting the inner surface of the groove to a hydrophilic or hydrophobic treatment comprises plasma treatment or coating the flexible substrate with a hydrophilic coating or a hydrophobic coating.

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