CN112201760B - Display device and method for manufacturing the same - Google Patents
- ️Fri Dec 03 2021
CN112201760B - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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Publication number
- CN112201760B CN112201760B CN202010928332.1A CN202010928332A CN112201760B CN 112201760 B CN112201760 B CN 112201760B CN 202010928332 A CN202010928332 A CN 202010928332A CN 112201760 B CN112201760 B CN 112201760B Authority
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- China Prior art keywords
- groove
- layer
- flexible substrate
- display device
- organic Prior art date
- 2020-09-07 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 15
- 239000010410 layer Substances 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000012044 organic layer Substances 0.000 claims abstract description 54
- 230000002209 hydrophobic effect Effects 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 2
- 239000002346 layers by function Substances 0.000 claims description 2
- 238000009832 plasma treatment Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 14
- 238000007641 inkjet printing Methods 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display device, it includes: the flexible substrate is provided with a groove which is undercut; the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove; an organic layer covers the inner side wall of the groove.
Description
Technical Field
The present disclosure relates to display devices, and particularly to a display device and a method for manufacturing the same.
Background
In the known oled display device, in order to block the water and oxygen intrusion, a special structure is formed at some positions of the display panel, so that the organic light emitting layer is not connected at the special position, and the thin film encapsulation structure is connected. One of the methods is to etch the display panel to form a cavity structure. However, the water oxygen barrier properties of inorganic films are directly related to the underlying film layer morphology. When an inorganic film of a thin film encapsulation structure is formed on the cavity structure, the inorganic film has the problems of film layer discontinuity and poor film quality due to an excessively large taper angle, for example, exceeding 80 degrees, and failure such as crack (crack) is easy to occur after a bending test.
Disclosure of Invention
In view of the above, the present disclosure is directed to a display device and a method for manufacturing the same, which can improve the water and oxygen barrier performance and the film quality of a thin film encapsulation structure.
The application provides a display device, it includes:
the flexible substrate is provided with a groove which is undercut; and
the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove;
an organic layer covers the inner side wall of the groove.
In one embodiment, the inner surface of the recess is formed by a first portion and a second portion, the organic layer being disposed on the second portion, the first portion being opposite to the hydrophilic property of the organic layer.
In one embodiment, the first portion is a plasma treated hydrophilic flexible substrate or a hydrophobic flexible substrate.
In one embodiment, the first portion includes a hydrophilic coating or a hydrophobic coating formed on the flexible substrate.
In one embodiment, the display device further comprises a thin film encapsulation layer covering the display functional layer, the thin film encapsulation layer comprising at least one inorganic layer, the inorganic layer covering the organic layer and the first portion.
In one embodiment, the flexible substrate includes a barrier layer and first and second flexible substrates disposed on both sides of the barrier layer,
the groove comprises a first groove arranged in the first flexible substrate and a second groove arranged in the second flexible substrate, the first groove is communicated with the second groove, and an organic layer covers the inner side wall of the first groove and the inner side wall of the second groove.
In one embodiment, the display device includes a display area, a photosensitive area, and a peripheral area, the display area surrounds the photosensitive area, the peripheral area is disposed between the display area and the photosensitive area, the photosensitive area is used for disposing a photosensitive element, and the groove is disposed in the peripheral area.
The present application also provides a method of manufacturing a display device, which includes the steps of:
providing a flexible substrate, and forming a groove in an undercut shape on the flexible substrate;
forming an organic layer on the inner side wall of the groove;
forming a display function layer on the flexible substrate, the display function layer including an organic light emitting layer, the organic light emitting layer being broken at the groove.
In one embodiment, the step of forming an organic layer on the inner sidewall of the groove comprises:
carrying out hydrophilic or hydrophobic treatment on the inner surface of the groove to form a first part and a second part with hydrophilicity or hydrophobicity, dripping organic ink with the hydrophilicity opposite to that of the first part into the groove, and drying the organic ink to form an organic layer on the second part.
In one embodiment, the step of forming the first and second portions having hydrophilicity or hydrophobicity by subjecting the inner surfaces of the grooves to a hydrophilic or hydrophobic treatment includes plasma treatment or coating the flexible substrate with a hydrophilic coating or a hydrophobic coating.
Compared with the prior art, the display device and the manufacturing method thereof provided by the application reduce the taper angle of the groove by arranging the organic layer in the undercut groove, so that the formed inorganic film layer is more continuous and compact and has good water and oxygen barrier property when the inorganic film layer of the film packaging layer is deposited in the groove subsequently.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic plan view of a display device according to a first embodiment of the present application.
Fig. 2 is a partially enlarged schematic view of the display device in fig. 1.
Fig. 3 is a schematic cross-sectional view of the display device of fig. 1 along the line a-a.
Fig. 4 is a schematic cross-sectional view of a groove of a display device according to a second embodiment of the present disclosure.
Fig. 5(a) to 5(g) are schematic cross-sectional views illustrating a method for manufacturing a display device according to a third embodiment of the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being directly adjacent or may comprise the first and second features being not in direct contact but in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 to fig. 3, a
display device100 according to an embodiment of the present disclosure includes a
display panel10 and a
photosensitive element20. The
display panel10 is an organic light emitting diode display panel. The
light sensing element20 includes, but is not limited to, a front camera, a face recognition sensor, a gesture sensor, and the like.
The
display device100 may be divided into a
display area100a, a
photosensitive area100b, and a
peripheral area100 c. The
display area100a surrounds the
photosensitive area100 b. The
peripheral area100c is located between the
display area100a and the
photosensitive area100 b. In other words, the
peripheral area100c surrounds the
photosensitive area100b, and the
display area100a surrounds the
peripheral area100 c.
The
display area100a is used for displaying an image. The
display region100a is provided with a plurality of light-emitting pixels (not shown) and a drive circuit (not shown) for driving the plurality of light-emitting pixels to emit light.
The
photosensitive region100b is used to dispose the
photosensitive element20. The
light sensing region100b may be formed by forming a through hole or a blind hole in the
display device100 by laser cutting. In the present embodiment, the
photosensitive region100b is formed of the through hole TH. The shape of the
photosensitive region100b is not limited in the present application, and may be a circle, a square, a triangle, or other polygons.
The
peripheral region100c is used for water and oxygen blocking between the
display region100a and the
photosensitive region100 b.
The
display panel10 includes a
flexible substrate11, a
display function layer12 disposed on the
flexible substrate11, and a thin
film encapsulation layer13 covering the
display function layer12.
The
flexible board11 may be formed of a single-layer flexible substrate, or may be formed of two or more layers of flexible substrates. The material of the flexible substrate is selected from one or more of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI) and Polyethersulfone (PES).
The
display function layer12 includes an organic
light emitting layer121. The organic
light emitting layer121 is formed using inkjet printing. As the material of the organic
light emitting layer121, organic electroluminescent materials commonly used in the art, such as high molecular or low molecular weight organic photo-or electroluminescent materials, and fluorescent and phosphorescent compounds, may be used. The
display function layer12 may also include other elements of an Organic Light Emitting Device (OLED), such as an anode, a cathode, and a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, etc. The
display function layer12 may further include a
driving circuit layer122 and a planarization layer (not shown), a passivation layer (not shown), and the like.
The thin
film encapsulation layer13 includes at least one inorganic layer and at least one organic layer alternately stacked. The inorganic layer may be selected from inorganic materials of alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The organic layer is an organic material selected from epoxy resin, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like. Only the first
inorganic layer131, the
organic layer132, and the second
inorganic layer133 are illustrated in fig. 3, but the number of inorganic layers and organic layers of the thin
film encapsulation layer13 of the present application is not limited thereto.
The
flexible substrate11 is provided with a
groove101 which is undercut. The
groove101 is disposed in the
peripheral region100 c. In this embodiment, only one
notch101 is opened in the
flexible substrate11, but in other embodiments, the number of
notches101 may be two or more.
In other embodiments of the present application, the structure of the
groove101 may also be located at other positions of the
display device100 where water and oxygen barrier is required.
The
groove101 may have a shape surrounding the through hole TH in a plan view. The
groove101 may have an undercut shape. The
groove101 having an undercut shape may be one of an opening, a slit (aperture), and a hole. The
groove101 having the undercut shape may be formed using a wet etching method or a dry etching method. The
etched recess101 has, for example, a semicircular, hexagonal or elliptical cross section. Since the organic
light emitting layer121 is formed on the
flexible substrate11 by inkjet printing, it may be broken at the
groove101. However, an excessively large taper angle inside the
groove101 having an undercut shape may affect the quality of an inorganic layer of the thin
film encapsulation layer13 subsequently formed on the
groove101. It should be noted that only the organic
light emitting layer121 is disconnected at the
groove101, although not shown in the figure, other film layers of the
display device100, such as an inorganic layer and a metal layer, may be continuous at the
groove101, and may also be removed by patterning.
To solve this problem, an
organic layer102 is coated on the inner sidewall of the
groove101. In one embodiment, the
organic layer102 is formed in one turn around the inner sidewall of the
groove101. In the present embodiment, the
organic layer102 completely covers the inner sidewall of the
groove101. However, the present application does not limit the position of the
organic layer102 on the inner sidewall of the
groove101 as long as the taper angle can be reduced. In another embodiment, the
organic layer102 partially covers the inner sidewalls of the
groove101 or the
organic layer102 completely covers the inner sidewalls of the
groove101 and also covers a portion of the bottom wall of the
groove101.
The composition and fabrication method of the
organic layer102 is not limited in this application. The
organic layer102 may be formed by, for example, inkjet printing, coating or filling an organic solution, and forming an organic layer after the organic solution is dried, or by directly forming an organic colloid on the inner wall of the
groove101.
In one embodiment, the material of the
organic layer102 may be an epoxy resin, an acrylate resin, or the like. The
organic layer102 is formed on the inner sidewall of the
groove101 by means of inkjet printing. The organic ink of the
organic layer102 used in the inkjet printing process is composed of, for example: epoxy resin, acrylic resin, olefinic resin, and photopolymerization initiator, but are not limited thereto.
In one embodiment, the inner surface of the
recess101 is formed by a
first portion101a and a
second portion101 b. The
organic layer102 is disposed on the
second portion101 b. In one embodiment, the
second portion101b may surround the
first portion101 a. For example, as mentioned above, the
second portion101b may be an inner sidewall of a part or all of the
groove101, and may also include an inner sidewall and a part of the bottom wall of all of the
groove101. The
first portion101a may be opposite to the hydrophilic property of the
organic layer102. For example, the
first portion101a has hydrophobic properties, and the
organic layer102 and the
second portion101a have hydrophilic properties, or vice versa. Further, the
second portion101b may have the same hydrophilic property as the
organic layer102.
In one embodiment, the
first portion101a is a hydrophilic flexible substrate formed by performing a plasma hydrophilic treatment on a flexible substrate, or a hydrophobic flexible substrate material formed by performing a plasma hydrophobic treatment on a flexible substrate.
In another embodiment, the
first portion101a may include a hydrophilic coating or a hydrophobic coating formed on the
flexible substrate11. Further, the
second portion101b may also include a coating layer having the same hydrophilic property as the
organic layer102.
Further, the inorganic layers of the thin
film encapsulation layer13, specifically, the first
inorganic layer131 and the second
inorganic layer132 cover the
groove101, that is, cover the
organic layer102 and the
first portion101 a.
Referring to fig. 4, a display device 100' according to a second embodiment of the present application has substantially the same structure as the
display device100 according to the first embodiment, except that:
the flexible substrate 11' includes a
barrier layer111 and first and second
flexible substrates112 and 113 disposed at both sides of the
barrier layer111. The
recess101' includes a
first recess1011 opening into the first
flexible substrate113 and a
second recess1012 opening into the second
flexible substrate113. The
first recess1011 is in communication with the
second recess1012. The barrier layer protrudes between the
first recess1011 and the
second recess1012. The
organic layer102 covers inner sidewalls of the first and
second grooves1011 and 1012.
Referring to fig. 5(a) to 5(g), a method for manufacturing a display device according to a third embodiment of the present application includes:
s1: a
flexible substrate11 is provided, and a
groove101 with an undercut is formed on the
flexible substrate100. The
flexible substrate100 is disposed on the
glass substrate200, and is peeled off from the
glass substrate200 after the process is completed.
In the present embodiment, the
flexible board11 is formed of a single-layer flexible substrate. In other embodiments, the
flexible substrate11 may be formed of two or more layers of flexible substrates. When the
flexible substrate11 is the flexible substrate 11' shown in fig. 4, a
first groove1011 is formed in the first
flexible substrate113, and a
second groove1012 is formed in the second
flexible substrate113.
S2: an
organic layer102 is formed on the inner sidewall of the
groove101.
The method for forming an
organic layer102 on the inner sidewall of the
groove101 may be, for example, ink-jet printing, or coating or filling an organic solution, forming an organic layer after the organic solution is dried, or directly forming an organic colloid on the inner sidewall of the
groove101.
In one embodiment, the organic ink of the
organic layer102 used in the inkjet printing process is comprised of: epoxy resin, organic olefine acid esters and photopolymerization initiator.
In one embodiment, the
organic layer102 is formed in one turn around the inner sidewall of the
groove101. In the present embodiment, the
organic layer102 completely covers the inner sidewall of the
groove101. However, the present application does not limit the position of the
organic layer102 on the inner sidewall of the
groove101 as long as the taper angle can be reduced. In another embodiment, the
organic layer102 partially covers the inner sidewalls of the
groove101 or the
organic layer102 completely covers the inner sidewalls of the
groove101 and also covers a portion of the bottom wall of the
groove101.
In the present embodiment, step S2 further includes:
step S21: the inner surface of the
groove101 is subjected to hydrophilic or hydrophobic treatment to form a
first portion101a and a
second portion101b having hydrophilic or hydrophobic surfaces. Dropping an
organic ink300 having a hydrophilic property opposite to that of the
first portion101a into the
groove101; an
organic layer102 is formed after the
organic ink300 is dried in the
second portion101 b. In this step, since the
organic ink300 has the opposite hydrophilic property to the
first portion101a, the
organic ink300 repels the
first portion101a and flows to the
second portion101 b. The
organic layer102 may be simply formed on the inner sidewall of the
groove101.
In one embodiment, the
second portion101b may surround the
first portion101 a. As described above, the
second portion101b may be an inner sidewall of a part or all of the
grooves101, and may also include an inner sidewall and a part of the bottom wall of all of the
grooves101. In one embodiment, the
first portion101a has a hydrophobic property and the
organic layer102 has a hydrophilic property, or vice versa.
Further, the
second portion101b may have the same hydrophilic property as the
organic layer102. Step S2 further includes step S22: the inner surface of the
groove101 is subjected to hydrophilic or hydrophobic treatment to form a
second portion101b having a hydrophilic property opposite to that of the
first portion101 a.
In steps S21 and S22, the method of performing hydrophilic or hydrophobic treatment on the inner surface of the
groove101 may be performing plasma hydrophilic or plasma hydrophobic treatment on the flexible substrate of the
flexible base plate11, thereby forming a hydrophilic flexible substrate or a hydrophobic flexible substrate. In another embodiment, the inner surface of the
groove101 may be treated to be hydrophilic or hydrophobic by coating a hydrophilic or hydrophobic coating on the
flexible substrate11.
S3: a
display function layer12 is formed on the
flexible substrate11. The
display function layer12 includes an organic
light emitting layer121. Among them, the organic
light emitting layer121 is formed on the
flexible substrate11 by inkjet printing. The organic
light emitting layer121 is disconnected at the
groove101.
Further, the method of manufacturing a display device further includes step S4: a thin
film encapsulation layer13 is formed on the
display function layer12. The structure and material of the thin
film encapsulation layer13 refer to the above embodiments, and are not described in detail herein. The inorganic layers of the thin
film encapsulation layer13, specifically, the first
inorganic layer131 and the second
inorganic layer132 cover the
groove101, i.e., cover the
organic layer102 and the
first portion101 a. It should be noted that fig. 5(a) to 5(g) only show the cross-sectional views of the
peripheral region100c, and reference may be made to fig. 3 for the structures of the
display region100a and the
photosensitive region100 b.
The display device 100' in fig. 4 can also be manufactured by the same manufacturing method, and will not be described again.
Compared with the prior art, the display device and the manufacturing method thereof provided by the application reduce the taper angle of the groove by arranging the organic layer in the undercut groove, so that the formed inorganic film layer is more continuous and compact and has good water and oxygen barrier property when the inorganic film layer of the film packaging layer is deposited in the groove subsequently.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (8)
1. A display device, comprising:
the flexible substrate is provided with an undercut groove, and the inner surface of the groove is composed of a first part and a second part; and
the display function layer is arranged on the flexible substrate and comprises an organic light emitting layer, and the organic light emitting layer is disconnected at the groove;
the inner side wall of the groove is covered with an organic layer, the organic layer is arranged on the second part, and the hydrophilic performance of the first part is opposite to that of the organic layer.
2. The display device according to claim 1, wherein the first portion is a hydrophilic flexible substrate or a hydrophobic flexible substrate which is plasma-treated.
3. The display device according to claim 1, wherein the first portion includes a hydrophilic coating or a hydrophobic coating formed on the flexible substrate.
4. The display device of claim 1, further comprising a thin film encapsulation layer covering the display functional layer, the thin film encapsulation layer comprising at least one inorganic layer, the inorganic layer covering the organic layer and the first portion.
5. The display device according to any one of claims 1 to 4, wherein the flexible substrate includes a barrier layer and a first flexible substrate and a second flexible substrate provided on both sides of the barrier layer,
the groove comprises a first groove arranged in the first flexible substrate and a second groove arranged in the second flexible substrate, the first groove is communicated with the second groove, and an organic layer covers the inner side wall of the first groove and the inner side wall of the second groove.
6. The display device according to claim 1, wherein the display device includes a display area, a photosensitive area, and a peripheral area, the display area surrounds the photosensitive area, the peripheral area is disposed between the display area and the photosensitive area, the photosensitive area is used for disposing a photosensitive element, and the recess is disposed in the peripheral area.
7. A method of manufacturing a display device, comprising the steps of:
providing a flexible substrate, and forming a groove in an undercut shape on the flexible substrate;
carrying out hydrophilic or hydrophobic treatment on the inner surface of the groove to form a first part and a second part with hydrophilicity or hydrophobicity, dripping organic ink with the hydrophilicity opposite to that of the first part into the groove, and drying the organic ink to form an organic layer on the second part;
forming a display function layer on the flexible substrate, the display function layer including an organic light emitting layer, the organic light emitting layer being broken at the groove.
8. The method of manufacturing a display device according to claim 7, wherein the step of forming the first portion and the second portion having hydrophilicity or hydrophobicity by subjecting the inner surface of the groove to a hydrophilic or hydrophobic treatment comprises plasma treatment or coating the flexible substrate with a hydrophilic coating or a hydrophobic coating.
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