CN1877417A - Side light type backlight module - Google Patents

A side-incident type backlight module comprises a substrate, a light guide plate, a light emitting diode and a metal sheet; the substrate is provided with a first surface, a second surface and a hole, and the hole penetrates through the first surface and the second surface; the light guide plate is arranged on the first surface and does not cover the hole; the light guide plate is provided with a light incident surface. The light emitting diode is combined on the substrate through the hole; the metal sheet and the light incident surface of the light guide plate form a space to cover the light emitting diode therein. The invention improves the heat accumulation problem of the prior side-incident backlight module, according to the invention, the possibility that the light guide plate in the side-incident backlight module is degraded or even melted due to the heat accumulation of the light emitting surface of the light emitting diode can be avoided, and in addition, the defect that the light guide plate and the optical film above the light guide plate are degenerated and yellowed due to the heat is overcome.

侧端入光型背光模块Side light type backlight module

技术领域technical field

本发明涉及一种侧端入光型(Edge-type)背光模块，特别是涉及一种以发光二极管(Light Emitting Diode，LED)为光源的例端入光型背光模块。The present invention relates to an edge-type backlight module, in particular to an edge-type backlight module with a light emitting diode (Light Emitting Diode, LED) as a light source.

背景技术Background technique

请参照图1A与图1B，图1A为一现有侧端入光型背光模块侧剖面示意图；图1B显示图1A中的光源组。背光模块10包括一底座(back bezel)12、一导光板14、多层光学膜片(未绘示出)、一反射片16与一光源组20。光源组20包括一电路板21、一发光二极管(LED)22。背光模块10的功能是用来提供一均匀的面光源给一显示面板(display panel)，例如液晶面板。Please refer to FIG. 1A and FIG. 1B . FIG. 1A is a schematic side sectional view of a conventional side-lit backlight module; FIG. 1B shows the light source group in FIG. 1A . The backlight module 10 includes a base (back bezel) 12 , a light guide plate 14 , multilayer optical films (not shown), a reflector 16 and a light source group 20 . The light source group 20 includes a circuit board 21 and a light emitting diode (LED) 22 . The function of the backlight module 10 is to provide a uniform surface light source to a display panel, such as a liquid crystal panel.

在背光模块10之中，底座12具有一基板122，并具有从基板122周边部分延伸出的一延伸部124，可用于装设或包覆背光模块10的其它组件。In the backlight module 10 , the base 12 has a base plate 122 and has an extension portion 124 extending from the peripheral portion of the base plate 122 , which can be used to install or cover other components of the backlight module 10 .

导光板14设置于基板122上，光源组20设置于导光板14的侧端，所述侧端即为导光板14的入光面。光线由导光板14的所述侧端进入导光板14，并散射于导光板14之中。导光板14通常具有特定的光学图案(optical pattern)，例如v-cut图案，可使得散射于其中的光线较均匀地出射导光板14。在导光板14上通常会设置有多层光学膜片，例如上、下扩散片与上、下增光片，以强化背光模块10所提供的光线的品质。The light guide plate 14 is disposed on the substrate 122 , and the light source group 20 is disposed on a side end of the light guide plate 14 , and the side end is the light incident surface of the light guide plate 14 . The light enters the light guide plate 14 from the side end of the light guide plate 14 and is scattered in the light guide plate 14 . The light guide plate 14 usually has a specific optical pattern, such as a v-cut pattern, so that the light scattered therein can exit the light guide plate 14 more uniformly. Multi-layer optical films, such as upper and lower diffusion films and upper and lower brightness enhancement films, are usually arranged on the light guide plate 14 to enhance the quality of the light provided by the backlight module 10 .

为了加强背光模块10的光线使用效率，在底座12的内面通常会设置反射片16或者是涂布反光材料。若以反射片16为例，设置于延伸部124内面的反射片16可用于使得光源组20的光线更有效率地入射导光板14，而设置于基板122内面的反射片16则可使得光线更有效率地被运用于背光模块10。In order to enhance the light utilization efficiency of the backlight module 10 , a reflective sheet 16 is usually disposed on the inner surface of the base 12 or coated with a reflective material. Taking the reflection sheet 16 as an example, the reflection sheet 16 arranged on the inner surface of the extension part 124 can be used to make the light of the light source group 20 enter the light guide plate 14 more efficiently, and the reflection sheet 16 arranged on the inner surface of the substrate 122 can make the light more efficient. Efficiently applied to the backlight module 10 .

光源组20之中，发光二极管22是主要将电能转换成光能的组件，其主要发光体为一芯片，整体而言则以所述芯片为主的一封装构造；而电路板21则具有操作发光二极管22时所需的电路，二者通常分别制作完成后，再将发光二极管22装设于电路板21上而完成光源组20，以利于背光模块10的组装。由于电路板21的电路接脚处容易产生热能，因此通常会在电路板21的一面利用导热硅胶18来加强散热效果。In the light source group 20, the light emitting diode 22 is a component that mainly converts electric energy into light energy. The circuits required for the light emitting diodes 22 are generally manufactured separately, and then the light emitting diodes 22 are installed on the circuit board 21 to complete the light source group 20 to facilitate the assembly of the backlight module 10 . Since the circuit pins of the circuit board 21 are likely to generate heat, the heat-conducting silica gel 18 is usually used on one side of the circuit board 21 to enhance the heat dissipation effect.

然而，光源组20中产生热能的部位除了上述的电路接脚处之外，发光二极管22的发光面也为另一产生热能的部位，且如图1所示，发光二极管22的设置位置贴近于导光板14，因此，发光二极管22点亮时所产生的热容易堆积而不易散去，尤其在现今显示面板尺寸越来越大的趋势下，背光模块10之中所需的发光二极管22数目也越来越多，热堆积的问题已造成导光板14及/或其上方的光学膜片的劣化等问题。However, in addition to the above-mentioned circuit pins, the position where heat energy is generated in the light source group 20, the light-emitting surface of the light emitting diode 22 is also another position that generates heat energy, and as shown in FIG. 1, the setting position of the light emitting diode 22 is close to The light guide plate 14, therefore, the heat generated when the light-emitting diodes 22 are turned on is easy to accumulate and not easy to dissipate, especially in the current trend of increasing display panel size, the number of light-emitting diodes 22 required in the backlight module 10 is also increasing. Increasingly, the problem of thermal buildup has caused problems such as degradation of the light guide plate 14 and/or the optical films above it.

请参照图2A与图2B，图2A为另一现有侧端入光型背光模块侧剖面示意图；图2B显示图2A中的光源组。在背光模块10’之中，光源组20’异于图1A与图1B所示的光源组20，光源组20其中的电路板21组装于延伸部124，而光源组20’的电路板21’则组装于基板122上。然而相同的是：发光二极管22’的发光面也设置于贴近导光板14的位置，因此，上述关于热堆积与其它衍生问题仍然出现在图2A与图2B图所示的现有技术中。Please refer to FIG. 2A and FIG. 2B . FIG. 2A is a schematic side sectional view of another conventional side-lit backlight module; FIG. 2B shows the light source group in FIG. 2A . In the backlight module 10', the light source group 20' is different from the light source group 20 shown in FIG. 1A and FIG. Then assemble on the substrate 122 . However, the same thing is: the light-emitting surface of the light-emitting diode 22' is also disposed close to the light guide plate 14, therefore, the above-mentioned heat accumulation and other derived problems still occur in the prior art shown in Fig. 2A and Fig. 2B.

因此，如何改善现有侧端入光型背光模块的热堆积问题，并进一步避免背光模块中导光板及/或导光板上的光学膜片的劣化等问题，为当前发展所必需。Therefore, how to improve the heat accumulation problem of the existing side-illuminated backlight module and further avoid the degradation of the light guide plate and/or the optical film on the light guide plate in the backlight module is necessary for the current development.

发明内容Contents of the invention

本发明的目的之一在于改善现有侧端入光型背光模块的热堆积问题。One of the objectives of the present invention is to improve the heat accumulation problem of the conventional side-lit backlight module.

本发明的另一目的在于避免侧端入光型背光模块中导光板劣化的可能性。Another object of the present invention is to avoid the possibility of deterioration of the light guide plate in the side light type backlight module.

本发明的另一目的在于避免侧端入光型背光模块中导光板及其上方的光学膜片劣化等缺点。Another object of the present invention is to avoid the disadvantages of the side light type backlight module such as deterioration of the light guide plate and the optical film above it.

本发明提供了一种侧端入光型背光模块。所提供的背光模块至少包括一基板、一导光板、一发光二极管与一金属片；其中，The invention provides a side light-incident type backlight module. The provided backlight module at least includes a substrate, a light guide plate, a light emitting diode and a metal sheet; wherein,

所述基板具有一第一面、一第二面与一孔洞；The substrate has a first surface, a second surface and a hole;

导光板设置于所述第一面，且不覆盖所述孔洞，导光板具有一入光面；The light guide plate is arranged on the first surface and does not cover the hole, and the light guide plate has a light incident surface;

发光二极管通过所述孔洞组合于所述基板；The light emitting diode is combined with the substrate through the hole;

金属片与导光板的所述入光面形成一空间，以罩覆所述发光二极管于其中。The metal sheet and the light incident surface of the light guide plate form a space to cover the light emitting diodes therein.

所述发光二极管属于一光源组，该光源组还包括一电路板，所述电路板设置于所述基板的所述第二面。The light emitting diodes belong to a light source group, and the light source group also includes a circuit board, and the circuit board is arranged on the second surface of the substrate.

包括一反射片或一反射材料，设置于所述基板的所述第一面。It includes a reflective sheet or a reflective material disposed on the first surface of the substrate.

所述基板属于一底座的一部分，所述底座还包括从所述基板周边延伸出的一延伸部。The base plate is part of a base, and the base further includes an extension extending from the periphery of the base plate.

还包括一蓄热块，接触所述金属片以及所述基板。A heat storage block is also included, contacting the metal sheet and the base plate.

还包括一蓄热块，接触所述金属片、所述基板以及所述延伸部。A thermal storage block is also included, contacting the metal sheet, the base plate and the extension part.

所述金属片形成一反射斜面或一反射曲面。The metal sheet forms a reflective slope or a reflective curved surface.

所述金属片具有一光学粗糙面。The metal sheet has an optically rough surface.

本发明还一种侧端入光型背光模块，包括：The present invention also provides a side-incident type backlight module, comprising:

一底座，具有一第一面与一第二面；a base with a first surface and a second surface;

一导光板，设置于所述底座的所述第一面上，所述导光板具有一入光面；A light guide plate, disposed on the first surface of the base, the light guide plate has a light incident surface;

一金属片，与所述导光板的所述入光面形成一小于90度的夹角，并形成一空间；A metal sheet forming an angle less than 90 degrees with the light incident surface of the light guide plate and forming a space;

一发光二极管，位于所述导光板的所述入光面与所述金属片之间，具有一主发光方向大体上与所述导光板的入光面平行。A light emitting diode, located between the light incident surface of the light guide plate and the metal sheet, has a main light emitting direction substantially parallel to the light incident surface of the light guide plate.

所述发光二极管设置于所述底座的所述第一面上。The LED is disposed on the first surface of the base.

所述底座还具有一孔洞，所述发光二极管属于一光源组，所述光源组还包括一电路板，该电路板设置于所述底座的所述第二面，所述发光二极管则穿过所述孔洞而设置于所述导光板的所述入光面与所述金属片之间。The base also has a hole, the light emitting diode belongs to a light source group, and the light source group further includes a circuit board, the circuit board is arranged on the second surface of the base, and the light emitting diode passes through the The holes are arranged between the light incident surface of the light guide plate and the metal sheet.

所述底座的所述第一面上还设置一反射片或一反射材料。A reflection sheet or a reflection material is further arranged on the first surface of the base.

还包括一蓄热块，接触于所述金属片以及所述底座。It also includes a heat storage block, which is in contact with the metal sheet and the base.

所述夹角大体上介于40度至60度之间。The included angle is generally between 40 degrees and 60 degrees.

所述金属片朝向所述发光二极管的表面为光学粗糙面。The surface of the metal sheet facing the LED is optically rough.

还包括一胶框，设置于所述底座的所述第一面上，并大体上围绕所述导光板。It also includes a plastic frame disposed on the first surface of the base and substantially surrounding the light guide plate.

所述金属片固定于所述胶框上。The metal sheet is fixed on the plastic frame.

所述金属片以贴、镶、卡其中之一的方式固定于所述胶框上。The metal sheet is fixed on the plastic frame by one of sticking, inserting and clipping.

发光二极管产生的光线大体上由第二面朝向第一面的方向行进。金属片形成一反射斜面或一反射曲面，以将发光二极管产生的光线反射至导光板。通过金属片对光线的反射，发光二极管所产生的光线可低损失地由导光板的所述入光面入射导光板。The light generated by the light emitting diodes generally travels from the second surface toward the first surface. The metal sheet forms a reflective slope or a reflective curved surface to reflect the light generated by the LEDs to the light guide plate. Through the reflection of the light by the metal sheet, the light generated by the light emitting diode can enter the light guide plate from the light incident surface of the light guide plate with low loss.

因为导光板与邻接介质折射率的不同，光线会在接口产生内部全反射，并散射于导光板之中。导光板具有特定的光学图案，以使得散射于导光板中的光线可出射导光板，光学图案的分布情形可调控由导光板出射的光线的均匀性。Because of the difference in refractive index between the light guide plate and the adjacent medium, the light will be totally reflected internally at the interface and scattered in the light guide plate. The light guide plate has a specific optical pattern, so that the light scattered in the light guide plate can exit the light guide plate, and the distribution of the optical pattern can regulate the uniformity of the light emitted from the light guide plate.

导光板上设置有多层光学膜片，多层光学膜片可为上扩散片、上增光片、下扩散片与下增光片或其组合，可强化背光模块所提供的光线的品质。A multi-layer optical film is arranged on the light guide plate. The multi-layer optical film can be an upper diffusion film, an upper brightness enhancement film, a lower diffusion film and a lower brightness enhancement film or a combination thereof, which can enhance the quality of light provided by the backlight module.

通过金属片的反射功能，发光二极管的发光面不需要贴近导光板或是导光板上方的多层光学膜片。如此一来，现有导光板及/或其上方的光学膜片的劣化等问题，都已在本发明迎刃而解。金属片不但可使得发光二极管较远离导光板的入光面，且可提供一散热途径，以将热能引导至底座而排出。因此，本发明背光模块不但使得热能不易堆积于其中，且散热的传导效果也较Through the reflective function of the metal sheet, the light-emitting surface of the light-emitting diode does not need to be close to the light guide plate or the multi-layer optical film above the light guide plate. In this way, the problems of deterioration of the existing light guide plate and/or the optical film above it have been solved by the present invention. The metal sheet can not only keep the light emitting diodes far away from the light incident surface of the light guide plate, but also provide a heat dissipation path to guide the heat energy to the base and discharge it. Therefore, the backlight module of the present invention not only makes it difficult for heat to accumulate therein, but also has better conduction effect of heat dissipation.

现有技术进步许多。The existing technology has improved a lot.

本发明依上述的结构也提供了其中多种不同的详细实施方式。关于本发明的优点与精神，以及更详细的实施方式可以通过以下的实施方式以及附图得到进一步的了解。According to the above structures, the present invention also provides various detailed implementations thereof. The advantages and spirit of the present invention, as well as more detailed implementations, can be further understood through the following implementations and drawings.

附图说明Description of drawings

图1A为一现有侧端入光型背光模块侧剖面示意图；FIG. 1A is a schematic side sectional view of a conventional side-lit type backlight module;

图1B显示图1A中的光源组；Figure 1B shows the light source group in Figure 1A;

图2A为另一现有侧端入光型背光模块侧剖面示意图；FIG. 2A is a schematic side sectional view of another conventional side-lit type backlight module;

图2B显示图2A中的光源组；Figure 2B shows the group of light sources in Figure 2A;

图3A为本发明侧端入光型背光模块侧剖面示意图，其中发光二极管未组合于背光模块；Fig. 3A is a schematic side sectional view of a side-lit type backlight module of the present invention, wherein the light emitting diode is not combined with the backlight module;

图3B为本发明侧端入光型背光模块侧剖面示意图，其中发光二极管已组合于背光模块；Fig. 3B is a schematic side sectional view of a side-lit type backlight module of the present invention, wherein light-emitting diodes have been combined in the backlight module;

图3C为本发明另一实施例侧剖面示意图。FIG. 3C is a schematic side sectional view of another embodiment of the present invention.

【主要组件符号说明】[Description of main component symbols]

背光模块10、10’、30、30’       底座12、32Backlight module 10, 10’, 30, 30’ base 12, 32

基板122、321                延伸部124、323Substrate 122, 321 Extension 124, 323

导光板14、34                反射片16、36Light guide plate 14, 34 Reflector 16, 36

导热硅胶18、43              光源组20、20’、40Thermal silica gel 18, 43 Light source group 20, 20’, 40

电路板21、21’、41          发光二极管22、22’、42Circuit board 21, 21', 41 Light-emitting diodes 22, 22', 42

第一面321a                  第二面321bFirst side 321a Second side 321b

孔洞321c                    入光面341Hole 321c Light incident surface 341

底面342                     复数层光学膜片35Bottom 342 Multi-layer optical film 35

胶框39                      金属片45Plastic frame 39 metal sheet 45

蓄热块49                    夹角aHeat storage block 49 included angle a

具体实施方式Detailed ways

请参照图3A与图3B，为本发明侧端入光型背光模块侧剖面示意图。背光模块30包括一基板321、一导光板34、一发光二极管42与一金属片45。图3A显示发光二极管42未组合于背光模块30前的情形；图3B显示发光二极管42已组合于背光模块30的情形。Please refer to FIG. 3A and FIG. 3B , which are schematic side cross-sectional views of the side-lit backlight module of the present invention. The backlight module 30 includes a substrate 321 , a light guide plate 34 , a light emitting diode 42 and a metal sheet 45 . FIG. 3A shows a situation where the LED 42 is not assembled in front of the backlight module 30 ; FIG. 3B shows a situation where the LED 42 is assembled in the backlight module 30 .

其中，基板321具有一第一面321a、一第二面321b与一孔洞321c。孔洞321c贯通第一面321a与第二面321b。基板(subst rate)321属于一底座(back bezel)32的一部分，底座32还包括从基板321周边延伸出的一延伸部323。Wherein, the substrate 321 has a first surface 321a, a second surface 321b and a hole 321c. The hole 321c passes through the first surface 321a and the second surface 321b. The substrate 321 is part of a back bezel 32, and the base 32 further includes an extension 323 extending from the periphery of the substrate 321.

导光板34设置于第一面321a，且不覆盖孔洞321c。导光板34具有一入光面341与一底面342。导光板34通过底面342而设置于基板321的第一面321a上。入光面341是指导光板34的一侧端的表面，其邻接于底面342。The light guide plate 34 is disposed on the first surface 321a and does not cover the hole 321c. The light guide plate 34 has a light incident surface 341 and a bottom surface 342 . The light guide plate 34 is disposed on the first surface 321 a of the substrate 321 through the bottom surface 342 . The light incident surface 341 is a surface of one end of the light guide plate 34 , which is adjacent to the bottom surface 342 .

发光二极管42通过孔洞321c组合于基板321，其可以设置于孔洞321c之中，也可以设置于第一面321a上。发光二极管42产生的光线大体上由第二面321b朝向第一面321a的方向行进(图3A中由下往上的方向)；换句话说，发光二极管42的主发光方向大体上与导光板34的入光面341平行。上述发光二极管42的主发光方向是指发光二极管42的出光面(大体上为图标中发光二极管42的上表面)的法线方向。The light emitting diode 42 is combined with the substrate 321 through the hole 321c, and it can be disposed in the hole 321c, or can be disposed on the first surface 321a. The light generated by the light emitting diode 42 generally travels from the second surface 321b toward the direction of the first surface 321a (the direction from bottom to top in FIG. 3A ); The light incident surface 341 is parallel. The above-mentioned main light emitting direction of the light emitting diode 42 refers to the normal direction of the light emitting surface of the light emitting diode 42 (generally the upper surface of the light emitting diode 42 in the figure).

金属片45与导光板34的入光面341形成一空间，以罩覆发光二极管42于其中，其中金属片45可跨设于导光板34与底座32上。金属片45形成一反射斜面或一反射曲面，以将发光二极管42产生的光线反射至导光板34。通过金属片45对光线的反射，发光二极管42所产生的光线可低损失地由入光面341入射导光板34。如图所示，金属片45与入光面341形成一夹角(图标中标号a)，夹角a小于90度。较佳地，夹角a介于40度至60度之间，实施上，当发光二极管42较靠近导光板34时，夹角a可设计成较小的角度；而当发光二极管42较远离导光板34时，夹角a可设计成较大的角度。The metal sheet 45 forms a space with the light incident surface 341 of the light guide plate 34 to cover the LED 42 therein, wherein the metal sheet 45 can straddle the light guide plate 34 and the base 32 . The metal sheet 45 forms a reflecting slope or a reflecting curved surface to reflect the light generated by the LED 42 to the light guide plate 34 . Through the reflection of the light by the metal sheet 45 , the light generated by the LED 42 can enter the light guide plate 34 from the light incident surface 341 with low loss. As shown in the figure, the metal sheet 45 forms an included angle (marked a in the figure) with the light incident surface 341 , and the included angle a is less than 90 degrees. Preferably, the included angle a is between 40 degrees and 60 degrees. In practice, when the LED 42 is closer to the light guide plate 34, the included angle a can be designed to be a smaller angle; and when the LED 42 is farther away from the guide plate 34 When the light board 34 is used, the included angle a can be designed as a relatively large angle.

因为导光板34与邻接介质折射率的不同，光线会在接口产生内部全反射，并散射于导光板34之中。导光板34具有特定的光学图案(optical pattern)，例如v-cut图案，以使得散射于导光板34中的光线出射导光板34，光学图案的分布情形可调控由导光板34出射的光线的均匀性。Because of the difference in refractive index between the light guide plate 34 and the adjacent medium, the light will be totally internally reflected at the interface and scattered in the light guide plate 34 . The light guide plate 34 has a specific optical pattern (optical pattern), such as a v-cut pattern, so that the light scattered in the light guide plate 34 exits the light guide plate 34, and the distribution of the optical pattern can regulate the uniformity of the light emitted by the light guide plate 34. sex.

一实施例中，导光板34上设置有多层光学膜片35，多层光学膜片可为上扩散片、上增光片、下扩散片与下增光片或其组合，可强化背光模块30所提供的光线的品质。In one embodiment, the light guide plate 34 is provided with a multi-layer optical film 35. The multi-layer optical film can be an upper diffusion film, an upper brightness enhancement film, a lower diffusion film and a lower brightness enhancement film or a combination thereof, which can strengthen the backlight module 30. The quality of light provided.

金属片45除了上述跨设于导光板34与底座32的实施方式之外，也可固定于背光模块30进一步包括的一胶框39上。胶框39设置于底座32的第一面321a上。胶框39除了设置于图标中导光板34其中一侧端(入光面341)的外侧，也可设置于图中所未示的其它侧端的外侧，换句话说，胶框39大体上围绕导光板34。而实施上，金属片45以贴、镶、卡其中之一方式固定于胶框39上。胶框39的功能除了可以用来固定金属片45，通过胶框39容易利用射出成型技术制作不同形状的特性，则金属片45可通过胶框39，而与导光板34的入光面341形成夹角a。In addition to the aforementioned embodiment of straddling the light guide plate 34 and the base 32 , the metal sheet 45 can also be fixed on a plastic frame 39 further included in the backlight module 30 . The plastic frame 39 is disposed on the first surface 321 a of the base 32 . The rubber frame 39 can be arranged on the outside of one side (light incident surface 341) of the light guide plate 34 in the figure, and can also be arranged on the outside of other side ends not shown in the figure. In other words, the rubber frame 39 generally surrounds the light guide plate 34 light board 34 . In practice, the metal sheet 45 is fixed on the plastic frame 39 by one of sticking, inlaying and clipping. The function of the plastic frame 39 is not only to fix the metal sheet 45, it is easy to use the injection molding technology to make different shapes through the plastic frame 39, so the metal sheet 45 can pass through the plastic frame 39 and form with the light incident surface 341 of the light guide plate 34. Angle a.

背光模块30之中，以发光二极管42作为光源。实施上，发光二极管42属于一光源组40，光源组40还包括一电路板41。发光二极管42的主要发光体为一芯片，其整体则以所述芯片为主的一封装构造；而电路板41则具有操作发光二极管42时所需的电路，二者通常分别制作完成后，再将发光二极管42装设于电路板41上而完成光源组40。In the backlight module 30 , light emitting diodes 42 are used as light sources. In practice, the light emitting diodes 42 belong to a light source group 40 , and the light source group 40 also includes a circuit board 41 . The main illuminant of the light emitting diode 42 is a chip, and its whole is a packaging structure based on the chip; while the circuit board 41 has the required circuits for operating the light emitting diode 42. The light emitting diodes 42 are installed on the circuit board 41 to complete the light source group 40 .

现有技术中，无论是图1A或是图1B所示的光源组20都具有严重的热堆积问题。而本发明通过金属片45的反射功能，光源组40不需要贴近导光板34或是导光板上方的多层光学膜片35，如此一来，由于光源组40中产生热能的一部分——发光二极管42的发光面不再贴近导光板34，所以导光板34可能劣化甚或融化或者导光板34及其上方的光学膜片35黄化等问题，都得以迎刃而解。金属片45不但可使得发光二极管42较远离导光板34的入光面341，且可提供一散热途径，以将热能引导至底座32而排出。因此，本发明背光模块30不但热能不易堆积于其中，且散热的传导效果也较现有技术进步许多。In the prior art, no matter the light source group 20 shown in FIG. 1A or FIG. 1B has a serious heat accumulation problem. In the present invention, through the reflective function of the metal sheet 45, the light source group 40 does not need to be close to the light guide plate 34 or the multilayer optical film 35 above the light guide plate. The light-emitting surface of 42 is no longer close to the light guide plate 34, so the problems that the light guide plate 34 may deteriorate or even melt, or the light guide plate 34 and the optical film 35 above it yellow, etc., can be easily solved. The metal sheet 45 can not only keep the light emitting diodes 42 far away from the light incident surface 341 of the light guide plate 34 , but also provide a heat dissipation path to guide the heat energy to the base 32 to be discharged. Therefore, the backlight module 30 of the present invention is not only difficult to accumulate heat energy therein, but also has much better conduction effect of heat dissipation than the prior art.

电路板41可设置于基板321的第二面321b，实施上，如图3A与图3B所示，可利用冲压成型的方式，对基板321的第二面321b冲压出一凹陷部，以容纳电路板41，而孔洞321c也可由所述冲压成型的步骤制出。组装时，发光二极管42承载于电路板41之上，正好可通过孔洞321c而使其光线射向金属片45。The circuit board 41 can be disposed on the second surface 321b of the substrate 321. In practice, as shown in FIG. 3A and FIG. The plate 41, and the hole 321c can also be made by the stamping step. When assembled, the light emitting diode 42 is carried on the circuit board 41 , and its light can be irradiated to the metal sheet 45 through the hole 321 c.

由于电路板41是设置在第二面321b，换句换说，其并非设置于背光模块30的内部空间，因此散热效果较现有技术有明显地进步，实施上，可将一导热硅胶43设置于电路板41与基板321之间，以加强散热效果。Because the circuit board 41 is arranged on the second surface 321b, in other words, it is not arranged in the inner space of the backlight module 30, so the heat dissipation effect is significantly improved compared with the prior art. In practice, a heat-conducting silica gel 43 can be installed between the circuit board 41 and the substrate 321 to enhance the heat dissipation effect.

除了在散热的效果之外，若考虑光学上的效果，则在本发明一实施例中，也可将一反射片36或一反射材料，设置于基板321的第一面321a，且反射片36或反射材料位于基板321与导光板34之间，或者其它可能漏光处，如此则可使得背光模块30整体的光线使用率提高。而金属片45的表面可为粗糙面，特别是朝向发光二极管42的表面可为粗糙面，可使得光线扩散反射，而提高背光模块30的光线的均匀性。In addition to the effect of heat dissipation, if the optical effect is considered, in one embodiment of the present invention, a reflective sheet 36 or a reflective material may also be arranged on the first surface 321a of the substrate 321, and the reflective sheet 36 Or the reflective material is located between the substrate 321 and the light guide plate 34 , or other places where light may leak, so that the overall light utilization rate of the backlight module 30 can be improved. The surface of the metal sheet 45 can be a rough surface, especially the surface facing the LED 42 can be a rough surface, which can diffuse and reflect the light and improve the uniformity of the light of the backlight module 30 .

请参照图3C，为本发明另一实施例侧剖面示意图。其中，背光模块30’的组件大体上类似于图3A与图3B的背光模块30，然而，背光模块30’还包括一蓄热块49，蓄热块49接触于金属片45、基板321以及延伸部323。如此一来，金属片45所提供给发光二极管42的散热途径将可具有更好的散热效果，热能将更有效率地被引导至底座，而排出背光模块30’。在另一实施例中，蓄热块49也可仅接触于金属片45以及基板321，也会有加强散热效果的作用。Please refer to FIG. 3C , which is a schematic side sectional view of another embodiment of the present invention. Wherein, the components of the backlight module 30' are substantially similar to the backlight module 30 shown in FIG. 3A and FIG. Section 323. In this way, the heat dissipation path provided by the metal plate 45 for the light emitting diode 42 will have a better heat dissipation effect, and the heat energy will be guided to the base more efficiently and discharged out of the backlight module 30'. In another embodiment, the heat storage block 49 may also only be in contact with the metal sheet 45 and the base plate 321 , which will also enhance the heat dissipation effect.

综上所述，本发明确实已改善现有侧端入光型背光模块的热堆积问题，依据本发明，侧端入光型背光模块之中的导光板，其因为发光二极管发光面的热能堆积而劣化甚或融化的可能性已可避免，此外，导光板及其上方的光学膜片因热能而变质黄化的缺点已在本发明得到克服。In summary, the present invention has indeed improved the heat accumulation problem of the existing side-illuminated backlight module. According to the present invention, the light guide plate in the side-illuminated backlight module is due to the heat accumulation on the light-emitting surface of the LED. The possibility of deterioration or even melting can be avoided. In addition, the shortcoming of deterioration and yellowing of the light guide plate and the optical film above it due to heat energy has been overcome by the present invention.

上述实施例仅用于说明本发明，而并非用于限定本发明。The above-mentioned embodiments are only used to illustrate the present invention, but not to limit the present invention.