CN1963643A - Bonding apparatus and system for liquid crystal display device - Google Patents
- ️Wed May 16 2007
CN1963643A - Bonding apparatus and system for liquid crystal display device - Google Patents
Bonding apparatus and system for liquid crystal display device Download PDFInfo
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Publication number
- CN1963643A CN1963643A CNA2006101382846A CN200610138284A CN1963643A CN 1963643 A CN1963643 A CN 1963643A CN A2006101382846 A CNA2006101382846 A CN A2006101382846A CN 200610138284 A CN200610138284 A CN 200610138284A CN 1963643 A CN1963643 A CN 1963643A Authority
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- China Prior art keywords
- mounting plate
- compression system
- upper mounting
- present
- lower platform Prior art date
- 2002-03-08 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
Abstract
A bonding apparatus for fabricating a liquid crystal display device includes a vacuum chamber for bonding first and second substrates together, an upper stage and a lower stage oppositely arranged in an upper space and a lower space of the vacuum chamber, and a pressure application system coupled to one of the upper and lower stages for applying first and second pressures to different parts of the one of the upper and lower stages.
Description
The application is that the application number submitted in China on February 20th, 2003 is dividing an application of 03105412.9 the application that is entitled as " binding appts and the system that are used to make liquid crystal indicator ", and described application is incorporated with for referencial use at this.
The application requires respectively the Korean application Nos.P2002-0012410, the P2002-0012439 that submit on March 8th, 2002, on March 8th, 2002 and on March 20th, 2002 and the rights and interests of P2002-0015081, in this article by with reference in addition combination.
Technical field
The present invention relates to a kind of binding appts, relate in particular to a kind of binding appts and system that is used to make liquid crystal indicator.
Background technology
Increase along with to the requirement of display device has proposed multiple panel display board device, such as LCD (LCD), Plasmia indicating panel (PDP), ELD electroluminescent display (ELD) and vacuum fluorescent display (VFD).Generally replace traditional cathode ray tube (CRT) device as mobile display, because the picture quality of LCD device excellence, light weight, thin outward appearance and low power consumption with the LCD device.In addition, exploitation such as the mobile model LCD that is used for notebook computer is used for that televisor receives and the display of broadcast signal, and as the monitor of computing machine.
Although the multiple technologies that have been the LCD device development,, the work that is used to strengthen the picture quality of LCD device is contradiction.Therefore, for the LCD device as general display device, the LCD device must have high image quality, i.e. high definition and brightness, and must be large scale and keep the characteristics of light weight, thin outward appearance and low power consumption.
Can make the LCD device with the LCD injection, wherein, with a substrate being formed with sealant pattern on it under vacuum with another base plate bonding, through injection orifice to wherein injecting liquid crystal material.Perhaps, can make the LCD device with the liquid crystal drip-injection method, as the open Nos.H11-089612 of Japanese Patent Laid and H11-172903 are disclosed, wherein, a substrate and another substrate of the liquid crystal that instiled on it are provided, and two base plate bondings vertically staggered relatively together.In these two methods, the advantage of liquid crystal drip-injection method can directly be distributed to different elements on the substrate surface.
Fig. 1 is according to prior art, the sectional view of LCD binding appts during load module.Among Fig. 1, binding appts is provided with
framework10,
upper mounting plate21,
lower platform22, sealant exit portion (not shown), liquid crystal drip-
injection part30,
upper chamber portion31,
bottom section32, chamber
mobile system40 and the platform
mobile system64 that forms profile.Sealant exit portion (not shown) and liquid crystal drip-
injection part30 are attached on the side of
framework10, upper and
lower chamber part31 and 32 is separated from each other.
Chamber
mobile system40 comprises: driving motor, be used for optionally
bottom section32 being moved to the position during the bonding program, and perhaps move to and carry out that sealant discharges and the position of the instillation of liquid crystal material.
Platform
mobile system64 is provided with motor,
axle61,
shell62,
line slideway63, ball-
screw65 and nut shell 66.
Upper mounting plate21 is kept by the
axle61 that is attached on the shell 66.
Shell66 usefulness line slideways are attached on the
framework67, and
motor64 is attached on the
support68 on the
framework67, are used for along direction
drive nut shell66 up and down.With ball-
screw65 and
nut shell66 transmission driving powers,
nut shell66 is connected with
shell66 through
side pressure element69.
Explain the process steps of making LCD according to prior art with binding appts now.At first,
upper substrate51 is loaded on the
upper mounting plate21,
infrabasal plate52 is loaded on the lower platform 22.Therefore, as shown in Figure 1, the bottom section criminal that will have
lower platform22 with chamber
mobile system40 moves to the position that is used for sealant coating and liquid crystal drip-injection.
Below, as shown in Figure 2, when finishing sealant coating and liquid crystal drip-injection with sealant exit portion (not shown) and liquid crystal drip-
injection part30,
bottom section32 is moved to the position that is used for bonding upper and
lower platform51 and 52 with chamber mobile system 40.Then, aim at upper and
lower chamber unit31 and 32, upper and
lower chamber part31 and 32 is attached together to form airtight chamber with chamber mobile system 40.Below, reduce airtight indoor pressure with at airtight indoor generation vacuum state with vacuum system.Then,
axle61 is moved in a downward direction, upper and
lower substrate51 and 52 is bonded together thereby
upper mounting plate21 moved to motor 64.
Load cell69 plays pressure transducer, is used for the load
signal control motor64 that produces with reference to load cell 69.Therefore, the value that the amount control bit of loading pressure can be preset.
Yet, following problem is arranged according to the binding appts of prior art.At first, after the repeated use cycle, be used to make the change in location of
upper mounting plate21 along the system that direction up and down moves.Therefore, take place because of the mistake due to upper mounting plate smooth.In addition, because the
transmission shaft65 of platform mobile system receives driving force from driving
motor64,, before initial treatment, be difficult to realize the accurate smooth setting of
upper mounting plate21 so that
upper mounting plate21 is moved in a downward direction with accurate power.
The second, the wearing and tearing of the special part of
upper mounting plate21 can cause the special part place of upper and
lower substrate51 and 52 bonding bad.Therefore, when the difference in height that takes place along the lower surface of
upper mounting plate21, upper and
lower substrate51 and 52 bonding be defective.For example, as shown in Figure 3, during bonding upper and
lower substrate51 and 52, the disperse of liquid crystal material LC distributes not exclusively.Therefore, between adjacent seals agent part, form gap S, thereby stop the disperse of liquid crystal material LC equalization.For example, when a part that falls to having the
infrabasal plate52 of liquid crystal material LC thereon is higher than the part of sealant, even when being coated with the insufficient pressurized of the part of sealant thereon, load cell 69 (among Fig. 1 and 2) also is read as upper and
lower substrate51 and 52 bonding fully.Like this, the insufficient pressurized of sealant, hermetic unit breaks.The sealing of breaking causes the bonding inappropriate of upper and
lower substrate51 and 52, and surrounding air is infiltrated in the device.
Summary of the invention
The present invention relates to a kind of binding appts, be used to make liquid crystal indicator, it has avoided the restriction of prior art and the one or more problems due to the shortcoming substantially.
An object of the present invention is to provide binding appts, be used to make liquid crystal indicator, it can and compensate poor between a plurality of parts of a plurality of platforms in measuring table flatness before the base plate bonding.
Another object of the present invention is to provide additional device for exerting at the binding appts that is used for making liquid crystal indicator,, can apply the power of increase to the specified portions of bonding metacoxal plate here.
Other characteristics of the present invention and advantage are described in the following description, can from describe, part understand, perhaps can know from the practice of the present invention.Realize and obtain purpose of the present invention and other advantage with the structure that particularly points out in written description and claim and the accompanying drawing.
In order to realize these and other advantage and to follow purpose of the present invention, as concrete and general description, be used for the additional compression system of first and second base plate bondings binding appts is together comprised the removable mask of exerting pressure to have a plurality of juts of prominent sealant region to first or second substrate.
Knowing that above-mentioned general description and following detailed all are exemplary and indicative, is in order to provide the of the present invention further explanation as claim.
Description of drawings
Comprise and be used to provide further understanding of the present invention and comprise and constitute its a part of accompanying drawing in this manual with working to explain that the description of the principle of the invention illustrates embodiments of the invention.Among the figure:
Fig. 1 is according to prior art, the sectional view of the LCD binding appts during load module;
Fig. 2 is according to prior art, the sectional view of the LCD binding appts during bonding program;
Fig. 3 is according to prior art, the amplification sectional view of the LCD binding appts during bonding program;
Fig. 4 is the skeleton view according to example compression system of the present invention;
Fig. 5 is the sectional view according to the example compression system in the vacuum chamber of the present invention;
Fig. 6 is according to the present invention, the sectional view of the compression system before bonding program;
Fig. 7 is according to the present invention, the sectional view of compression system during bonding program;
Fig. 8 is the sectional view that replenishes compression system according to example of the present invention;
Fig. 9 is the skeleton view according to additional compression system of the present invention;
Figure 10 is according to the present invention, the sectional view of the additional compression system before bonding program;
Figure 11 is according to the present invention, the sectional view of the additional compression system during bonding program;
Figure 12 is the planimetric map according to another additional compression system of the present invention;
Figure 13 is that explanation shows the planimetric map that replenishes compression system according to another example of the present invention;
Figure 14 is the planimetric map that replenishes compression system according to another example of the present invention;
Figure 15 is the perspective exploded view of replenishing compression system according to another example of the present invention;
Figure 16 is according to the present invention, the sectional view of another the additional compression system before bonding program;
Figure 17 is according to the present invention, replenishes the sectional view of compression system during bonding program; With
Figure 18 is the amplification sectional view according to example stationary of the present invention system.
Embodiment
Quote most preferred embodiment of the present invention now in detail, with the description of drawings example.
Fig. 4 is the skeleton view according to example compression system of the present invention.Among Fig. 4, compression system can be positioned in the
vacuum chamber100, be used for bonding upper and
lower substrate510 and 520.Compression system can comprise upper space and interior
upper mounting plate210 and the
lower platform220 of lower space that is positioned at vacuum chamber 100.In addition, compression system can comprise main compression system and a plurality of additional
compression system.Platform210 and 220 core above and/or under main compression system can be positioned at are used for during adhesion process upwards and
infrabasal plate510 and 520 is exerted pressure.
Main compression system can comprise:
main screw axis311 is used to make main compression system edge direction up and down to move;
Driver motor312 is used to make
main screw axis311 edge directions up and down to move;
Nut shell313 is with
main screw axis311 couplings connection; With main
movable axle314, be connected with nut shell 313.
Driver motor312 can and can be attached on the framework (not shown) with
main screw axis311 couplings connection.Main
movable axle314 can be connected with the core of the top surface of
upper mounting plate210, perhaps can be connected with the core of the basal surface of lower platform 220.In addition, main compression system can comprise
main load cell315, is used for changing applied pressure by main
movable axle314, and can be attached on the
main screw axis311.
Additional compression system can be adhered to along the outer surface of upper and
lower platform210 and 220, is used for applying compensatory pressure or additonal pressure during the adhesion process of upper and
lower substrate510 and 520.Additional compression system can comprise at least one
secondary screw axis321, at least one
secondary driving motor322, with the
nut shell323 of
secondary screw axis321 couplings connection, with secondary
movable axle324 and at least one secondary load cell 325 of
nut shell323 couplings connection.
Secondary screw axis321 can join with
secondary driving motor322 couplings, and
secondary driving motor322 can be attached on the framework (not shown).
Secondary driving motor322 can be optionally along up and down direction displaced
spirals axle321, be used for during adhesion process upwards and
infrabasal plate510 and 520 is exerted pressure.Secondary
movable axle324 can adhere to along the outer peripheral portion of the top surface of
upper mounting plate210, perhaps can adhere to along the outer peripheral portion of the basal surface of lower platform 220.For example, each secondary
movable axle324 can be at each angle of
upper mounting plate210 or the pars intermedia office of the minor face of the center section on the long limit of
upper mounting plate210 or
upper mounting plate210 be attached on the upper surface of upper mounting plate 210.In addition, each secondary
movable axle324 can be at each angle of
lower platform220 or the pars intermedia office of the minor face of the center section on the long limit of
lower platform220 or
lower platform220 be attached on the basal surface of lower platform 220.Therefore, can carry out the change in location formation compensation of upper and
lower platform210 and 220 because of the uneven wear of upper and
lower platform210 and 220.
Secondary load cell 325 can be connected with
secondary screw axis321 with change and is applied to pressure on the secondary screw axis 321.
Main load cell315 can be connected with a controller (not shown) or each controller (not shown) with secondary load cell 325, to be controlled at the operation of binding appts by transmission feedback/control signal.
In addition, can provide flatness measuring system (not shown),, be used for determining that the specific position place of upper and
lower platform210 and 220 takes place departs from or wear and tear such as position transducer (optical sensor), indicating gauge and feeling of stress machine-glazed paper.Can be attached to the inside or the outside of
vacuum chamber100 such as the multiple position transducer of optical sensor.Therefore, sensor provides the real-time measurement that departs from.
In the compression system of binding appts of the present invention, driving
motor312 and 322 can be attached on the framework (not shown), perhaps be attached on the outer wall of
vacuum chamber100, wherein,
movable axle314 can be connected with 220 with upper and
lower platform210 with 324, and they can be by the top or the bottom of vacuum chamber 100.Like this, upper and
lower platform210 and 220 can receive driving force with
nut shell313 and 323 through
screw axis311 and 321 respectively.Therefore, can seal the part of the
vacuum chamber100 that joins with
movable axle314 and 324 couplings, be used for during adhesion process, keeping the vacuum state of
vacuum chamber100.
Binding appts of the present invention can comprise:
main screw axis311 is used for moving
upper mounting plate210 along direction up and down; With 4
secondary screw axis321, be used to provide because of
upper mounting plate210 lacks the correction that flatness caused, and be used for before the starting stage of beginning adhesion process, setting the flatness reference value of upper mounting plate 210.Therefore, when taking place because of the prolongation use or wearing and tearing departing from of causing, can during adhesion process, apply different pressure.
Explain the instantiation procedure of binding appts adhesive base plate of the present invention now.
Fig. 5 is the sectional view according to the example compression system of the present invention in vacuum chamber.Among Fig. 5, when repeating to drive binding appts, can wear and tear upper and
lower platform210 and 220.Therefore, upper and
lower platform210 can be not exclusively parallel with 220 surface.When the special part of determining
upper mounting plate210 when small part is worn and torn, departure degree S and the position coordinates that depart from part can be stored in the controller (not shown).
Fig. 6 is according to the present invention, the sectional view of compression system before bonding program.Among Fig. 6, when starting binding appts, can substrate 510 and 520 be loaded on upper and
lower platform210 and 220 with
mechanical arm300, upper and
lower platform210 and 220 is positioned at respectively in the vacuum chamber 100.Then, after respectively
substrate510 and 520 being loaded on upper and
lower platform210 and 220, can sealed
vacuum chamber100.
Fig. 7 is according to the present invention, the sectional view of the compression system during bonding program.Among Fig. 7, the
vacuum chamber100 of can finding time, the controller (not shown) can drive driving
motor312 and 322, so that the
screw axis311 and 321 that is connected with
upper mounting plate210 moves in a downward direction.During with controller
drives screw axis311 and 321, can determine the departure degree S of the special part of upper and
lower platform210 and 220.Then, can calculate the desired offset R of departure degree, can determine the position of departing from, be used for set that a
secondary screw axis321 moves down apart from the time compensation calculate value R.The calculating and the compensation method of offset be can carry out with auto-programming and automatic program control (not shown), calculating and the compensation method of carrying out offset with individual's manual operation perhaps can be calculated by hand.
During adhesion process, be attached to the amount that
load cell315 and 325 on main compression system and the additional compression system can continue to measure the pressure of
screw axis311 and 321 supplies of secondary screw axis.Therefore,
load cell315 and 325 can provide feedback signal to be transferred to the control signal of driving
motor312 and 322 with change to the controller (not shown).Like this,
load cell315 and 325,
screw axis311,
secondary screw axis321 and driving
motor312 and 322 can compensate irrelevance S (among Fig. 5).
For example, compare with the other parts of
upper mounting plate210 when the special angle part of
upper mounting plate210 and to depart from about 2mm, the controller (not shown) can be set the rotation amount of
secondary screw axis321, makes secondary
movable axle324 on the special angle part be attached to
upper mounting plate210 can move the distance corresponding to 2mm bias in a downward direction.In addition,
nut shell323 can move in a downward direction according to rotation amount, and purpose is that secondary
movable axle324 is moved in a downward direction.Therefore, after additional compression system compensation departs from, can drive driving
motor312 and 322 according to compensation settings, thereby
substrate510 and 520 is bonded together.
In addition, if the part of the upper mounting plate that departs from 210 is positioned at the office, bight of
upper mounting plate210, but, can compensate the setting value of the
driving motor322 of adjacent pair
movable axle324 at the part place that is positioned the
upper mounting plate210 between the adjacent pair
movable axle324.
Fig. 8 is the sectional view that replenishes compression system according to example of the present invention.Among Fig. 8, additional compression system can comprise upper and
lower platform210 and 220, and wherein,
upper mounting plate210 can comprise pressing
part410, at least one raise
axle420 and at least one drive part 430.Similarly, though do not show,,
lower platform220 can also comprise pressing part, at least one raise axle and at least one drive
part.Pressing part410 can form a unit, is used for by applying displacing force from the
axle420 that raises moving along direction up and down.The
axle420 that raises can pass through
upper mounting plate210, and
upper mounting plate210 can comprise that along the working face of
upper mounting plate210 promptly the depression 211 of basal surface location is used to hold pressing part 410.
Pressing part410 can comprise the material that prevents that
upper substrate510 from scratching.
Upper and
lower substrate510 that is pressed down by
pressing part410 and 520 part can comprise the superincumbent sealant material of coating, perhaps can comprise forming superincumbent virtual region.The depression 211 that is formed in the
upper mounting plate210 can be coated with sealant thereon corresponding to the part of upper and
lower substrate510 and 520, and the depression 211 that perhaps is formed in the
upper mounting plate210 can be corresponding to virtual region.
430 can move through the
axle420 edge directions up and down that raise.
Drive part430 can comprise hydraulic pressure or air pressure cylinder or the motor that is used to exert pressure.Can determine the sum of drive part, purpose be equably with the pressure transmission of
drive part430 to pressing
part410.
Fig. 9 is the skeleton view according to additional compression system of the present invention.Among Fig. 9, pressing
part410 can comprise the array of the crossbeam that interconnects.Each
drive part430 can be through the angle of raise
axle420 and the crossbeam of outermost and is connected at the infall of interior crossbeam.
Figure 10 is according to the present invention, the sectional view of the additional compression system before bonding program.Among Figure 10, during adhesion process, in case upper and
lower substrate510 and 520 is loaded on upper and
lower platform210 and 220
vacuum chamber100 of just can finding time respectively.Then, main compression system just can mobile in a downward direction
upper mounting plate210, thereby the upper and
lower substrate510 and 520 that remains on respectively on upper and
lower platform210 and 220 is bonded together.
Figure 11 is according to the present invention, the sectional view of the additional compression system during bonding program.Among Figure 11, during adhesion process is carried out, can start additional compression system.For example, along with controller (not shown) controlling and driving
part430, drive
part430 can move the
axle420 that raises in a downward direction, and this controller separates with the controller (not shown) of the
driver motor312 that is used for main compression system.Below, along with the
axle420 that raises moves in a downward direction, the depression 211 interior
pressing parts410 that are positioned at
upper mounting plate210 can be prominent to a height from 211 (the Fig. 8) that cave in.Therefore,
pressing part410 can be from the baseplane projection of upper mounting plate 210.Like this, the special part of the
upper substrate510 relative with
pressing part410 can be provided with the pressure of the other parts that are higher than
upper substrate510, makes that the special part of
upper substrate510 can be more bonding with
second substrate520 more tightly than the other parts of upper substrate.For example, the special part that is provided with the
upper substrate510 of high pressure can comprise sealant material and/or dividing plate, and the other parts that are provided with the
upper substrate510 of low-pressure can comprise liquid crystal material.
One finishes adhesion process, and main compression system just can mobile in the upward direction upper mounting
plate210, and the
drive part430 that replenishes the compression system device can move in the upward direction to raise and
spools420 cave in 211 so that
pressing part410 is received into.In addition, along with discharging
upper substrate520 is appended on the upper mounting
plate210,
upper substrate520 separates with upper mounting
plate210, thereby bonding back upper and
lower substrate510 and 520 can remain on
lower platform220 places.Below, can remove bonding back upper and
lower substrate510 and 520 from
vacuum chamber100 making with the mechanical arm (not shown) after
vacuum chamber100 returns atmospheric pressure.
Needn't only during adhesion process, utilize and replenish compression system according to example of the present invention.For example, can after finishing substrate bonding, utilize according to additional compression system of the present invention.
Figure 12 is the planimetric map according to another additional compression system of the present invention.Among Figure 12, additional compression system can comprise: upper mounting
plate210, have a plurality of
pressing parts410, and be used to make each unit area pressurized that is coated with sealant material on it; With a plurality of
drive parts430, be connected with
pressing part410 through a plurality of risings axle 420.Therefore, because the eroded area of upper mounting
plate210, can each unit area of separate compensation.The advantage of replenishing compression system is and can only exerts pressure to the special element zone when being necessary to apply additonal pressure.
Figure 13 has illustrated and has shown the planimetric map that replenishes compression system according to another example of the present invention.Among Figure 13, additional compression system can comprise: upper mounting
plate210, a plurality of
pressing parts410 are arranged, with make be coated with sealant material on it respectively organize the unit area pressurized; With a plurality of
drive parts430, be connected with
pressing part410 through a plurality of risings axle 420.Therefore, because the eroded area of upper mounting
plate210, can every group of independent unit area of separate compensation.The advantage of replenishing compression system is and can only exerts pressure to the unit area of specific group when being necessary to apply additonal pressure.
Figure 14 is the planimetric map that replenishes compression system according to another example of the present invention.Among Figure 14, additional compression system can be used and the consistent form of sealant part, exerts pressure to the part that is coated with sealant of multi-form different substrate model.For example, can realize different sealing agent coating multi-form consistent selection projection partly by pressing
part410 being divided into a plurality of and optionally start these pieces by each
drive part430 and the
axle420 that raises with the different substrate model.
Figure 15 is the perspective exploded view of replenishing compression system according to another example of the present invention.Among Figure 15, additional compression system can comprise the
removable mask600 of exerting pressure, and it can be used for upper mounting
plate210 or
lower platform220, and
jut610 is from requiring to apply more each part projection of high pressure than other parts.Therefore, after finishing adhesion process, can apply to upper mounting
plate210 and exert
pressure mask600 and do not remove bonding back first and
second substrates510 and 520.In addition, can apply the
mask600 of exerting pressure, wherein, bonding back first and
second substrates510 and 520 can be placed on the top of the
mask600 of exerting pressure, apply the pressure of repetition once more to special part to
lower platform220.
The
mask600 of exerting pressure can comprise the system that covers whole upper mounting
plate210 that do not require.In this case, can be along the whole basal surface of upper mounting
plate210, promptly form a plurality of coupling connection groove (not shown), the projection with height of requirement can be inserted a plurality of couplings that can require in the stressed difference of heavy dressing and join in one of grooves with
lower platform220 facing surfaces.
Figure 16 is according to the present invention, the sectional view of another the additional compression system before bonding program.Among Figure 16, can be attached on the upper mounting
plate210 with fixed
system620
mask600 of will exerting pressure, the
mask600 that is used to prevent to exert pressure drops out upper mounting
plate210 during the adhesion process to first and
second substrates510 and 520.Fixed
system620 can comprise:
hook621 is formed on exert
pressure mask600 or the upper mounting
plate210; (catch) 622 that catch is formed on another of exert
pressure mask600 and upper mounting plate 210.Perhaps, can be fixed on the upper mounting
plate210, as shown in figure 18 with screw 624
mask600 of will exerting pressure.
The
mask600 of exerting pressure according to the present invention can be not limited to separate so that the system that cooperates with upper mounting
plate210 with upper mounting plate 210.For example, the
mask600 of exerting pressure can for good and all join with upper mounting
plate210 couplings, makes and can not remove the
mask600 of exerting pressure during the vacuum bonding process.Therefore, the
mask600 of exerting pressure can comprise the structure that allows vacuum suction or Electrostatic Absorption, and the
substrate510 of winning can be loaded on the upper mounting
plate210.
Explain that now the present invention with replenishing compression system, replenishes the instantiation procedure of exerting pressure to first and second substrates in series of steps, this series of steps is used for additional the exerting pressure of sealant the area of application to bonding back first and second substrates.
Figure 17 is according to the present invention, replenishes the sectional view of compression system during bonding program.Among Figure 17,, in the time of perhaps can requiring the entire portion of bonding back first and
second substrates510 and 520, can the
mask600 of exerting pressure according to the present invention be attached on the upper mounting
plate210 with the fixed system (not shown) when exerting pressure to special part.When the
mask600 of exerting pressure is attached on the upper mounting
plate210, can make the
driver motor312 of main compression system can move the
main screw axis311 that is connected with upper mounting
plate210 in a downward direction.Therefore, the
mask600 of exerting pressure can be pressed downwardly onto on first and
second substrates510 and 520 of bonding back again.Like this, with the special part of bonding back first and
second substrates510 and 520, that is, sealant coating part is compared, and the
jut610 of the
mask600 of exerting pressure can be to lower process, with bonding special part tightly.
Below, when finishing additional exerting pressure, can drive the
driver motor312 of main compression system once more, mobile in the upward direction upper mounting plate 210.Therefore, in case upper mounting
plate210 moves fully in the upward direction, just can be with the mechanical arm (not shown) from the bonding back of
vacuum chamber100 unloadings first and
second substrates510 and 520, a pair of first and second substrates that can be bonding are loaded on the
vacuum chamber100, to repeat adhesion process and additional exerting pressure.
The
mask600 of exerting pressure according to the present invention also can provide the compensating operation that departs to the special part place generation of upper and
lower platform210 and 220.For example, when the special part of worn and torn upper and
lower platform210 and 220, the
mask600 of exerting pressure can comprise the jut 310 at the special part place that is positioned at upper and
lower platform210 and 220, thereby compensates departing from that the wear branch of upper and
lower platform210 and 220 causes.
For those skilled in the art, clearly, can in LCD binding appts of the present invention, carry out numerous modifications and variations and do not deviate from the spirit or scope of the present invention.Like this, the present invention can cover modifications and variations of the present invention, as long as they are within the scope of claim of being added and equivalents thereof.
Claims (4)
1, a kind of being used for is characterized in that the additional compression system of first and second base plate bondings binding appts together, comprising:
The removable mask of exerting pressure has a plurality of juts to the sealant region projection of first or second substrate.
2, system according to claim 1 is characterized in that, the removable mask adhesion of exerting pressure is on the upper mounting plate or lower platform of binding appts.
3, system according to claim 2 is characterized in that, the removable mask of exerting pressure comprises and the hook that is formed on the engagement of catching in the upper and lower platform.
4, system according to claim 2 is characterized in that, the removable mask of exerting pressure comprise be formed on upper and lower platform in the fixed orifice aimed at of attachment hole.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020012410 | 2002-03-08 | ||
KR1020020012439 | 2002-03-08 | ||
KR1020020015081 | 2002-03-20 | ||
KR1020020015081A KR100720417B1 (en) | 2002-03-20 | 2002-03-20 | Vacuum bonding device for liquid crystal display device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03105412A Division CN100592171C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus for liquid crystal display device and the system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1963643A true CN1963643A (en) | 2007-05-16 |
CN100456113C CN100456113C (en) | 2009-01-28 |
Family
ID=32225515
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101382846A Expired - Fee Related CN100456113C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
CNB2006101382850A Expired - Fee Related CN100449382C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101382850A Expired - Fee Related CN100449382C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100720417B1 (en) |
CN (2) | CN100456113C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102347209A (en) * | 2010-07-27 | 2012-02-08 | 台湾积体电路制造股份有限公司 | Substrate bonding system and modification method of bonding system design |
CN115167041A (en) * | 2022-08-02 | 2022-10-11 | 辛集冀雅电子有限公司 | Processing equipment and processing method for liquid crystal display crystal box |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101437873B1 (en) * | 2012-12-27 | 2014-09-05 | 엘아이지에이디피 주식회사 | Apparatus for attaching substrates |
KR101437872B1 (en) * | 2012-12-27 | 2014-09-05 | 엘아이지에이디피 주식회사 | Method for attaching substrates |
KR102401042B1 (en) * | 2015-08-25 | 2022-05-24 | 엘지전자 주식회사 | Glass substrate bonding device |
JP6737575B2 (en) * | 2015-09-30 | 2020-08-12 | Aiメカテック株式会社 | Board assembly system, board assembly apparatus used in the system, and board assembly method using the system |
CN114211743A (en) * | 2021-12-16 | 2022-03-22 | 江苏唯侓机器人科技有限公司 | Automatic positioning type actuating mechanism |
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US3629035A (en) * | 1966-12-19 | 1971-12-21 | Minoru Kuroda | Method of forming applique designs |
US4557889A (en) * | 1981-09-26 | 1985-12-10 | Kawasaki Yucoh Co., Ltd. | Method and apparatus for producing sheet molding compound parts by compression |
US5231923A (en) * | 1991-07-12 | 1993-08-03 | Sintogokio Ltd. | Press apparatus used for manufacturing a liquid crystal panel |
JPH05307160A (en) * | 1992-04-30 | 1993-11-19 | Ricoh Co Ltd | Apparatus and method for production of liquid crystal display element |
JP2604090B2 (en) * | 1992-06-30 | 1997-04-23 | 信越エンジニアリング株式会社 | Glass substrate bonding equipment for liquid crystal display panels |
US5407519A (en) * | 1993-07-07 | 1995-04-18 | Interserv Corp. | Apparatus for manufacturing liquid crystal display screens |
JP3053535B2 (en) * | 1994-11-09 | 2000-06-19 | 信越エンジニアリング株式会社 | Pressurizing and heating equipment for glass substrates for liquid crystal display panels |
US6001203A (en) * | 1995-03-01 | 1999-12-14 | Matsushita Electric Industrial Co., Ltd. | Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
JPH09281458A (en) * | 1996-04-16 | 1997-10-31 | Toshiba Corp | Pressurizing device |
JP3568862B2 (en) * | 1999-02-08 | 2004-09-22 | 大日本印刷株式会社 | Color liquid crystal display |
JP2001051284A (en) * | 1999-08-10 | 2001-02-23 | Matsushita Electric Ind Co Ltd | Device for manufacturing liquid crystal display device |
JP3483809B2 (en) * | 1999-08-31 | 2004-01-06 | シャープ株式会社 | Substrate bonding method and bonding apparatus, and liquid crystal display device manufacturing method |
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2002
- 2002-03-20 KR KR1020020015081A patent/KR100720417B1/en not_active IP Right Cessation
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2003
- 2003-02-20 CN CNB2006101382846A patent/CN100456113C/en not_active Expired - Fee Related
- 2003-02-20 CN CNB2006101382850A patent/CN100449382C/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102347209A (en) * | 2010-07-27 | 2012-02-08 | 台湾积体电路制造股份有限公司 | Substrate bonding system and modification method of bonding system design |
CN102347209B (en) * | 2010-07-27 | 2015-09-09 | 台湾积体电路制造股份有限公司 | Substrate bonding system and modification method of bonding system design |
US9299594B2 (en) | 2010-07-27 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate bonding system and method of modifying the same |
US9978628B2 (en) | 2010-07-27 | 2018-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonding method including adjusting surface contours of a bonding system |
CN115167041A (en) * | 2022-08-02 | 2022-10-11 | 辛集冀雅电子有限公司 | Processing equipment and processing method for liquid crystal display crystal box |
CN115167041B (en) * | 2022-08-02 | 2023-07-14 | 辛集冀雅电子有限公司 | Liquid crystal screen crystal box processing equipment and processing method |
Also Published As
Publication number | Publication date |
---|---|
CN100456113C (en) | 2009-01-28 |
CN1963644A (en) | 2007-05-16 |
KR20030075725A (en) | 2003-09-26 |
CN100449382C (en) | 2009-01-07 |
KR100720417B1 (en) | 2007-05-22 |
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2007-05-16 | C06 | Publication | |
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2007-07-11 | C10 | Entry into substantive examination | |
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