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CN202142578U - High power LED lamp silver based bonding wire packaging structure - Google Patents

  • ️Wed Feb 08 2012

CN202142578U - High power LED lamp silver based bonding wire packaging structure - Google Patents

High power LED lamp silver based bonding wire packaging structure Download PDF

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Publication number
CN202142578U
CN202142578U CN201120211688U CN201120211688U CN202142578U CN 202142578 U CN202142578 U CN 202142578U CN 201120211688 U CN201120211688 U CN 201120211688U CN 201120211688 U CN201120211688 U CN 201120211688U CN 202142578 U CN202142578 U CN 202142578U Authority
CN
China
Prior art keywords
output pin
base
led chip
plying
negative pole
Prior art date
2011-06-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120211688U
Other languages
Chinese (zh)
Inventor
史鹏飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENGZHOU LIGHT VISION CORP
Original Assignee
ZHENGZHOU LIGHT VISION CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
2011-06-22
Filing date
2011-06-22
Publication date
2012-02-08
2011-06-22 Application filed by ZHENGZHOU LIGHT VISION CORP filed Critical ZHENGZHOU LIGHT VISION CORP
2011-06-22 Priority to CN201120211688U priority Critical patent/CN202142578U/en
2012-02-08 Application granted granted Critical
2012-02-08 Publication of CN202142578U publication Critical patent/CN202142578U/en
2021-06-22 Anticipated expiration legal-status Critical
Status Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model relates to a high power LED (Light-Emitting Diode) lamp silver based bonding wire packaging structure, comprising an aluminium substrate base, an LED chip body, an anode output pin and a cathode output pin. The LED chip body is plastered on the upper surface of the aluminium substrate base through colloid; the anode and cathode of the LED chip body are respectively in electric connection with the anode output pin and the cathode output pin through metal lead wires; the anode output pin and the cathode output pin are respectively arranged on two sides above the LED chip body; the aluminium substrate base, the LED chip body, the anode output pin and the cathode output pin are all packed in a plastic-sealed body, and the ends of the anode output pin and the cathode output pin extend from the plastic-sealed body; the upper part and the lower part of the plastic-sealed body are respectively a transparent body and an opaque body; the LED chip body is located in the transparent body; the metal lead wires are silver based bonding wires. The utility model provides a high power LED lamp silver based bonding wire packaging structure which has a simple structure and low costs.

Description

The high-powered LED lamp money base is good for the plying encapsulating structure

(1), technical field: the utility model relates to a kind of LED encapsulating structure, and particularly a kind of high-powered LED lamp money base is good for the plying encapsulating structure.

(2), background technology: energy-conservation is the social concern of various countries, world today common concern with protecting environment, and it directly has influence on the sustainable development of human society.Lighting Industry to direct consumes energy; Hope to realize the green illumination of low energy consumption more; The birth of semiconductor green lighting source is described as the revolution of lighting field; Its sign is that semiconductor light-emitting-diode (LED) progresses into general lighting market as new type light source from special lighting market, and its market prospects are very wide.Fast development along with LED material epitaxy technology and chip technology makes the luminous efficiency of LED improve rapidly, and LED will replace conventional light source to become the green illumination light source of 21 century in the future.

But the LED production technology is comparatively complicated, and cost price is high, causes the LED slower development; At present, LED lamp on the market mostly is to encapsulate with the technology that the strong plying of auri is welded when encapsulating; Because the cost of the strong plying of auri is higher, thereby causes holding at high price of LED lamp.

(3), utility model content:

The technical problem that the utility model will solve is: not enough to prior art, and provide a kind of high-powered LED lamp money base simple in structure, that cost is low strong plying encapsulating structure.

The technical scheme of the utility model:

A kind of high-powered LED lamp money base is good for the plying encapsulating structure; Contain aluminium base base, led chip body, anodal output pin and negative pole output pin; The led chip body sticks on the upper surface of aluminium base base through colloid; The positive pole of led chip body and negative pole are connected electrically on anodal output pin and the negative pole output pin through metal lead wire respectively, and anodal output pin and negative pole output pin are separately positioned on the both sides of led chip body top, and aluminium base base, led chip body, anodal output pin and negative pole output pin all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of anodal output pin and negative pole output pin; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and the led chip body is arranged in the transparent body, and metal lead wire is the strong plying of money base.

The both sides of aluminium base base are arranged in opaque body, and the middle part of aluminium base base, anodal output pin and negative pole output pin are positioned at the intersection of the transparent body and opaque body.

The material of the transparent body is for adding the transparent resin of fluorophor, perhaps for adding the transparent epoxy resin of fluorophor.

The content of silver is 99.99% in the strong plying of money base.

The beneficial effect of the utility model:

1. the utility model only is made up of aluminium base base, led chip body, anodal output pin, negative pole output pin and outside plastic-sealed body thereof; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and it is simple in structure, cost of manufacture is low.

2. the metal lead wire in the utility model is the strong plying of money base, the strong plying cost of the strong relative auri of plying of money base is comparatively cheap, on the production line management more convenient, be difficult for losing; And the strong plying of money base extinction not, up to 90%, can increase the light of

LED lamp

5%-10% to the reflectivity of visible light; The strong plying heat conduction of money base can reduce the temperature of led chip body than very fast, increases its life-span; The strong plying of money base can oxidation in air, and condition of storage is less demanding, and storage period is longer; The conjugation of the weld pad of aluminizing on strong plying of money base and the output pin is higher than the strong plying of auri, and good conductivity is fit to the encapsulation of high-powered LED lamp.

(4), description of drawings:

Fig. 1 is the structural representation of the strong plying encapsulating structure of high-powered LED lamp money base.

(5), embodiment:

Referring to Fig. 1; Among the figure; The strong plying encapsulating structure of high-powered LED lamp money base contains

aluminium base base

4,

led chip body

3,

anodal output pin

2 and negative

pole output pin

8; Led

chip body

3 sticks on the upper surface of

aluminium base base

4 through

colloid

6; The positive pole of led

chip body

3 and negative pole are connected electrically on

anodal output pin

2 and the negative

pole output pin

8 through metal lead wire 1,9 respectively, and

anodal output pin

2 and negative

pole output pin

8 are separately positioned on the both sides of led

chip body

3 tops, and

aluminium base base

4, led

chip body

3,

anodal output pin

2 and negative

pole output pin

8 all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of

anodal output pin

2 and negative

pole output pin

8; The upper and lower of plastic-sealed body is respectively the

transparent body

5 and

opaque body

7, and led

chip body

3 is arranged in the

transparent body

5, and metal lead wire 1,9 is the strong plying of money base.

The both sides of

aluminium base base

4 are arranged in

opaque body

7, and the middle part of

aluminium base base

4,

anodal output pin

2 and negative

pole output pin

8 are positioned at the intersection of the

transparent body

5 and

opaque body

7.

The material of the

transparent body

5 is for adding the transparent resin of fluorophor.

The content of silver is 99.99% in the strong plying 1,9 of money base.

Claims (4)

1. a high-powered LED lamp money base is good for the plying encapsulating structure; Contain aluminium base base, led chip body, anodal output pin and negative pole output pin; The led chip body sticks on the upper surface of aluminium base base through colloid; The positive pole of led chip body and negative pole are connected electrically on anodal output pin and the negative pole output pin through metal lead wire respectively, it is characterized in that: anodal output pin and negative pole output pin are separately positioned on the both sides of led chip body top, and aluminium base base, led chip body, anodal output pin and negative pole output pin all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of anodal output pin and negative pole output pin; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and the led chip body is arranged in the transparent body, and metal lead wire is the strong plying of money base.

2. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure; It is characterized in that: the both sides of said aluminium base base are arranged in opaque body, and the middle part of aluminium base base, anodal output pin and negative pole output pin are positioned at the intersection of the transparent body and opaque body.

3. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure, it is characterized in that: the material of the said transparent body is for adding the transparent resin of fluorophor, perhaps for adding the transparent epoxy resin of fluorophor.

4. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure, it is characterized in that: the content of silver is 99.99% in the strong plying of said money base.

CN201120211688U 2011-06-22 2011-06-22 High power LED lamp silver based bonding wire packaging structure Expired - Fee Related CN202142578U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120211688U CN202142578U (en) 2011-06-22 2011-06-22 High power LED lamp silver based bonding wire packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120211688U CN202142578U (en) 2011-06-22 2011-06-22 High power LED lamp silver based bonding wire packaging structure

Publications (1)

Publication Number Publication Date
CN202142578U true CN202142578U (en) 2012-02-08

Family

ID=45553622

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120211688U Expired - Fee Related CN202142578U (en) 2011-06-22 2011-06-22 High power LED lamp silver based bonding wire packaging structure

Country Status (1)

Country Link
CN (1) CN202142578U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103236486A (en) * 2013-04-22 2013-08-07 立达信绿色照明股份有限公司 LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure
CN103855144A (en) * 2014-01-06 2014-06-11 深圳市瑞丰光电子股份有限公司 LED filament and light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103236486A (en) * 2013-04-22 2013-08-07 立达信绿色照明股份有限公司 LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure
CN103236486B (en) * 2013-04-22 2017-04-26 厦门立达信绿色照明集团有限公司 LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure
CN103855144A (en) * 2014-01-06 2014-06-11 深圳市瑞丰光电子股份有限公司 LED filament and light-emitting device
CN103855144B (en) * 2014-01-06 2016-08-17 深圳市瑞丰光电子股份有限公司 LED filament and light-emitting device

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Legal Events

Date Code Title Description
2012-02-08 C14 Grant of patent or utility model
2012-02-08 GR01 Patent grant
2013-08-14 C17 Cessation of patent right
2013-08-14 CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120208

Termination date: 20120622