CN203517379U - Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates - Google Patents

The utility model relates to a lamp bulb based on inversely-installed LED chips and transparent ceramic substrates. The lamp bulb comprises a lampshade, a positive electrode contact, a lamp base, a heat conducting column, a radiating body, a positive electrode wire and a negative electrode wire, and is characterized in that connecting parts are arranged at the lower end of the heat conducting column, the transparent ceramic substrates are installed on the outer-side planes of the connecting parts, 10-80-degree angles are formed between the transparent ceramic substrates and the horizontal plane, the front faces of the transparent ceramic substrates are provided with circuit layers, the inversely-installed LED chips are packaged on the circuit layers, and the circuit layers are respectively connected with the positive electrode wire and the negative electrode wire. The connecting parts, the heat conducting column and the radiating body are of an integrated structure, so that the heat conducting effect is good; eutectic soldering is adopted for the transparent ceramic substrates and the connecting parts, so that installation is firm, and heat transmission is good; the slant design of the transparent ceramic substrates is adopted, so that the light emitting angle is larger; due to the fact that the transparent ceramic substrates are transparent, LEDs can emit light in all directions, and high-efficiency light emitting is achieved; light-emitting bodies can further be manufactured to be in different shapes, and the lamp bulb is attractive.

A kind of bulb based on flip LED chips and crystalline ceramics substrate

Technical field

The utility model belongs to LED lighting apparatus field, specifically relates to a kind of bulb based on flip LED chips and crystalline ceramics substrate, and bulb can omnibearing luminous illumination.

Background technology

LED is as a kind of novel green light source, owing to having, energy-saving and environmental protection, extra long life, volume are little, fast response time, light efficiency is high and luminescent spectrum and the controlled unrivaled advantage of the more high conventional light source of colorfulness that makes of energy gap, has become the high-technology field that 21 century has development prospect most.

Flip LED chips is compared with packed LED chip, flip LED chips has good heat sinking function and luminous efficiency, have the advantages such as low-voltage, high brightness, high reliability, high saturation current density, aspect of performance has larger advantage, has better development prospect.

The heat radiating package substrate material that existing flip LED chips is used, generally adopts metallic aluminium, high heat-conducting plastic or ceramic material.Ceramic material has good insulating, thermal conductivity is high, infrared emittance is large, the coefficient of expansion is low feature, is widely used in the heat sink material of packaged chip.But, the ceramic material that LED chip circuit substrate used adopts at present mainly contains the potteries such as 96 aluminium oxide, AlN, LTCC, and these potteries are all opaque, for LED plane or class planar design light source, cause LED lamp lighting angle limited, generally 120 °～165 ° left and right.Flip LED chips luminous be each to, chip front side, the back side and each side have light to send.And the light that above-mentioned traditional ceramic substrate cannot send chip back extracts, this part light can finally be converted into heat by refraction, transmitting, absorption.Not only reduce light efficiency, and caused the temperature of chip to raise gradually, caused light output efficiency and the life-span of chip.

China utility model (applying date 2012-11-16, notification number 202972633U) a kind of encapsulating structure that utilizes crystalline ceramics COB substrate to realize comprehensive LED illumination is disclosed, " comprising: bulb (1), cathode contact (11), screw socket (12), heating column (2), positive wire (3), cathode wire (4) characterized by further comprising crystalline ceramics COB substrate (5), this crystalline ceramics COB substrate (5) is connected with heating column (2), positive wire (3), cathode wire (4) respectively." heat dispersion of this structure is bad, when using powerful flip LED chips, its heat dissipation problem can be more outstanding.

Utility model content

The purpose of this utility model is to provide a kind of bulb based on based on flip LED chips and crystalline ceramics substrate, this bulb can be stereo luminous in all directions, the shape of the filament of the imitative tengsten lamp of illuminator shape picture, the perfect heat-dissipating of while bulb, and crystalline ceramics substrate and heating column fixation, heat-transfer effect is good.

For achieving the above object, the utility model is to realize by following technical scheme.

The utility model is to provide a kind of bulb based on flip LED chips and crystalline ceramics substrate, comprise lampshade, cathode contact, screw socket, heating column, heat radiator body, positive wire and cathode conductor, wherein, the lower end of described heating column is provided with connecting portion, on the outer side plane of connecting portion, crystalline ceramics substrate is installed, crystalline ceramics substrate becomes 10～80 degree angles with level, the front of described crystalline ceramics substrate is provided with line layer, on line layer, be packaged with flip LED chips, line layer is connected with cathode conductor with positive wire respectively.

In the bulb of the following stated, connecting portion, heat radiator body on described heating column, heating column are structure as a whole, and adopt aluminium or the copper product of good heat conductivity to make, and under integrative-structure, there is no contact point, have avoided contact point to conduct heat uneven, affect whole heat-conducting effect.

In the bulb of the following stated, described connecting portion is 2～4, and a crystalline ceramics substrate is installed on each connecting portion.Described crystalline ceramics substrate is to be welded and fixed on the connecting portion that is arranged on heating column by eutectic, utilizes eutectic welding to have good heat-conducting effect.

In above-described bulb, wherein, the line layer on described crystalline ceramics substrate is silver slurry line layer or copper base line layer.Described flip LED chips welds by ashbury metal or eutectic welding is encapsulated on the line layer on crystalline ceramics substrate.On flip LED chips, also utilize fluorophor to encapsulate, illuminator can be made to live the bar shaped state of the filament of incandescent lamp bulb when luminous, can also make other shape.

Further, described crystalline ceramics substrate is trapezoidal or leg-of-mutton thin-slab structure, it is provided with anodal wiring hole, negative pole wiring hole and heating column installing hole, and wherein anodal wiring hole, negative pole wiring hole determine according to wire aperture, and starches line layer or copper base line layer circuit UNICOM with silver.

The beneficial effects of the utility model are: the integrative-structure of connecting portion, heating column and heat radiator body, makes heat-conducting effect better; Crystalline ceramics substrate and connecting portion adopt eutectic welding, install firmly and conduct heat; Crystalline ceramics substrate inclined design, lighting angle is larger; Crystalline ceramics substrate transparent, makes the LED can be omnibearing luminous, realizes high efficiency light-emitting, and illuminator can also be made different shapes, more attractive in appearance.

Accompanying drawing explanation

Fig. 1 is the bulb stereochemical structure diagram of the utility model embodiment.

Fig. 2 is the structure front view of the bulb in Fig. 1.

Fig. 3 is the structural base view of the bulb in Fig. 1.

Fig. 4 is that bulb in Fig. 3 is along the cross section view of A-A face.

Fig. 5 is the front view of the crystalline ceramics substrate of the bulb in Fig. 1.

Fig. 6 is that crystalline ceramics substrate in Fig. 5 is along the cross section view of B-B face.

The specific embodiment

Below in conjunction with accompanying drawing and specific embodiment, the technical solution of the utility model is elaborated.

In order to make to conduct heat soon between crystalline ceramics substrate and connector, crystalline ceramics substrate is welded and fixed on the connecting portion that is arranged on heating column by eutectic.

Above embodiment is preferred embodiment of the present utility model; the utility model is not limited to above-described embodiment; for those of ordinary skills; the any apparent change of doing on the basis that does not deviate from the utility model know-why, all belongs to the protection domain of design of the present utility model and claims.