CN203979910U - COB-LED light source and lamps - Google Patents
- ️Wed Dec 03 2014
CN203979910U - COB-LED light source and lamps - Google Patents
COB-LED light source and lamps Download PDFInfo
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Publication number
- CN203979910U CN203979910U CN201320430738.2U CN201320430738U CN203979910U CN 203979910 U CN203979910 U CN 203979910U CN 201320430738 U CN201320430738 U CN 201320430738U CN 203979910 U CN203979910 U CN 203979910U Authority
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- China Prior art keywords
- cob
- led
- light
- light source
- led light Prior art date
- 2013-07-17 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000003292 glue Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 241001465382 Physalis alkekengi Species 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 8
- 238000000605 extraction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a LED technical field provides a COB-LED light source and lamps and lanterns. The COB-LED light source comprises a light-transmitting substrate, a plurality of LED chips and a light-transmitting packaging body; the printing opacity base plate edge is equipped with anodal pad and negative pole pad, and printing opacity base plate middle part is equipped with the printed circuit line, and a plurality of LED chips are located printing opacity base plate upper surface and loop through the printed circuit line and switch on the series connection between anodal pad and negative pole pad, and the printing opacity packaging body is located printing opacity base plate upper surface and is covered a plurality of LED chips, and printing opacity base plate lower surface is equipped with the reflector layer, and the reflection of light face and a plurality of LED chips of reflector layer are relative. The COB-LED light source has the advantages of uniform light, large light-emitting angle, wide irradiation range and high light-emitting efficiency; a plurality of LEDs in the COB-LED light source are connected in series, so that a power circuit of the plurality of LEDs only needs one rectifier bridge circuit and one constant current IC, and the circuit cost is saved.
Description
Technical field
The utility model relates to LED technical field, relates in particular to a kind of COB-LED light source and light fixture.
Background technology
COB-LED light source refers to several LED chips is attached to formed integrated area source on substrate.COB-LED light source technology has been rejected support concept, electroless plating, without Reflow Soldering, without paster operation, so manufacturing process reduces closely 1/3rd, cost has also saved nearly 1/3rd thereupon.
COB(Chip On Board, Chinese: chip on board) first technological process is to cover chip mount point at heat-conduction epoxy resin for upper surface of base plate (the general epoxy resin with mixing silver-colored particle), then chip is directly placed in to upper surface of base plate, till being heat-treated to chip and being securely fixed in upper surface of base plate, by the method for bonding wire, between chip and substrate, directly set up and be electrically connected again subsequently.
Existing COB-LED light source is mainly that LED chip is attached on the substrate of surface for minute surface, the light that relies on mirror-reflection LED chip to send improves light extraction efficiency, the common light efficiency of this class COB-LED light source only has 70-80lm/W, and this is because due to the light launched downwards of LED is not used effectively.And the rising angle of above-mentioned COB-LED light source is also less, its light directive property is excessively strong, and the field that is unsuitable for specific (special) requirements uses.
Utility model content
The purpose of this utility model is to overcome the defect of prior art, provides that a kind of light extraction efficiency is high, rising angle is large, equal good COB-LED light sources of light effect.
For this reason, the utility model is by the following technical solutions:
A COB-LED light source, comprises transparent substrates, a plurality of LED chip and light transmission package;
Described transparent substrates edge is provided with positive terminal pad and negative terminal pad, described transparent substrates middle part is provided with printed circuit lines, described a plurality of LED chip is located at described transparent substrates upper surface and by described printed circuit lines conducting, is series between described positive terminal pad and negative terminal pad successively, described light transmission package is located at described transparent substrates upper surface and is covered described a plurality of LED chip, described transparent substrates lower surface is provided with reflector layer, and the reflective surface of described reflector layer is relative with described a plurality of LED chips.
Further, described light transmission package comprises printing opacity box dam and is condensed in the fluorescent glue in the region that described printing opacity box dam surrounds, and described a plurality of LED chips are positioned at the region that described printing opacity box dam surrounds, and described fluorescent glue covers described LED chip.
Further, described reflector layer is silvering.
Further, described reflector layer is nickel coating.
Further, described reflector layer is the reflecting piece that is attached at described transparent substrates lower surface.
The utility model also provides a kind of light fixture, comprises lamp housing, also comprises above-mentioned COB-LED light source, and described COB-LED light source is located in described lamp housing.
COB-LED light source provided by the utility model has following technique effect:
This COB-LED light source is by transparent substrates lower surface, reflector layer being set, and the light reflection that a plurality of LED chips can be launched downwards goes out transparent substrates upper surface, takes full advantage of all light that LED chip sends, and has promoted the light extraction efficiency of LED light source; From optical principle, this COB-LED light source can also reach the effect that rising angle is large, is suitable for having the field of specific (special) requirements to use.Therefore light that, this COB-LED light source sends is even, rising angle is large, range of exposures is wide, light extraction efficiency is high.
In addition, a plurality of LED chips in this COB-LED light source adopt and are connected in series, and therefore the power circuit of the plurality of LED chip only needs a rectifier circuit and a constant current IC, has saved circuit cost.
The utility model also provides a kind of light fixture, comprises lamp housing and above-mentioned COB-LED light source, and described COB-LED light source is located in described lamp housing.
Adopted that the light that the light fixture of above-mentioned COB-LED light source sends has advantages of evenly, rising angle is large, range of exposures is wide, light extraction efficiency is high.
Accompanying drawing explanation
Fig. 1 is the front view of COB-LED light source in the utility model embodiment;
Fig. 2 is the cutaway view of A-A in Fig. 1;
Fig. 3 is the rearview of COB-LED light source in the utility model embodiment;
Fig. 4 is the schematic diagram that in the utility model embodiment, transparent substrates upper surface is not established light transmission package;
Fig. 5 is index path when COB-LED light source is used in the utility model embodiment;
Fig. 6 is the power circuit schematic diagram of COB-LED light source in the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Referring to Fig. 1～4.
A COB-LED light source, comprises transparent substrates 1, a plurality of LED chip 2 and light transmission package 3; Transparent substrates 1 edge is provided with positive terminal pad 11 and negative terminal pad 12, transparent substrates 1 middle part is provided with printed circuit lines 13, a plurality of LED chips 2 are located at transparent substrates 1 upper surface and by printed circuit lines 13 conductings, are series between positive terminal pad 11 and negative terminal pad 12 successively, light transmission package 3 is located at transparent substrates 1 upper surface and is covered a plurality of LED chips 2, transparent substrates 1 lower surface is provided with reflector layer 4, and the reflective surface of reflector layer 4 is relative with a plurality of LED chips 2.
Below in conjunction with Fig. 5, the illumination effect of this COB-LED light source is described further.While lighting a plurality of LED chip 2, the light that a plurality of LED chips 2 send is to all the winds launched, the light wherein penetrating downwards directly enters transparent substrates 1, when light is penetrated in reflector layer 4, light is reflected by reflector layer 4, through repeatedly coming and going reflection, light penetrates transparent substrates 1 upper surface the most at last, effectively utilized the light being penetrated by a plurality of LED chips 2 downwards, simultaneously, owing to being finally reflected, light and the vertical direction of transparent substrates 1 upper surface is angled, plays astigmatic effect, and whole rising angle is large.Visible, this COB-LED light source is by transparent substrates 1 lower surface, reflector layer 4 being set, and the light reflection that a plurality of LED chips 2 can be launched downwards goes out transparent substrates 1 upper surface, takes full advantage of all light that LED sends, and has promoted the light extraction efficiency of LED; From optical principle, this COB-LED light source can also reach the effect that rising angle is large.
In addition, in conjunction with Fig. 6.A plurality of LED chips 2 in this COB-LED light source adopt and are connected in series, and therefore the power circuit of the plurality of LED chip 2 only needs a rectifier circuit 5 and a constant current IC6, has saved circuit cost.
As further improvement of the utility model, light transmission package 3 comprises printing opacity box dam 31 and is condensed in the fluorescent glue 32 in the region that printing opacity box dam 31 surrounds, a plurality of LED chips 2 are positioned at the region that printing opacity box dam 31 surrounds, and fluorescent glue 32 covers a plurality of LED chips 2.Printing opacity box dam 31 and fluorescent glue 32 allow light to pass through, and when effectively utilizing light, also play all effects of light.The material of printing opacity box dam 31 can be silica gel or resin.Fluorescent glue 32 forms for phosphor powder adds silica gel or mixed with resin.
Wherein a kind of embodiment as the utility model about reflector layer 4, reflector layer 4 can be silvering.
Another kind of embodiment as the utility model about reflector layer 4, reflector layer 4 also can be nickel coating.
Another embodiment as the utility model about reflector layer 4, reflector layer 4 also can be the reflecting piece that is attached at transparent substrates 1 lower surface.
Above-mentioned three kinds of embodiments about reflector layer 4 all have technique effect separately, during production, can select according to actual needs any one embodiment.Certainly, the setting of reflector layer 4 is not limited to above three kinds of modes, within any embodiment that can reach reflecting effect all belongs to protection domain of the present utility model.
In addition, transparent substrates 1 can be the substrate that has sapphire substrate, the glass substrate of high transmission rate or adopt other materials with high transmission rate to make.
The utility model embodiment also provides a kind of light fixture (not shown), comprises lamp housing and above-mentioned COB-LED light source, and COB-LED light source is located in lamp housing.The light that adopted the light fixture of above-mentioned COB-LED light source to send is even, rising angle is large, range of exposures is wide, light extraction efficiency is high.
The foregoing is only the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (6)
1.一种COB-LED光源，其特征在于：包括透光基板（1）、多个LED芯片（2）及透光封装体（3）；1. A COB-LED light source, characterized in that it includes a light-transmitting substrate (1), a plurality of LED chips (2) and a light-transmitting package (3); 所述透光基板（1）边缘设有正极焊盘（11）和负极焊盘（12），所述透光基板（1）中部设有印刷电路线（13），所述多个LED芯片（2）设于所述透光基板（1）上表面并依次通过所述印刷电路线（13）导通串联于所述正极焊盘（11）和负极焊盘（12）之间，所述透光封装体（3）设于所述透光基板（1）上表面且覆盖所述多个LED芯片（2），所述透光基板（1）下表面设有反光层（4），所述反光层（4）的反光面与所述多个LED芯片（2）相对。An anode pad (11) and a cathode pad (12) are provided on the edge of the light-transmitting substrate (1), a printed circuit line (13) is provided in the middle of the light-transmitting substrate (1), and the plurality of LED chips ( 2) It is arranged on the upper surface of the transparent substrate (1) and connected in series between the positive electrode pad (11) and the negative electrode pad (12) through the printed circuit line (13) sequentially. The optical package (3) is arranged on the upper surface of the light-transmitting substrate (1) and covers the plurality of LED chips (2), the lower surface of the light-transmitting substrate (1) is provided with a reflective layer (4), and the The reflective surface of the reflective layer (4) is opposite to the plurality of LED chips (2). 2.如权利要求1所述的COB-LED光源，其特征在于：所述透光封装体（3）包括透光围坝（31）以及凝结于所述透光围坝（31）所围成的区域内的荧光胶（32），所述多个LED芯片（2）位于所述透光围坝（31）所围成的区域内，所述荧光胶（32）覆盖所述LED芯片（2）。2. The COB-LED light source according to claim 1, characterized in that: the light-transmitting encapsulation (3) includes a light-transmitting dam (31) and is formed by condensation on the light-transmitting dam (31) The fluorescent glue (32) in the area, the plurality of LED chips (2) are located in the area surrounded by the light-transmitting dam (31), and the fluorescent glue (32) covers the LED chips (2 ). 3.如权利要求1所述的COB-LED光源，其特征在于：所述反光层（4）为银镀层。3. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is silver plating. 4.如权利要求1所述的COB-LED光源，其特征在于：所述反光层（4）为镍镀层。4. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is nickel plating. 5.如权利要求1所述的COB-LED光源，其特征在于：所述反光层（4）为贴附于所述透光基板（1）下表面的反光片。5. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is a reflective sheet attached to the lower surface of the transparent substrate (1). 6.一种灯具，包括灯壳，其特征在于：还包括权利要求1-5任一项所述的COB-LED光源，所述COB-LED光源设于所述灯壳内。6. A lamp, comprising a lamp housing, characterized in that it further comprises the COB-LED light source according to any one of claims 1-5, and the COB-LED light source is arranged in the lamp housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320430738.2U CN203979910U (en) | 2013-07-17 | 2013-07-17 | COB-LED light source and lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320430738.2U CN203979910U (en) | 2013-07-17 | 2013-07-17 | COB-LED light source and lamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203979910U true CN203979910U (en) | 2014-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320430738.2U Expired - Fee Related CN203979910U (en) | 2013-07-17 | 2013-07-17 | COB-LED light source and lamps |
Country Status (1)
| Country | Link |
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| CN (1) | CN203979910U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106907584A (en) * | 2017-03-29 | 2017-06-30 | 山东晶泰星光电科技有限公司 | A kind of illuminating module and LED with rectifier bridge stack |
| CN107152614A (en) * | 2017-07-06 | 2017-09-12 | 山东中微光电子有限公司 | A kind of LED area light source |
-
2013
- 2013-07-17 CN CN201320430738.2U patent/CN203979910U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106907584A (en) * | 2017-03-29 | 2017-06-30 | 山东晶泰星光电科技有限公司 | A kind of illuminating module and LED with rectifier bridge stack |
| CN107152614A (en) * | 2017-07-06 | 2017-09-12 | 山东中微光电子有限公司 | A kind of LED area light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 2014-12-03 | C14 | Grant of patent or utility model | |
| 2014-12-03 | GR01 | Patent grant | |
| 2015-05-20 | ASS | Succession or assignment of patent right |
Owner name: ZHONGSHAN HONGSHENGXIANG LIGHTING TECHNOLOGICAL CO Free format text: FORMER OWNER: ZHONGSHAN WANPU ELECTRONIC SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150506 |
| 2015-05-20 | C41 | Transfer of patent application or patent right or utility model | |
| 2015-05-20 | TR01 | Transfer of patent right |
Effective date of registration: 20150506 Address after: 528400 building, No. 17, Torch Road, Torch Development Zone, Guangdong, Zhongshan, 4 Patentee after: Hong Shengxiang photoelectric lighting Science and Technology Ltd. of Zhongshan city Address before: 528400 Guangdong province Zhongshan Torch Development Zone, Jiang Mei Village Patentee before: ZHONGSHAN WANPU ELECTRONIC SCIENCE & TECHNOLOGY CO., LTD. |
| 2020-07-10 | CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20190717 |
| 2020-07-10 | CF01 | Termination of patent right due to non-payment of annual fee |