CN207909874U - A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED - Google Patents

The utility model discloses a kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED, including transparent circuit substrate, the front of transparent circuit substrate is provided with circuit layer, and the anode of transparent circuit substrate is connect with the circuit for being connected with upside-down mounting diode chip for backlight unit, and the circuit of upside-down mounting diode chip for backlight unit constitutes rectification circuit；The output end of the rectification circuit is parallel at least three upside-down mounting constant current chips, and each upside-down mounting constant current chip access is connected the circuit formed by multiple flip LED chips, constitutes at least three illuminating circuits, and the cathode of illuminating circuit and transparent circuit substrate connects；In the front of transparent circuit substrate fluorescent powder is coated with reverse side.Fluorescent powder is coated on front and the reverse side of transparent substrate after carrying out appropriate mix with silica gel, it is ensured that positive and negative can all have fluorescent powder excitation is luminous to realize that 360 ° shine.

A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED

Technical field

The utility model is related to technical field of LED illumination, especially a kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED.

Background technology

LED currently on the market is all made of conventional package mode and encapsulates, and product light emitting angle is small, can not achieve 360 ° and shines, Internal in conventional package simultaneously to be attached by the way of bonding wire, product is assembled and was used by high-temperature soldering in client Easily there is gold thread fracture in Cheng Zhong, causes product bad, and general LED is required to optional equipment driving power and can use.

Utility model content

Technical problem to be solved in the utility model is overcome the deficiencies in the prior art, and provides a kind of upside-down mounting self-rectifying 360 ° light-emitting LED, and self-rectifying may be implemented, realize that 360 ° shine, can directly connect alternating current use, while welding applied at elevated temperature Product reliability is ensured in the process, avoids gold thread from being broken bad.

The utility model uses following technical scheme to solve above-mentioned technical problem：

A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED, including transparent circuit substrate, the front of transparent circuit substrate are provided with electricity The anode of road floor, transparent circuit substrate is connect with the circuit for being connected with upside-down mounting diode chip for backlight unit, the circuit of upside-down mounting diode chip for backlight unit Constitute rectification circuit；The output end of the rectification circuit is parallel at least three upside-down mounting constant current chips, and each upside-down mounting constant current chip connects Enter and connected the circuit formed by multiple flip LED chips, constitutes at least three illuminating circuits, illuminating circuit and transparent circuit substrate Cathode connection；In the front of transparent circuit substrate fluorescent powder is coated with reverse side.

Fluorescent powder is coated on front and the reverse side of transparent substrate after carrying out appropriate mix with silica gel, it is ensured that positive and negative all can There is fluorescent powder excitation to shine and realizes that 360 ° shine, and complete a kind of 360 ° of light-emitting LED encapsulation of upside-down mounting self-rectifying, may be implemented 360 ° It shines.

For wherein upside-down mounting diode chip for backlight unit for forming rectifier bridge in transparent circuit substrate, the connection of rectifier bridge input terminal is transparent Circuit board anode, upside-down mounting constant current chip input terminal connect the output end of rectifier bridge, and upside-down mounting constant current chip output end connects upside-down mounting LED chip, plurality of LEDs chip are connected using series-parallel system, are ultimately connected to the cathode of transparent circuit substrate, are formed into a loop.

Preferably, flip LED chips, upside-down mounting diode chip for backlight unit and upside-down mounting constant current chip pass through conductive adhesive and transparent electricity Base board connects.

Further, conductive adhesive is or mixtures thereof silver paste, tin cream, alloy.

The utility model has the following technical effects using above technical scheme is compared with the prior art：

（1）The utility model is real using upside-down mounting diode chip for backlight unit, upside-down mounting constant current chip and flip LED chips forming circuit Existing upside-down mounting self-rectifying LED realizes that all structures do not use gold thread inside self-rectifying, and client assembled in use or secondary high-temperature Cheng Zhong is not in the exception of gold thread fracture, it is ensured that terminal client use reliability promotes product reliability.

（2）Upside-down mounting diode and upside-down mounting constant current chip are encapsulated into inside LED, avoid diode chip for backlight unit, constant current chip envelope Dress up after electronic device that SMT reduces diode chip for backlight unit, constant current chip packaging cost and SMT costs, LED assemblies to substrate again Originally it is reduced.

Description of the drawings

Fig. 1 is transparent circuit substrate schematic diagram.

Fig. 2 is that upside-down mounting diode, upside-down mounting constant current chip, flip LED chips schematic diagram are mounted in transparent circuit substrate.

Fig. 3 is transparent circuit substrate front surface coated fluorescent glue schematic diagram.

Fig. 4 is transparent circuit substrate backside coating fluorescent glue schematic diagram.

Description of symbols in figure：

1- transparent circuit substrates；

2- circuit layers；

3- pads；

4- upside-down mounting diode chip for backlight unit；

5- upside-down mounting constant current chips；

6- flip LED chips；

7- fluorescent glues.

Specific implementation mode

The technical solution of the utility model is described in further detail below in conjunction with the accompanying drawings：

360 ° of a kind of upside-down mounting self-rectifying described in the utility model is light-emitting LED, including transparent circuit substrate, transparent circuit substrate Front be provided with circuit layer, the anode of transparent circuit substrate is connect with the circuit for being connected with upside-down mounting diode chip for backlight unit, upside-down mounting two The circuit of pole pipe chip constitutes rectification circuit；The output end of the rectification circuit is parallel at least three upside-down mounting constant current chips, each The access of upside-down mounting constant current chip is connected the circuit formed by multiple flip LED chips, constitutes at least three illuminating circuits, illuminating circuit It is connect with the cathode of transparent circuit substrate；In the front of transparent circuit substrate fluorescent powder is coated with reverse side.

Specifically encapsulation step is：

Such as Fig. 1, transparent circuit substrate 1 is prepared, has circuit layer 2 and pad 3 in transparent circuit substrate 1；

Such as Fig. 2, conductive adhesive is used on pad, and upside-down mounting diode 4, upside-down mounting constant current chip 5 are fixed to transparent electricity In the respective pad of base board 1, internal rectification circuit is formed, flip LED chips 6 are fixed to the corresponding of transparent circuit substrate 1 On pad 3, complete driving and illuminating circuit are formed；Conductive adhesive is or mixtures thereof silver paste, tin cream, alloy.

Such as Fig. 3,4, fluorescent powder and silica gel are mixed to form fluorescent glue 7 according to a certain percentage, in 1 front of transparent circuit substrate Coating fluorescent glue 7 completes a kind of 360 ° of light-emitting LED envelopes of upside-down mounting self-rectifying in transparent circuit substrate backside coating fluorescent glue 7 Dress.

The utility model adds flip LED chips using upside-down mounting diode chip for backlight unit and upside-down mounting constant current chip, realizes upside-down mounting from whole LED is flowed, realizes that all structures ensure terminal client use reliability without using gold thread inside self-rectifying, client is in use or two In secondary high temperature assembling process, is not in the exception of gold thread fracture, promotes product reliability.Upside-down mounting diode and upside-down mounting constant current core Piece is directly encapsulated into chip form inside LED light, avoids diode chip for backlight unit, constant current chip is packaged into after electronic device again SMT reduces diode chip for backlight unit, constant current chip packaging cost and SMT costs to substrate, and LED totle drilling costs are reduced..

Obviously, above-described embodiment of the utility model is only intended to clearly illustrate the utility model example, and It is not the restriction to the embodiment of the utility model.For those of ordinary skill in the art, in above description On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments It is exhaustive.And the obvious changes or variations that these connotations for belonging to the utility model are extended out still fall within this practicality Novel protection domain.