patents.google.com

JPS543473A - Manufacture of semiconductor device - Google Patents

  • ️Thu Jan 11 1979

JPS543473A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS543473A
JPS543473A JP6813377A JP6813377A JPS543473A JP S543473 A JPS543473 A JP S543473A JP 6813377 A JP6813377 A JP 6813377A JP 6813377 A JP6813377 A JP 6813377A JP S543473 A JPS543473 A JP S543473A Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
layer
wafer
deterioration layer
Prior art date
1977-06-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6813377A
Other languages
Japanese (ja)
Other versions
JPS5726407B2 (en
Inventor
Chuichi Takada
Ryoji Abe
Makoto Serigano
Kuniaki Makabe
Shoji Minagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1977-06-09
Filing date
1977-06-09
Publication date
1979-01-11
1977-06-09 Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
1977-06-09 Priority to JP6813377A priority Critical patent/JPS543473A/en
1979-01-11 Publication of JPS543473A publication Critical patent/JPS543473A/en
1982-06-04 Publication of JPS5726407B2 publication Critical patent/JPS5726407B2/ja
Status Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To increase the adhesion between the wafer and the resist layer as well as to facilitate an easy minute processing, by converting the surface of the resist film formed on the semiconductor wafer into a deterioration layer through a plasma treatment and then giving a thermal treatment to the deterioration layer.

COPYRIGHT: (C)1979,JPO&Japio

JP6813377A 1977-06-09 1977-06-09 Manufacture of semiconductor device Granted JPS543473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6813377A JPS543473A (en) 1977-06-09 1977-06-09 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6813377A JPS543473A (en) 1977-06-09 1977-06-09 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS543473A true JPS543473A (en) 1979-01-11
JPS5726407B2 JPS5726407B2 (en) 1982-06-04

Family

ID=13364927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6813377A Granted JPS543473A (en) 1977-06-09 1977-06-09 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS543473A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532095A (en) * 1978-08-24 1980-03-06 Ibm Stabilizing resist image
JPS55103736A (en) * 1979-02-01 1980-08-08 Toshiba Corp Hardening method of proving ink for semiconductor wafer
US5372677A (en) * 1991-12-18 1994-12-13 Kawasaki Steel Corporation Method of manufacturing semiconductor devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938403A (en) * 1982-08-24 1984-03-02 日工株式会社 Method and apparatus for regenerating asphalt paving waste material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933573A (en) * 1972-07-26 1974-03-28
JPS50154066A (en) * 1974-05-31 1975-12-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933573A (en) * 1972-07-26 1974-03-28
JPS50154066A (en) * 1974-05-31 1975-12-11

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532095A (en) * 1978-08-24 1980-03-06 Ibm Stabilizing resist image
JPS5640332B2 (en) * 1978-08-24 1981-09-19
JPS55103736A (en) * 1979-02-01 1980-08-08 Toshiba Corp Hardening method of proving ink for semiconductor wafer
JPS628937B2 (en) * 1979-02-01 1987-02-25 Tokyo Shibaura Electric Co
US5372677A (en) * 1991-12-18 1994-12-13 Kawasaki Steel Corporation Method of manufacturing semiconductor devices

Also Published As

Publication number Publication date
JPS5726407B2 (en) 1982-06-04

Similar Documents

Publication Publication Date Title
JPS53108390A (en) 1978-09-21 Semiconductor device and its manufacture
JPS5351970A (en) 1978-05-11 Manufacture for semiconductor substrate
JPS5244173A (en) 1977-04-06 Method of flat etching of silicon substrate
JPS543473A (en) 1979-01-11 Manufacture of semiconductor device
JPS5420671A (en) 1979-02-16 Production of semiconductor devices
JPS531471A (en) 1978-01-09 Manufacture for semiconductor device
JPS5244175A (en) 1977-04-06 Method of flat etching of silicon substrate
JPS5386177A (en) 1978-07-29 Production of semiconductor device
JPS5382174A (en) 1978-07-20 Surface processing method for semiconductor device
JPS544070A (en) 1979-01-12 Manufacture for semiconductor device
JPS5415669A (en) 1979-02-05 Manufacture of mesa-type semiconductor device
JPS5220764A (en) 1977-02-16 Manufacturing system of mesa type semi-conductor unit
JPS53142870A (en) 1978-12-12 Manufacture for semiconductor device
JPS5339872A (en) 1978-04-12 Etching method of wafers
JPS5411688A (en) 1979-01-27 Manufacture for semiconductor device
JPS52112281A (en) 1977-09-20 Manufacture of semiconductor
JPS547867A (en) 1979-01-20 Manufacture for semiconductor device
JPS52101991A (en) 1977-08-26 Preparation of silicon target
JPS5428566A (en) 1979-03-03 Manufacture of semiconductor device
JPS5353964A (en) 1978-05-16 Electrode forming method of semiconductor device
JPS5335375A (en) 1978-04-01 Heating method
JPS5367362A (en) 1978-06-15 Manufacture of semiconductor device
JPS5211867A (en) 1977-01-29 Manufacturing method of a semiconductor device
JPS5417663A (en) 1979-02-09 Manufacture of semiconductor device
JPS5412684A (en) 1979-01-30 Manufacture of semiconductor device