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JPS5599741A - Affixing method of article onto adhesive tape - Google Patents

  • ️Wed Jul 30 1980

JPS5599741A - Affixing method of article onto adhesive tape - Google Patents

Affixing method of article onto adhesive tape

Info

Publication number
JPS5599741A
JPS5599741A JP708579A JP708579A JPS5599741A JP S5599741 A JPS5599741 A JP S5599741A JP 708579 A JP708579 A JP 708579A JP 708579 A JP708579 A JP 708579A JP S5599741 A JPS5599741 A JP S5599741A Authority
JP
Japan
Prior art keywords
adhesive tape
article
affix
articles
adherent surface
Prior art date
1979-01-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP708579A
Other languages
Japanese (ja)
Other versions
JPS644339B2 (en
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1979-01-26
Filing date
1979-01-26
Publication date
1980-07-30
1979-01-26 Application filed by Hitachi Ltd filed Critical Hitachi Ltd
1979-01-26 Priority to JP708579A priority Critical patent/JPS5599741A/en
1980-07-30 Publication of JPS5599741A publication Critical patent/JPS5599741A/en
1989-01-25 Publication of JPS644339B2 publication Critical patent/JPS644339B2/ja
Status Granted legal-status Critical Current

Links

Landscapes

  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To affix articles onto adhesive tape without damaging articles, by vacuum absorbing of article from reverse side of adherent surface of adhesive tape, and affix.

CONSTITUTION: Plural fine penetrating holes 4b are made on adhesive tape by means of treatment with electric discharge, etc. Then, on adherent surface 4a of tape 4, article, for example semiconductor wafer 1 is placed. Adhesive tape 4 on which wafers 1 is placed, is positioned on receptacle 6, containing porous material 5 in it, and then absorb articles by vacuum through hole 7 provided underneath of receptacle 6. Resulted by this performance, semiconductor wafer 1 is firmly adhered to adherent surface 4a and is affixed. It is possible to affix without touching on the main surface of the article.

COPYRIGHT: (C)1980,JPO&Japio

JP708579A 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape Granted JPS5599741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP708579A JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP708579A JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Publications (2)

Publication Number Publication Date
JPS5599741A true JPS5599741A (en) 1980-07-30
JPS644339B2 JPS644339B2 (en) 1989-01-25

Family

ID=11656244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP708579A Granted JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Country Status (1)

Country Link
JP (1) JPS5599741A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115833A (en) * 1981-12-28 1983-07-09 Sony Corp Division of wafer
JPS59152639A (en) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd Method for provisional fixing of semiconductor wafer
JPS61222146A (en) * 1985-02-12 1986-10-02 Matsushita Electronics Corp Sheet for supporting semiconductor wafer
CN110767612A (en) * 2018-07-27 2020-02-07 奇景光电股份有限公司 Bonding structure and bonding method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958773A (en) * 1972-10-04 1974-06-07
JPS5318969A (en) * 1976-08-06 1978-02-21 Nippon Telegr & Teleph Corp <Ntt> Wafer fixing method
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958773A (en) * 1972-10-04 1974-06-07
JPS5318969A (en) * 1976-08-06 1978-02-21 Nippon Telegr & Teleph Corp <Ntt> Wafer fixing method
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115833A (en) * 1981-12-28 1983-07-09 Sony Corp Division of wafer
JPH0318343B2 (en) * 1981-12-28 1991-03-12 Sony Corp
JPS59152639A (en) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd Method for provisional fixing of semiconductor wafer
JPS61222146A (en) * 1985-02-12 1986-10-02 Matsushita Electronics Corp Sheet for supporting semiconductor wafer
CN110767612A (en) * 2018-07-27 2020-02-07 奇景光电股份有限公司 Bonding structure and bonding method
CN110767612B (en) * 2018-07-27 2021-06-18 奇景光电股份有限公司 Bonding structure and bonding method

Also Published As

Publication number Publication date
JPS644339B2 (en) 1989-01-25

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