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MY145225A - Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp - Google Patents

  • ️Fri Jan 13 2012
Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Info

Publication number
MY145225A
MY145225A MYPI20062536A MYPI20062536A MY145225A MY 145225 A MY145225 A MY 145225A MY PI20062536 A MYPI20062536 A MY PI20062536A MY PI20062536 A MYPI20062536 A MY PI20062536A MY 145225 A MY145225 A MY 145225A Authority
MY
Malaysia
Prior art keywords
features
transfer
present
adhesion
methods
Prior art date
2005-06-02
Application number
MYPI20062536A
Inventor
Ralph G Nuzzo
John A Rogers
Etienne Menard
Keon Jae Lee
Dahl-Young Khang
Yugang Sun
Matthew Meitl
Zhengtao Zhu
Original Assignee
Univ Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
2005-06-02
Filing date
2006-06-01
Publication date
2012-01-13
2005-06-02 Priority claimed from PCT/US2005/019354 external-priority patent/WO2005122285A2/en
2006-06-01 Application filed by Univ Illinois filed Critical Univ Illinois
2012-01-13 Publication of MY145225A publication Critical patent/MY145225A/en

Links

  • 238000010023 transfer printing Methods 0.000 title abstract 2
  • 238000000034 method Methods 0.000 abstract 4
  • 239000004065 semiconductor Substances 0.000 abstract 2
  • 239000000758 substrate Substances 0.000 abstract 2
  • 230000002153 concerted effect Effects 0.000 abstract 1
  • 230000010354 integration Effects 0.000 abstract 1

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Thin Film Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)

Abstract

PATTERN TRANSFER PRINTING BY KINETIC CONTROL OF ADHESION TO AN ELASTOMERIC STAMP THE PRESENT INVENTION PROVIDES METHODS, SYSTEMS AND SYSTEM COMPONENTS FOR 5 TRANSFERRING, ASSEMBLING AND INTEGRATING FEATURES AND ARRAYS OF FEATURES HAVING SELECTED NANOSIZED AND/OR MICROSIZED PHYSICAL DIMENSIONS, SHAPES AND SPATIAL ORIENTATIONS. METHODS OF THE PRESENT INVENTION UTILIZE PRINCIPLES OF 'SOFT ADHESION'TO GUIDE THE TRANSFER, ASSEMBLY AND/OR INTEGRATION OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENTS OR OTHER COMPONENTS OF ELECTRONIC DEVICES. METHODS OF THE PRESENT INVENTION ARE USEFUL FOR 10 TRANSFERRING FEATURES FROM A DONOR SUBSTRATE TO THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE AND, OPTIONALLY, FROM THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE TO THE RECEIVING SURFACE OF A RECEIVING SUBSTRATE. THE PRESENT METHODS AND SYSTEMS PROVIDE HIGHLY EFFICIENT, REGISTERED TRANSFER OF FEATURES AND ARRAYS OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENT, IN A CONCERTED MANNER THAT MAINTAINS THE 15 RELATIVE SPATIAL ORIENTATIONS OF TRANSFERRED FEATURES. DOOG)OI/06/&

MYPI20062536A 2005-06-02 2006-06-01 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp MY145225A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/US2005/019354 WO2005122285A2 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,542 US7557367B2 (en) 2004-06-04 2005-06-02 Stretchable semiconductor elements and stretchable electrical circuits
US11/145,574 US7622367B1 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements

Publications (1)

Publication Number Publication Date
MY145225A true MY145225A (en) 2012-01-13

Family

ID=41576388

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20062536A MY145225A (en) 2005-06-02 2006-06-01 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Country Status (3)

Country Link
CN (2) CN101632156B (en)
MY (1) MY145225A (en)
TW (1) TWI420237B (en)

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US7927976B2 (en) 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US8506867B2 (en) 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
US8261660B2 (en) 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
CN101924173A (en) * 2010-05-28 2010-12-22 孙文红 High lighting effect pattern substrate and manufacturing method thereof
TWI415284B (en) * 2011-03-10 2013-11-11 Gintech Energy Corp Solar cell electrode making device and method thereof
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9824851B2 (en) * 2013-01-20 2017-11-21 William M. Tong Charge drain coating for electron-optical MEMS
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CN105140227B (en) * 2015-07-01 2017-12-05 东南大学 The NAND gate of gallium nitride base low-leakage current cantilever beam
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CN115966503A (en) 2016-10-04 2023-04-14 维耶尔公司 Microdevice Arrangement in Donor Substrate
CN106383403B (en) * 2016-12-08 2020-11-10 中国科学院光电技术研究所 A stretchable and deformable metasurface color display device
CN108231534A (en) * 2016-12-15 2018-06-29 上海新微技术研发中心有限公司 Method for manufacturing flexible film
FR3063854B1 (en) * 2017-03-13 2021-08-27 Commissariat Energie Atomique SAW RESONATOR WITH PARASITE WAVE ATTENUATION LAYERS
CN109103101B (en) * 2017-06-21 2020-09-29 清华大学 Preparation method of nano-microstructure
CN109103090B (en) * 2017-06-21 2020-12-04 清华大学 Preparation method of nanobelt
CN110890309B (en) * 2018-09-10 2023-09-08 桦榆国际有限公司 Graphite disk repair method
CN109342325B (en) * 2018-10-30 2023-12-19 南开大学 A method and device for anisotropic microscopic imaging of low-dimensional materials
KR20200026768A (en) * 2019-11-22 2020-03-11 엘지전자 주식회사 Fabricating method for display device using semiconductor light emitting device and self-assembly device used therein
CN111622996B (en) * 2020-04-27 2022-05-24 江苏科技大学 Heterogeneous multi-valve parallel drive electro-hydraulic servo system and control method
CN111934071B (en) * 2020-06-19 2021-10-22 西安理工大学 A TSV-based Ridge-Substrate Integrated Waveguide Bandpass Filter
CN111947794B (en) * 2020-07-31 2023-01-31 电子科技大学 A kind of preparation method of superconducting nanowire single photon detector
CN112526660B (en) * 2020-11-11 2022-12-09 歌尔股份有限公司 Method for manufacturing nano-grating on curved surface, optical device and electronic equipment
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TWI273019B (en) * 2003-07-25 2007-02-11 Hon Hai Prec Ind Co Ltd A method of transfer pattern

Also Published As

Publication number Publication date
TWI420237B (en) 2013-12-21
CN102176465B (en) 2014-05-07
TW200710562A (en) 2007-03-16
CN101632156B (en) 2012-06-20
CN101632156A (en) 2010-01-20
CN102176465A (en) 2011-09-07

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