TW519582B - Apparatus for image photographing and display - Google Patents

The present invention provides an apparatus for image photographing and display and comprises a liquid crystal display (LCD) panel and an image sensor which is installed directly on the LCD panel. The LCD panel includes a first glass substrate, a second glass substrate, and a liquid crystal layer which is sandwiched between the inner surfaces of the two substrates. The first glass substrate is equipped with a set of electrode contacts. The image sensor is installed on the inner surface of the first glass substrate and is electrically connected with the set of electrode contacts. A lens for focusing images onto the image sensor is installed on the outer surface of the first glass substrate.

519582 五、發明說明（1) 【發明領域】 本發明係有關 關於一種用以拍 【先前技 視訊會 相隔的地 下列裝置 端拍攝以 訊；麥克 器，用以 數位攝 收反射自 器一般係 内，該透 面。而要 影像感測 内。該影 路板並且 數位攝像 上方，然 因此需 攝影像並 【發明概 本發明 術】 議（V i d 點之間 達成： 及傳送 風，用 放送來 像器主 物體或 密封於 明窗ο 組成一 器之週 像封裝 藉由板 器一般 而這樣 要一種 且顯示 要】 之主要 於一種整合的輸入/輪出裝置，其特別 攝影像並且顯示影像的裝置。 ' eo conferencing)最簡單的形式為在彼此 往復傳送影像以及聲音，其一般必須藉由 數位攝像器（digital camera)，用以^近 視汛，顯示器，用以顯示來自遠端的視 以從近端取得以及傳送聲音；以及揚聲 自遠端的聲音。 要係利用一影像感測器（image sens〇r)接 景象的光線。在習知技藝中，該影像感測 一具有透明窗口（wincj〇w)的塑膠封裝構造 係用以供光線通過而到達影像感測器表 攝影機或其類似物，一般必須要將配合尾 邊積體電路（Peripheral 1C)安裝攝影 構造以及週邊積體電路係安裝於一印刷ί 上=導電線路彼此連接。用於視訊會議之 係安裝在顯示器（例如一液晶顯示器）的 的習用配置相當的佔空間。 1合的輸入/輸出裝置，其可 以 影像。 目的在於提供一種用以拍攝影像並且顯示519582 V. Description of the invention (1) [Field of the invention] The present invention relates to a device for taking pictures of the following devices [the prior art video conferences are separated from each other; , The transparent surface. Instead, image sensing is required. The video board is digitally photographed, but it is necessary to take an image and [invention of the invention] Proposal (Vid between the points: and the transmission of wind, the main object of the camera or sealed in a bright window. The package of the image of the device requires a plate and a display device. It is mainly an integrated input / round-out device, which specializes in photographing images and displaying images. The simplest form of eo conferencing is in the Images and sounds are transmitted back and forth to each other. Generally, a digital camera must be used to monitor myopia, and a display to display the views from the far end to obtain and transmit sound from the near end. Sound. To use an image sensor (image sensor) to receive the light of the scene. In the conventional art, the image sensing plastic packaging structure with a transparent window (wincjw) is used for light to pass through to the image sensor table camera or the like. Generally, it is necessary to cooperate with the tail edge product. Circuit (Peripheral 1C) installation photography structure and peripheral integrated circuit are installed on a printed = conductive lines are connected to each other. Conventional configurations used in video conferencing systems mounted on a display (such as a liquid crystal display) take up considerable space. 1-in input / output device that can image. The purpose is to provide a method for capturing images and displaying

P〇l-l〇6, Ptd 519582 五、發明說明（2) 影像的裝置，其可克服前述先前技術的問題。 為達上述以及其他目的，本發明提供一種用以拍攝影像 並且顯示影像的裝置，其主要包含一液晶顯示面板以及一 影像感測器直接設在該液晶顯示面板上，藉此有效降低裝 置所佔用之空間。該液晶顯示面板包含第一玻璃基板，一 弟-—玻璃基板以及' 液晶層夹設於该兩基板的内表面之 間。該第一玻璃基板具有一組電極接點。該影像感測器係 設於該第一玻璃基板之内表面並且電性連接至該組電極接 點。一鏡片設於該第一玻璃基板之外表面，用以將影像聚 焦至該影像感測器。一般而言，該兩基板之外側係分別貼 附偏光片，並且該鏡片較佳係設於該第一玻璃基板上偏光 片貼附區域之外。 5亥衫像感測器可以利用「晶片上玻璃（Ch i p 〇n G 1 as s， COG)」技術安裝在玻璃基板上。該影像感測器可以是呈積 體電路晶片形式之電荷耦合元件感測器（CCD sensor)或互 補金屬氧化物半導體感測器（C μ 〇 s s e n s 〇 r)。較佳地， 影像感測器係設於該第一玻璃基板上相對於第二玻璃基板之 之外的區域。 相較於數位攝像器加上顯示器之習用配置，本發明拍攝 並且顯不影像的裝置具有較佳之空間效益。此外，由於該 影像感測器係直接以「晶片上玻璃」技術安裝在液晶顯示 面板之基板上，因此可以節省封裝影像感測器晶片所需之 材料（例如透明窗口以及其所使用之封裝基板）以及製造 成本。此外，配合該影像感測器之週邊積體電路亦可直接P01-106, Ptd 519582 V. Description of the invention (2) An image device, which can overcome the aforementioned problems of the prior art. To achieve the above and other objectives, the present invention provides a device for capturing and displaying an image, which mainly includes a liquid crystal display panel and an image sensor directly disposed on the liquid crystal display panel, thereby effectively reducing the occupation of the device. Space. The liquid crystal display panel includes a first glass substrate, a primary glass substrate and a liquid crystal layer sandwiched between the inner surfaces of the two substrates. The first glass substrate has a set of electrode contacts. The image sensor is disposed on an inner surface of the first glass substrate and is electrically connected to the group of electrode contacts. A lens is disposed on the outer surface of the first glass substrate and is used to focus an image to the image sensor. Generally speaking, polarizers are attached to the outer sides of the two substrates, respectively, and the lens is preferably disposed outside the polarizer attachment area on the first glass substrate. The 5H-shirt image sensor can be mounted on a glass substrate using "Chip On Glass (Cip On G 1 as s, COG)" technology. The image sensor may be a charge coupled device sensor (CCD sensor) or a complementary metal oxide semiconductor sensor (C μ s s en s 〇 r) in the form of an integrated circuit chip. Preferably, the image sensor is disposed on an area of the first glass substrate that is outside the second glass substrate. Compared with the conventional configuration of a digital camera and a display, the device for shooting and displaying images according to the present invention has better space efficiency. In addition, because the image sensor is directly mounted on the substrate of the liquid crystal display panel using "glass on chip" technology, it can save the materials needed to package the image sensor chip (such as the transparent window and the packaging substrate used by it). ) And manufacturing costs. In addition, the peripheral integrated circuit with the image sensor can also directly

第5頁 519582 五、發明說明（3) ----------—-二一 设置在液曰航— 上的導雷日日4不面板之基板上，然後利用形成在玻璃基板 截并+ 線路連接該影像感測器，因此習用技術中用以承 載並電性遠垃旦彡μ a 介叮☆ &按〜‘感測器以及週邊積體電路之印刷電路板 :ΐ略而進一步降低材料成本。 顯：讓本發明之上述和其他目的、特徵、和優點能更明 * 下文特舉本發明較佳實施並配合所附圖示， 細呪明如下。 【發明說明】 =1圖所_不為根據本發明第一較佳實施例之用以拍攝影 ι=、’、且顯不影像的裝置1〇〇，其主要包含一液晶顯示面板 丄以^及一影像感測器1 3 0直接設在該液晶顯示面板丨i 〇 上 ^ /夜晶顯示面板11 0主要係包含兩玻璃基板11 2、11 4 !!及二液晶層11 6夾設於該基板11 2、11 4内表面之間。值 得’主思的疋，該影像感測器1 3 0係設於玻璃基板11 2内表面 上相對於基板11 4之外的區域。可以理解的是，玻璃基板 U2可以是所謂的薄膜電晶體基板（TFT substrate)，而下 玻璃基板114即為所謂的彩色濾光片基板（CF substrate)。彩色濾光片基板上一般設有複數個彩色 片以及=共同電極，而薄膜電晶體基板上一般設有複^條 彼=平打的掃描線；複數條彼此平行的資料線，其垂直於 該掃描匯流線；及複數個薄膜電晶體與像素電極，該薄膜 電晶體及像素電極係成矩陣式排列於該掃描匯流線與資料 匯流線的交叉部分。該兩基板112、114間一般設有間隔件 (spacer)(未示於圖中）用以界定該基板之間的間隔Page 5 519582 V. Description of the invention (3) ------------21 on the base plate of the light guide on the liquid day, and then it is formed on the glass substrate Intercepting + wiring to connect the image sensor, so the conventional technology is used to carry and electrically remote 彡 μ a medium ☆ & press ~ 'Sensor and the printed circuit board of the peripheral integrated circuit: omitted And further reduce material costs. Obviously: to make the above and other objects, features, and advantages of the present invention clearer * The following describes the preferred implementation of the present invention with the accompanying drawings, and the details are as follows. [Explanation of the invention] = 1 Figure _ is not a device 100 for photographing and displaying images according to the first preferred embodiment of the present invention, which mainly includes a liquid crystal display panel 丄 ^ And an image sensor 130 is directly arranged on the liquid crystal display panel 丨 i 〇 ^ / night crystal display panel 110 is mainly composed of two glass substrates 11 2, 11 4 !! and two liquid crystal layers 116 are sandwiched between Between the inner surfaces of the substrates 11 2, 11 4. It is worth mentioning that the image sensor 130 is disposed on an inner surface of the glass substrate 11 2 outside the substrate 11 4. It can be understood that the glass substrate U2 may be a so-called thin film transistor substrate (TFT substrate), and the lower glass substrate 114 is a so-called color filter substrate (CF substrate). The color filter substrate is generally provided with a plurality of color plates and a common electrode, and the thin film transistor substrate is generally provided with a plurality of scanning lines that are parallel to each other; a plurality of data lines parallel to each other are perpendicular to the scanning bus Lines; and a plurality of thin film transistors and pixel electrodes, the thin film transistors and pixel electrodes are arranged in a matrix at the intersection of the scanning bus line and the data bus line. A spacer (not shown) is generally provided between the two substrates 112 and 114 to define a space between the substrates.

第6頁 519582 五、發明說明（4) (gap ) ° 如第1圖所示，玻璃基板11 2係大於玻璃基板丨1 4，並且 兩基板112、114結合後玻璃基板112有兩邊會突出於該基 板11 4。忒基板11 2突出於該基板11 4之第一邊部係設有該 影像感測器1 3 0，而該基板11 2突出於該基板丨丨4之第二邊 部可以設置驅動積體電路（drive 1C)例如閘極驅動積體電 路（gate drive 1C)或資料驅動積體電路（data drive 1C)。可以理解的是，drive IC亦可封裝於捲帶承載式封 裝構造（tcp)再利用異位性導電膠（ACF)電性連接至該基板 11 2第二邊部上的電極接點。該基板丨丨2之第一邊部設有一 組電極接點（未示於圖中）用以電性連接至該影像感測器 1 3 0，該組電極接點可以由基板丨丨2上的導電層（例如M j， M2或銦錫氧化物（ITO)層）延伸而出。一鏡片132設於該玻 璃基板11 2之外表面，用以將影像聚焦至該影像感測器 13 0。一般而言，該兩基板之外側係分別貼附偏光片丨2 2，Page 6 519582 V. Description of the invention (4) (gap) ° As shown in Figure 1, the glass substrate 11 2 is larger than the glass substrate 丨 1 4 and the two sides of the glass substrate 112 will protrude from both sides after the two substrates 112 and 114 are combined. The substrate 11 4.忒 The first edge of the substrate 11 2 protruding from the substrate 11 4 is provided with the image sensor 1 3 0, and the second edge of the substrate 11 2 protruding from the substrate 丨 4 can be provided with a drive integrated circuit (Drive 1C) For example, a gate drive integrated circuit (gate drive 1C) or a data drive integrated circuit (data drive 1C). It can be understood that the drive IC can also be packaged in a tape-and-reel packaging structure (tcp) and then electrically connected to the electrode contact on the second side of the substrate 11 by using an anisotropic conductive adhesive (ACF). A set of electrode contacts (not shown in the figure) is provided on the first side of the substrate 丨 2 for electrical connection to the image sensor 130. The group of electrode contacts can be connected to the substrate 丨 2 A conductive layer (such as an M j, M 2 or indium tin oxide (ITO) layer) is extended. A lens 132 is disposed on the outer surface of the glass substrate 11 2 to focus the image to the image sensor 130. Generally speaking, polarizers are attached to the outer sides of the two substrates.

並且戎鏡片1 3 2車父佳係設於該基板j j 2上偏光片貼附區域疗 外0 可以理解的是，該影像感測器丨3 〇必須對準該鏡片丨32使 知影像感測器1 3 0精確地位在鏡片1 3 2的光學軸以及聚焦面 上。因此’反射自物體或景象的光線係通過該鏡片丨3 2以 及玻璃基板11 2而到達影像感測器表面。此時，影像感測 器將產生反應入射光之光致訊號（1 ight — generated s 1 gna 1 s) °而來自影像感測器之類比訊號係被一類比數位 轉換器（analog-to-digital (A/D) converter)轉成數位And the Rong lens 1 3 2 is located on the substrate jj 2. The polarizer attachment area is outside the treatment. It can be understood that the image sensor 3 must be aligned with the lens 32 to make the image sensing The position of the lens 130 is precisely on the optical axis and the focusing surface of the lens 132. Therefore, the light reflected from the object or scene passes through the lens 3 2 and the glass substrate 11 2 to reach the surface of the image sensor. At this time, the image sensor will generate a light signal (1 ight — generated s 1 gna 1 s) that reflects the incident light, and the analog signal from the image sensor is converted by an analog-to-digital converter. (A / D) converter) to digital

P01-106.ptdP01-106.ptd

第7頁 519582 五、發明說明（5) /弋並且進一步被邏輯電路或程式化處理器 3。:二)處理而產生該物體或景象被拍攝 上，Ρ彳與# 5二邊積體電路可以同樣設於基板11 2 連接：：最上的導電線路與其電性 PPRH 輸出矾旒則错由與系統電路板（system 接摊带接之可撓性印刷電路（FPC)送出。此外，這些週邊 像成、則！2係整合於系統電路板(SyStem PCB)中，則影 像感測為藉由可撓性印刷電路與系統電路板連接。 «，感測器較佳係利用「晶片上玻璃（chip如 mu)」技術安襄在玻璃基板上而電性連接該基板 、邛上的電極接點。該影像感測器可以是呈積體 .:片形式之電荷耦合元件感測器（CCD sensor)。此 ，、亦可使用其他的影像元件。例如，呈積體電路晶片 ^互補金屬氧化物半導體感測器（CM0S “…◦。或㈣ 二，：ί ΐ可對入射光反應產生可偵測之電子訊號。 :、 ^ 益之優點在於前述週邊積體電路之功能 Γ以置於|積體電路内。使用CM〇s製程所製造之元 以允許將光m ϊ以及處理t置製造在單—晶片上，而 大幅降低整個系統之尺寸以及成本。 第2圖所不為根據本發明第二較佳實施例之用以拍攝影 像並且顯不影像的裝置2〇〇，其主要包含一液晶顯示面板 2 1 0以及一影像_感測器丨3 〇直接設在該液晶顯示面板2 j 〇 上。該液晶顯示面板21〇主要係包含兩玻璃基板212、214 以及一液晶層216夾設於該基板212、214内表面之間。值Page 7 519582 V. Description of the invention (5) / 弋 and further by logic circuits or stylized processors 3. : B) The object or scene produced by the processing is photographed. P 彳 and # 5 two-sided integrated circuit can be set on the substrate 11 2 as well: The uppermost conductive line and its electrical PPRH output are not properly connected to the system. The circuit board (system is connected to the flexible printed circuit (FPC). It is also sent out. In addition, these peripherals are like, then! 2 is integrated into the system circuit board (SyStem PCB), and the image is sensed by the flexible The printed circuit board is connected to the system circuit board. «The sensor is preferably connected to the electrode contacts on the glass substrate using the" chip on glass (mu) "technology on the glass substrate. The The image sensor can be in the form of a chip: a charge-coupled element sensor (CCD sensor) in the form of a chip. Therefore, other image elements can also be used. For example, a chip in a chip circuit is a complementary metal oxide semiconductor sensor. Detector (CM0S "... ◦. Or ㈣ Two :: ΐ ΐ can generate a detectable electronic signal in response to incident light. The advantage of the benefit is that the aforementioned peripheral integrated circuit function Γ is placed in the | integrated circuit内。 Made using the CM0s process The light m ϊ and the processing t are allowed to be manufactured on a single wafer, and the size and cost of the entire system are greatly reduced. The second figure is not used to capture images and display images according to the second preferred embodiment of the present invention. The device 200, which mainly includes a liquid crystal display panel 210 and an image sensor 301, is directly disposed on the liquid crystal display panel 2j. The liquid crystal display panel 21o mainly includes two glass substrates. 212 and 214 and a liquid crystal layer 216 are sandwiched between the inner surfaces of the substrates 212 and 214.

第8頁 519582 五、發明說明（6) 传 >主意的是，該影像感測器丨3 〇係設於玻璃基板2 i 2内表面 上相對於基板2 1 4之外的區域。可以理解的是，玻璃基板 2 1 2可以是所謂的彩色濾光片基板，而下玻璃基板2丨4即為 所謂的薄膜電晶體基板。 如第2圖所示，該基板2丨2突出於該基板2丨4之邊部係設 f該影像感測器130，而該基板214突出於該基板212之邊 部可以設置驅動積體電路（drive iC)例如閘極驅動積體電 路（gate drive 1C)或資料驅動積體電路（data drivePage 8 519582 V. Description of the invention (6) The main idea is that the image sensor 3 is located on the inner surface of the glass substrate 2 i 2 outside the substrate 2 1 4. It can be understood that the glass substrate 2 1 2 may be a so-called color filter substrate, and the lower glass substrate 2 4 is a so-called thin film transistor substrate. As shown in FIG. 2, the edge of the substrate 2 丨 2 protruding from the substrate 2 丨 4 is provided with the image sensor 130, and the substrate 214 protruding from the edge of the substrate 212 may be provided with a drive integrated circuit. (Drive iC) such as gate drive integrated circuit (gate drive 1C) or data drive integrated circuit (data drive

1C)。該基板21 2突出於該基板214之邊部設有一組電極接 點（未示於圖中）用以電性連接至該影像感測器丨3〇，該 組電極接點可以由基板212上的導電層（例如遮光層（BM) 或銦錫氧化物（I το)層）延伸而出。一鏡片132設於該玻璃 基板212之外表面，用以將影像聚焦至該影像感測器13〇。 一般而言’該兩基板之外側係分別貼附偏光片2 2 2，並且 忒鏡片1 3 2較佳係設於該基板2 1 2上偏光片貼附區域之外。 該影像感測器130較佳係利用「晶片上玻璃（Chip 〇n Glass，COG)」技術安裝在玻璃基板上而電性連接該基^r 212突出邊部上的電極接點。在本實施例中，前述之週 積體電路可以同樣設於基板212上，則影像感測器需藉由 基板212上的導電線路與其電性連接，而最終之輸出^號 則藉由與系統電路板（system PCB)連接之可撓性印刷電路 (FPC)送出。此外，這些週邊積體電路較佳係整合於系統 電路板（system PCB)中，則影像感測器藉由可撓性印刷 路與系統電路板連接。 电1C). A set of electrode contacts (not shown in the figure) protruding from the edge of the substrate 214 is electrically connected to the image sensor. The set of electrode contacts can be provided on the substrate 212. A conductive layer such as a light-shielding layer (BM) or an indium tin oxide (I το) layer is extended. A lens 132 is disposed on the outer surface of the glass substrate 212 and is used to focus the image to the image sensor 130. Generally speaking, 'the polarizers 2 2 2 are respectively attached to the outer sides of the two substrates, and the 忒 lens 1 3 2 is preferably provided outside the polarizer attachment area on the substrate 2 1 2. The image sensor 130 is preferably mounted on a glass substrate using "Chip On Glass (COG)" technology and is electrically connected to electrode contacts on the protruding edges of the substrate 212. In this embodiment, the aforementioned peripheral integrated circuit can also be provided on the substrate 212, so the image sensor needs to be electrically connected to it through the conductive line on the substrate 212, and the final output ^ number is connected to the system by The flexible printed circuit (FPC) connected to the system PCB is sent out. In addition, these peripheral integrated circuits are preferably integrated in a system PCB, and the image sensor is connected to the system circuit board through a flexible printed circuit. Electricity

P01-106.ptd 第9頁 519582 五、發明說明（7) 一當本發明拍攝並且顯示影像 (Video conferencing)時，兮旦/ 用於視訊會議 攝以及傳送視訊，而液晶顧Γ 感娜器係用以從近端拍 本發明拍攝並且顯示影像的裳二益之習用配置， 外，由於該影像感測器係直接；：曰乂佳之空間效益。此 在液晶顯示面板之基板上， 曰曰μ上玻璃」技術安裝 晶片所需之材#(例如透明窗：：省封裝影像感測器 路亦可直接設置在液晶顯：：二邊積體電 在玻璃基板上的導電線路連接。目此 枯=利用形成 並電性連接影像感測器 ^中用U承载 可省略而進-步降低材料=邊積體電路之印刷電路板亦 雖然本發明已以前述較佳實施 定本發明，任何孰習舲姑菽水— 然其並非用以限 範圍内，當可作：種之不脫離本發明之精神和 佳實施例係利用以一笼ίη。例如雖然本發明之較 感測器亦可設於i他且；透：：f加以說明、然而該影像 顯示面板（0LED panel))上，而達成本發明： 範圍所=者=本發明之保護範圍當視後附之申請專利P01-106.ptd Page 9 519582 V. Description of the invention (7) When the present invention captures and displays video (Video conferencing), it is used for video conferencing and video transmission, and the LCD monitor sensor system The conventional configuration of Chang Eryi, which is used to shoot and display the image taken by the present invention from a near end, and because the image sensor is direct; On the substrate of the liquid crystal display panel, the material required for mounting the wafer on the "μ on glass" technology # (for example, transparent window :: provincial packaged image sensor circuit can also be directly set on the liquid crystal display :: two-sided integrated circuit The conductive circuit connection on the glass substrate. At this point = using the U-bearing in the formation and electrical connection of the image sensor ^ can be omitted while further reducing the material = the printed circuit board of the side-on-chip circuit. The present invention is determined by the foregoing preferred implementation, and any practice of water is not intended to be used within a limited scope, but it can be used as follows: a kind without departing from the spirit and preferred embodiments of the present invention is utilized in a cage. For example, although the present invention The comparative sensor can also be provided on the other side; it is explained through: f, but the image display panel (0LED panel), and the cost of the invention is as follows: The scope == the scope of the present invention when viewed Attached patent

第10頁 519582 圖式簡單說明 【圖示說明】 第1圖：根據本發明第一較佳實施例之用以拍攝影像並 且顯示影像的裝置側視圖；及 第2圖：根據本發明第二較佳實施例之用以拍攝影像並 且顯示影像的裝置側視圖。 【圖號說明】 100 用以拍攝影像並且顯示影像的裝置 110 液晶顯示面板 112 玻璃基板 114 玻璃基板 116 液晶層 122 偏光片 130 影像感測器132鏡片 20 0 用以拍攝影像並且顯示影像的裝置 210 液晶顯不面板 212 玻璃基板 214 玻璃基板 216 液晶層Page 519582 Brief description of the drawings [Illustration] Figure 1: Side view of a device for capturing and displaying images according to the first preferred embodiment of the present invention; and Figure 2: Second comparison according to the present invention A side view of a device for taking an image and displaying the image in a preferred embodiment. [Illustration of drawing number] 100 A device for capturing and displaying an image 110 Liquid crystal display panel 112 Glass substrate 114 Glass substrate 116 Liquid crystal layer 122 Polarizer 130 Image sensor 132 Lens 20 0 Device for capturing and displaying image 210 LCD display panel 212 glass substrate 214 glass substrate 216 liquid crystal layer

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