patents.google.com

TWM419877U - Heat-dissipation structure of LED light bulb - Google Patents

  • ️Sun Jan 01 2012

TWM419877U - Heat-dissipation structure of LED light bulb - Google Patents

Heat-dissipation structure of LED light bulb Download PDF

Info

Publication number
TWM419877U
TWM419877U TW100210114U TW100210114U TWM419877U TW M419877 U TWM419877 U TW M419877U TW 100210114 U TW100210114 U TW 100210114U TW 100210114 U TW100210114 U TW 100210114U TW M419877 U TWM419877 U TW M419877U Authority
TW
Taiwan
Prior art keywords
lamp
lamp cup
heat
cup
heat dissipation
Prior art date
2011-06-03
Application number
TW100210114U
Other languages
Chinese (zh)
Inventor
Chen-Lung Huang
Chuan-Pan Huang
Original Assignee
Chen-Lung Huang
Chuan-Pan Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
2011-06-03
Filing date
2011-06-03
Publication date
2012-01-01
2011-06-03 Application filed by Chen-Lung Huang, Chuan-Pan Huang filed Critical Chen-Lung Huang
2011-06-03 Priority to TW100210114U priority Critical patent/TWM419877U/en
2012-01-01 Publication of TWM419877U publication Critical patent/TWM419877U/en
2012-01-20 Priority to JP2012009926A priority patent/JP2012253005A/en

Links

  • 230000017525 heat dissipation Effects 0.000 title claims description 35
  • 239000000853 adhesive Substances 0.000 claims description 4
  • 230000001070 adhesive effect Effects 0.000 claims description 4
  • 239000003973 paint Substances 0.000 claims description 3
  • 235000010627 Phaseolus vulgaris Nutrition 0.000 claims 1
  • 244000046052 Phaseolus vulgaris Species 0.000 claims 1
  • 239000003795 chemical substances by application Substances 0.000 claims 1
  • 238000001816 cooling Methods 0.000 claims 1
  • 239000011810 insulating material Substances 0.000 claims 1
  • 239000002689 soil Substances 0.000 claims 1
  • 230000007306 turnover Effects 0.000 claims 1
  • 238000004519 manufacturing process Methods 0.000 description 4
  • 239000000463 material Substances 0.000 description 4
  • 229910052782 aluminium Inorganic materials 0.000 description 3
  • XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
  • 239000011248 coating agent Substances 0.000 description 3
  • 238000000576 coating method Methods 0.000 description 3
  • 230000000694 effects Effects 0.000 description 3
  • 238000009423 ventilation Methods 0.000 description 3
  • 230000007613 environmental effect Effects 0.000 description 2
  • OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
  • 229910052799 carbon Inorganic materials 0.000 description 1
  • 230000008878 coupling Effects 0.000 description 1
  • 238000010168 coupling process Methods 0.000 description 1
  • 238000005859 coupling reaction Methods 0.000 description 1
  • 239000004744 fabric Substances 0.000 description 1
  • 230000001788 irregular Effects 0.000 description 1
  • 239000007769 metal material Substances 0.000 description 1
  • 238000000034 method Methods 0.000 description 1
  • 238000013022 venting Methods 0.000 description 1

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

M419877 五、新型說明: 【新型所屬之技術領域】 本創作係關於LED燈泡散熱結構,尤指一種於燈杯之外表面 塗佈有散熱塗料,即可藉由該燈杯將LED所生之高熱散佈到 外圍環境_,達到LED燈泡散熱之效果,延長led燈泡使 用壽命之LED燈泡結構創新性。 , 【先前技術】 按習知之LED燈泡,如臺灣新型專利第财〇2387號「具散熱之 LED燈泡」,為了讓LED麼泡得以散熱,係以由铭材所製成之 散熱座,並於前述散熱座設通孔,於前述通孔設有數個透氣 槽道,該等透氣槽道係連通於散熱座一端之外壁面上形成有 透氣缺槽,前述散熱座外壁面設數散熱葉片,該等散熱葉片 間形成有散熱槽;一導熱板,係設於散熱座上,該導熱板係 由鋁材所製成,該導熱板之一端面係設有一供散熱座之凸緣 嵌設之凹槽,於導熱板之容室内壁設數散熱孔,散熱孔係對 正於散熱座之透氣槽道,於容室之内壁面設有穿槽。亦即, 習知LED燈泡主要係以散熱座與導熱板作為LED燈泡之散熱元 件,惟前述散熱座與導熱板需先以鋁材成型,之後,再以加 工機械對散熱座與導熱板表面進行細部加工,始能成型前述 散熱座與導熱板之結構,其缺點為鋁材成型之散熱座與導熱 板雖有導熱快速之優點,但製造過程複雜,成本非常高,使 得LED燈泡售價偏高,無法有效普及於一般消費大眾,造成真 正省電之LED燈泡無發揮之餘地。 為此,本創作者,積多年相關產品之製造與設計經驗,特針 對前述習知LED燈泡之結構缺點加以研究,乃創作本案。 【新型内容】 ’ 本創作之目的,乃在提供一種結構簡易,以降低製造成本, 為消費者所接受,讓具備省電綠色環保之省電LED燈泡之使 3 M419877 用率更為提升,減少環境令之排碳量。 之^散熱結構,主要係於燈杯外表面塗佈有散 熱塗枓’仔错由該燈杯為LED燈泡散埶之用#、,f:有f 低LED燈泡之製造成本。 …之用途’亚因此而降 【實施方式】 審查員得以充分了解本創作的結構特徵' 〔㈣卜3所示mED燈4泡= 燈頭卜前述燈頭1設外螺紋10,得以利用該 紋10與燈座栓設而導接電源,於前述燈 得 以利用内螺紋U與有燈頭連接件2栓設結合二内螺紋1卜付 ^頭連接件2,設外螺紋2〇,得前 燈頭i之_紋U栓設結合,前述燈頭連接= 麵杯3 _35;電ί模組 二置其巾別述燈頭連接件2設延伸環圍23,前 之上方並設複數卡合元件24 ’以利用前述卡合元 燈杯3卡合固設;前述燈頭連接件2並設有外環圍乃。/、 燈杯3,為外A狀’前述燈杯3設内結合環圍3 Z-tm 3 "t; ^ 3 〇固5又(如圖3 — 5 ),並讓前述燈杯3之底端3〗知 述燈頭連接件2之外環圍25,即可將燈了=刖M419877 V. New description: [New technical field] This creation is about the heat dissipation structure of LED bulbs, especially one that is coated with heat-dissipating coating on the outer surface of the lamp cup, which can be used to heat the LEDs. Spread to the external environment _, to achieve the effect of LED bulb heat dissipation, extend the LED bulb structure structure innovation. [Prior Art] According to the conventional LED bulb, such as Taiwan's new patent No. 2387 "LED bulb with heat dissipation", in order to let the LED bubble dissipate heat, it is made of a heat sink made of Ming materials. The heat dissipation seat is provided with a through hole, and the through hole is provided with a plurality of ventilation channels, wherein the ventilation channels are connected to one end of the heat dissipation seat, and a gas venting groove is formed on the outer wall surface, and the outer wall surface of the heat dissipation seat is provided with a plurality of heat dissipation blades. A heat dissipating groove is formed between the heat dissipating blades; a heat conducting plate is disposed on the heat dissipating seat, the heat conducting plate is made of aluminum material, and one end surface of the heat conducting plate is provided with a concave surface for the flange of the heat dissipating seat The slot is provided with a plurality of heat dissipation holes in the inner wall of the heat conducting plate, and the heat dissipation holes are aligned with the ventilation channels of the heat dissipation seat, and the inner wall surface of the cavity is provided with a through groove. That is to say, the conventional LED bulb mainly uses the heat sink and the heat conducting plate as the heat dissipating component of the LED bulb, but the heat sink and the heat conducting board need to be formed by aluminum first, and then the processing machine is used to heat the heat sink and the surface of the heat conducting board. The detailed processing can form the structure of the heat sink and the heat conductive plate. The disadvantage is that the heat sink and the heat conductive plate of the aluminum material have the advantages of rapid heat conduction, but the manufacturing process is complicated and the cost is very high, so that the LED bulb has a high price. Can not effectively spread to the general consumer, resulting in real power-saving LED bulbs have no room to play. To this end, the creator, who has accumulated years of experience in the manufacture and design of related products, has specially studied the structural shortcomings of the aforementioned conventional LED bulbs, and created the case. [New Content] 'The purpose of this creation is to provide a simple structure to reduce manufacturing costs, which is acceptable to consumers, so that the energy-saving LED bulbs with energy-saving green and environmental protection will increase the utilization rate of 3 M419877 and reduce The environment allows for carbon emissions. The heat dissipation structure is mainly applied to the outer surface of the lamp cup coated with a heat-dissipating coating, which is used for the LED bulb to dissipate the light bulb. #, f: The manufacturing cost of the low-LED bulb. The use of ... 'As a result of this, the implementation method】 The examiner can fully understand the structural characteristics of this creation' [(4) Bu 3 shown mED lamp 4 bubble = lamp head, the above lamp head 1 is provided with external thread 10, to be able to use the pattern 10 with The lamp holder is bolted to guide the power supply, and the lamp can be bolted with the internal thread U and the cap connector 2 to be combined with the two internal threads 1 and the head connector 2, and the external thread 2 is provided, and the front lamp head i is obtained. The U-plug is combined, the above-mentioned lamp head connection = cup 3 _35; the electric 模组 module is provided with a cover, and the cap connector 2 is provided with an extension ring 23, and a plurality of engaging elements 24' are disposed above the front to utilize the card The unit light cup 3 is snap-fitted; the aforementioned lamp head connector 2 is provided with an outer ring circumference. /, lamp cup 3, for the outer A-shaped 'the aforementioned light cup 3 is set with the inner ring 3 Z-tm 3 "t; ^ 3 tamping 5 again (as shown in Figure 3 - 5), and let the aforementioned light cup 3 The bottom end 3 is described as the outer ring 25 of the lamp connector 2, and the lamp can be turned off = 刖

結合穩固;祕燈杯3之開口端設有複數定、突且 U ===導熱板4固設(如圖3 )】如二 所不化成之§又置關32A,亦得為導熱板4 33、或内表面34、或外及内二二 並塗佈有散熱塗料,如此,得藉由該燈杯 以為LED燈泡所生之織熱之用途。前二之 35 ’如此,即传以前述燈杯3之腔室%為電源模組7設置, 4 並讓電源模組7之下方抵頂於前述燈頭連接件2之腔室21的 上環圍22,即可將電源模組7固設於前述燈杯3之腔室% 與f述燈頭連接件2之腔室21之中;前述燈杯3之會八狀開 I 圖3及4 ) ’並形成非規則狀之内表面34,且形成有部 分之圓弧狀表面340 ’因此,得為導熱板設置並定位;或如圖 4及5,於喇叭口處形成結合環圍36,以為燈罩6固設。 前述燈杯3’如圖3 — 6,得為密閉狀之環壁,或如圖7所示, 亦得於環賴置有複數之散熱孔37,得_前述散熱孔37 配合燈杯所塗佈之散熱塗料,更為提升燈杯3之散熱效果, 確保LED燈泡之使用壽命。 * ,熱板4 ’設於前述燈杯之内部,前述導熱板4係由金屬材質 製成,且於導熱板4與燈杯3結合時,係將導熱板4自燈杯 之開口往内設置’並讓導熱板4之側環圍4〇之外壁面4〇〇得 以抵設於前述燈杯3之内表面34之部分表面,主要乃是利用 導熱板4之侧環圍40的外壁面400形成圓弧狀,並前述燈杯 3之内表面34亦設有部分之圓弧狀表面34〇,且利用燈杯所 形成之喇〇八狀開口,使得前述導熱板4之侧環圍4〇的外壁面 =0得與前述燈杯3之内表面34之部分表面呈現完全結合狀 悲’除了可確定導熱板4與燈杯3之結合位置,.不至於繼續 往下移動外,更可讓導熱板4將LED發光二極體所生之高溫 充刀導引到燈杯3 ’讓散熱效果更為快速與有效。並以前^燈 杯3之定位突緣32卡固於導熱板4之侧環圍40 (如圖3及 4 )’即可將導熱板4與燈杯3充分固設於結合;前述導熱板 4設槽41,於槽底壁設有位凸柱42,得與電路板5之定位孔 50結合,及前述導熱板4之槽底壁設栓設孔43,得為栓設元 件430栓設’即可將電路板5與導熱板4充分固定。 於前述導熱板4之上方設有電路板5,利用前述電路板5以為 LED發光二極體51設置,以發出光源。或如圖6所示,得將 前述導熱板與電路板製成一體,而省略部分元件,亦可節省 料19877 ’但該導熱板4A需為絕緣材料 一極體51設置其中。 斗斤製成,以為LED發光 於别述燈杯3之開口設燈置6, 於前述内延伸環圍6。 6設内延伸環圍6Q, 利用前述内延伸環圍60及下2環圍61,如圖3,得 即可將燈罩6與燈杯3固設。^圍4=為著, 環圍之外側形成釣合部62 於則述下延伸 燈杯3之結合環圍36結合 =别述鉤合部62與前述The combination is stable; the open end of the secret light cup 3 is provided with a plurality of fixed and protruding U === heat-conducting plate 4 is fixed (as shown in Fig. 3)] If the two are not formed, the § is also closed 32A, and the heat-conductive plate 4 is also obtained. 33. Or the inner surface 34, or the outer and inner layers are coated with a heat dissipating paint. Thus, the lamp cup is used for the purpose of ray heat generated by the LED bulb. The first two 35's, that is, the chamber % of the lamp cup 3 is set to the power module 7, 4 and the lower side of the power module 7 is abutted against the upper ring 22 of the chamber 21 of the lamp connector 2 The power module 7 can be fixed in the chamber of the lamp cup 3 and the chamber 21 of the lamp connector 2; the lamp cup 3 will be opened in the shape of FIG. 3 and 4). Forming an irregular inner surface 34, and forming a partial arcuate surface 340 ' Therefore, it is provided and positioned for the heat conducting plate; or as shown in FIGS. 4 and 5, a coupling ring 36 is formed at the bell mouth, so that the lamp cover 6 Fixed. The light cup 3' is formed as a closed ring wall as shown in FIG. 3-6, or as shown in FIG. 7, a plurality of heat dissipation holes 37 are also disposed in the ring, and the heat dissipation hole 37 is coated with the lamp cup. The heat-dissipating coating of the cloth enhances the heat dissipation effect of the lamp cup 3 and ensures the service life of the LED bulb. * The hot plate 4' is disposed inside the lamp cup, and the heat conducting plate 4 is made of a metal material, and when the heat conducting plate 4 is combined with the lamp cup 3, the heat conducting plate 4 is disposed from the opening of the lamp cup. 'And the side wall 4 of the heat conducting plate 4 is placed against the surface of the inner surface 34 of the lamp cup 3, mainly by the outer wall surface 400 of the side ring 40 of the heat conducting plate 4. Forming an arc shape, and the inner surface 34 of the lamp cup 3 is also provided with a partial arc-shaped surface 34〇, and the side of the heat conducting plate 4 is surrounded by a slap-shaped eight-shaped opening formed by the lamp cup. The outer wall surface =0 has a complete combination with the surface of the inner surface 34 of the lamp cup 3, except that the position of the heat conducting plate 4 and the lamp cup 3 can be determined, and it is not allowed to continue moving downward, and The heat conducting plate 4 guides the high temperature filling knife generated by the LED light emitting diode to the lamp cup 3' to make the heat dissipation effect more rapid and effective. And the positioning flange 32 of the lamp cup 3 is fastened to the side ring 40 of the heat conducting plate 4 (as shown in FIGS. 3 and 4), and the heat conducting plate 4 and the lamp cup 3 are sufficiently fixedly combined; the heat conducting plate 4 is The slot 41 is provided with a stud 42 at the bottom wall of the slot, and is coupled with the positioning hole 50 of the circuit board 5, and the bottom wall of the heat conducting plate 4 is provided with a bolting hole 43 for tying the bolting member 430. The circuit board 5 and the heat conducting plate 4 can be sufficiently fixed. A circuit board 5 is disposed above the heat conducting plate 4, and the LED board 5 is provided by the circuit board 5 to emit a light source. Alternatively, as shown in Fig. 6, the heat conducting plate and the circuit board may be integrally formed, and a part of the components may be omitted, and the material of the heat insulating plate 4A may be provided in the insulating body. The jack is made up, so that the LED is illuminated, and the light is set to 6 in the opening of the lamp cup 3, and the inner circumference 6 is extended in the foregoing. 6 is provided with an inner extension ring 6Q, and the inner cover ring 60 and the lower 2 ring circumference 61 are used. As shown in Fig. 3, the lamp cover 6 and the lamp cup 3 can be fixed. ^4=================================================================================

ΤΤ_罩與脉結合成-體。 ί省大燈ΐ與散熱結構加以改變,除了可以 ί : ί r圖斗 環保之實用價值,為本案之組成。 【圖式簡單說明】 圖1是本創作之立體組合視圖。 圖2是本創作實施例一之分解視圖。 圖3是本創作實施例一之剖視圖。 圖4是本創作實施例二之剖視圖。 圖5是本創作實施例三之剖視圖。 圖6是本創作實施例四之分解視圖。 圖7是本創作實施例五之立體視圖。 【主要元件符號說明】 燈頭1、外螺紋10、内螺紋11 燈頭連接件2、外螺紋20、腔室21、上環圍22、延伸環圍23、 卡合元件24、外環圍25。 燈杯3、内結合環圍30、底端31、定位突緣32、設置環圍32A、 外表面33、内表面34、圓弧狀表面34〇、腔室35、結合環圍 %、散熱孔37 6 M419877The ΤΤ_ hood and the pulse combine to form a body. ί Province headlights and heat dissipation structure have been changed, in addition to ί : ί r 斗 斗 environmental protection practical value, the composition of this case. [Simple description of the drawing] Figure 1 is a three-dimensional combination view of the creation. Figure 2 is an exploded view of the first embodiment of the present invention. Figure 3 is a cross-sectional view of the first embodiment of the present invention. Figure 4 is a cross-sectional view of the second embodiment of the present invention. Figure 5 is a cross-sectional view showing the third embodiment of the present invention. Figure 6 is an exploded view of the fourth embodiment of the present invention. Figure 7 is a perspective view of the fifth embodiment of the present invention. [Description of main component symbols] Lamp cap 1, external thread 10, internal thread 11 base connector 2, external thread 20, chamber 21, upper ring 22, extension ring 23, engaging element 24, outer ring circumference 25. The lamp cup 3, the inner joint ring 30, the bottom end 31, the positioning flange 32, the set ring 32A, the outer surface 33, the inner surface 34, the arcuate surface 34〇, the chamber 35, the joint ring%, and the heat dissipation hole 37 6 M419877

導熱板4、側環圍40、外壁面400、槽41、定位凸柱42、栓 設孔43、栓設元件430、導熱板4A 電路板5、定位孔50、LED發光二極體51 燈罩6、内延伸環圍60、下延伸環圍61、鉤合部62 電源模組7、黏著劑8The heat conducting plate 4, the side ring 40, the outer wall surface 400, the groove 41, the positioning protrusion 42, the bolting hole 43, the bolting element 430, the heat conducting plate 4A, the circuit board 5, the positioning hole 50, the LED light emitting body 51, the lampshade 6 , inner extension ring 60, lower extension ring 61, hook portion 62 power module 7, adhesive 8

Claims (1)

M419877 六、申請專利範圍: 1、一種LED燈泡散熱結構,至少包含: 燈頭,設外螺紋,得與燈座固設,前述燈頭設内螺紋,以與 有燈頭連接件之外螺紋栓設結合; Μ ^頭連接件,設腔室,配合燈杯之腔室將電源模組設置其中, :述燈頭連接件設卡合元件,以利用卡合元件與燈杯結合固 設;M419877 Sixth, the scope of application for patents: 1. An LED bulb heat dissipation structure, comprising at least: a lamp cap, which is provided with an external thread, and is fixed to the lamp holder, and the lamp cap is provided with an internal thread to be combined with a threaded bolt having a lamp cap connector; Μ ^ head connector, a chamber, and a chamber for the lamp cup, wherein the power module is disposed therein, wherein: the lamp connector is provided with a snap-in component for fastening with the lamp cup; 燈杯,設複數定位突緣,以為導熱板固設;前述燈杯之外表 面、或内表面、或外、内表面並塗佈有散熱塗料,即得藉由 該燈杯同時作為led燈泡散熱之用途; 曰 導if,設於前述燈杯之内部,並於導熱板設側環圍,得利 用前述側環圍以與前述燈杯之定位突緣結合,並以前述側 f抵頂於前紐杯之内表面,⑽導熱板與燈杯結合固設; 前述導熱板上方並為電路板設置,並利用前述電路板以 LED發光二極體設置; ’ 燈罩,設於前述燈杯之開口,並以黏著劑將燈罩與燈杯結人 成一體,即可組成led燈泡之散熱結構。 口 2 :依申請專利範圍第i項所述之LED燈泡散熱結構,其中燈 =接件之腔室設上環圍缝合燈杯之腔錯電源模組設置 ,其中燈 ,其中燈 3 :依申料利細第i項所述之LED燈泡散熱結構 頭連接件之卡合元件係設於燈頭連接件之延伸環圍。 4_、=中請翻翻第!項所述之LED燈泡散熱結構 頭連接件設外環圍以與燈杯之底端結合。 8 M419877 ϋίίΐΡ合固設,並讓前述燈杯之底端抵頂於燈頭連 6二依申,專利範圍第i項所述之LED燈泡散熱結構,其中燈 與導熱板側環圍之結合,係以導熱板之側環圍的 面抵設於燈杯之喊面的部絲面 之圓弧狀與前述燈杯之内表面;^ 二圓,絲面呈現完全結合狀態,並卿前紐杯所形成 。’使得前述導熱板得與前述燈杯穩定結合,並 7备ft請專利範圍第6項所述之㈣燈泡散熱結構,其令導 =燈杯結合,係將導熱板自燈杯之開口往内設置,、並讓 ΪΪΪ4前述燈杯之内表面,並以燈杯之定位突緣卡固 於導熱板之側環圍。 卜U 8如依申請專利範圍第!項所述之励燈泡散熱結構,其中燈 件ίΐϊίί 置’並讓電源模組抵頂於燈頭連接 接件之腔^中。電源模組固設於燈杯之腔室與燈頭連 9、依申請專利細第!項所述之咖 士^ 杯之環壁得為密閉狀或設置有散熱孔。欺—。構,其中燈 1 〇、依帽專利_第i項所述之LED触散熱 ,罩與燈杯之結合’係於燈罩設内延伸環圍,f ^ 圍以黏著劑與燈杯之内表面黏著’即可將燈申罩::固义, 1 1、依申請專利範圍第1項所述之LED燈泡散教 直中 1 2、一種LED燈泡散熱結構,至少包含: 燈頭,設外螺紋,得與燈座固設,前述燈頭設内螺紋,以與 有燈頭連捿件之外螺紋栓設結合; 、 燈頭連接件,設腔室’配合燈杯之腔室將電源模組設置其中, 前述燈頭連接件設卡合元件,以利用卡合元件與燈杯結'合固 言曼; 燈杯,設一設置環圍,以為導熱板固設;前述燈杯之外表面、 或内表面、或外、内表面並塗佈有散熱塗料,即得藉由該严 杯同時作為LED燈泡散熱之用途; ^ 導熱板,設於前述燈杯之設置環圍上方,前述導熱板上方並 為電路板設置’並利用前述電路板以為LED發光二極體設置; 燈罩,設於前述燈杯之開口’並以黏著劑將燈罩與燈杯结合 成一體,即可組成LED燈泡之散熱結構。 口 1 3、依申清專利範圍第1 2項所述之led燈泡散熱結構,其 中燈頭連接件之腔室設上環圍以配合燈杯之腔室源模^ 設置其中。 、 If、依申請專利範圍第i 2項所述之LED燈泡散熱結構,其 燈頭連接件之卡合元件係設於燈頭連接件之延伸環圍。 if、依申請專利範圍第1 2項所述之led燈泡散熱結構,其 中燈頭連接件設外環圍以與燈杯之底端結合。 、 1 依申請專利範圍第丄2項所述之LED燈泡散熱結構,其 燈杯與燈頭連接件之結合,係以燈杯之内結合環圍與燈頭 ΐΐί之卡合元件卡合固^ ’並讓前述燈杯之底端抵頂於燈 頭連接件之外環圍。 11、依申請專利範圍第1 2項所述之led燈泡散熱結構,豆 中3J與導熱板之結合’得於燈杯形成設置環圍,以為導&amp; 板设置定你。 1》燈ίΓϊίϊϊ, 述之LED燈泡散熱結構,其 為燈罩之下延伸^=於燈杯之開口處形成結合環圍,以 燈罩與燈杯結合成 1體側所形成之鉤合部互相結合’即可將 1 12項所述之led燈泡散熱結構,其 源模組設置’並讓電源模組抵頂於燈頭 頭連接件之腔室^。’可㈣賴、_設於燈杯之腔室與燈 2 第12項所述之led燈泡散熱結構,其 中燈杯之裱壁付為也、閉狀或設置有散熱孔。 2 利細第1 2項所述之LED燈泡散熱結構,其 且罩/、燈杯之結合,係於燈罩設内延伸環圍,於前述内延 π環圍内側设下延伸環圍,得利用前述内延伸環圍及下延伸 壤圍以點著劑與燈杯之内表面黏著,即可將燈罩與燈杯固設。 2 2、依申凊專利範圍第1 2項所述之led燈泡散熱結構,其 中得將導熱板與電路板製成一體,並以絕緣材料製成導熱 板,以為LED發光二極體設置。 ’The lamp cup is provided with a plurality of positioning flanges to fix the heat conducting plate; the outer surface or the inner surface of the lamp cup, or the outer and inner surfaces are coated with a heat dissipating paint, that is, the lamp cup is simultaneously used as a led bulb for heat dissipation. The use of the guide is provided in the interior of the lamp cup and is disposed around the side of the heat-conducting plate. The side ring circumference is used to be combined with the positioning flange of the lamp cup, and the front side f is pressed against the front side. The inner surface of the button, (10) the heat conducting plate is combined with the lamp cup; the heat conducting plate is disposed above the circuit board, and the circuit board is disposed with the LED light emitting diode; the light cover is disposed at the opening of the light cup, And the adhesive cover and the lamp cup are integrated into one body, and the heat dissipation structure of the led bulb can be formed. Port 2: According to the LED bulb heat dissipation structure described in item i of the patent application scope, wherein the lamp=the chamber of the connector is provided with a cavity power supply module with a ring-shaped stitching lamp cup, wherein the lamp, wherein the lamp 3: according to the application The engaging component of the LED bulb heat dissipating structure head connector described in item l is disposed in the extending circumference of the lamp cap connector. 4_, = please turn over the first! The LED bulb heat dissipation structure described in the item is provided with an outer ring to be combined with the bottom end of the lamp cup. 8 M419877 ϋίί 固 固 , , , , , , M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The surface of the side surface of the heat-conducting plate abuts against the arc surface of the surface of the surface of the lamp cup and the inner surface of the lamp cup; ^ two circles, the silk surface is completely combined, and the front cup is form. 'Making the heat-conducting plate to be stably combined with the above-mentioned lamp cup, and 7 (4) the heat-dissipating structure of the bulb as described in item 6 of the patent scope, which is to make the guide plate and the lamp cup are combined, and the heat-conducting plate is directed from the opening of the lamp cup Set, and let ΪΪΪ4 the inner surface of the aforementioned lamp cup, and fix the side flange of the heat-conducting plate with the positioning flange of the lamp cup. Bu U 8 as claimed in the scope of patent application! The light bulb heat dissipation structure described in the item, wherein the lamp is ίίίί and the power module is placed against the cavity of the lamp connector. The power module is fixed in the chamber of the lamp cup and the lamp holder. 9. According to the patent application! The wall of the cup of the coffee cup mentioned in the item is sealed or provided with a heat dissipation hole. bully-. Structure, wherein the lamp 1 〇, the cap according to the patent _ i item touches the heat, and the combination of the cover and the lamp cup is attached to the inner circumference of the lamp cover, and the adhesive is adhered to the inner surface of the lamp cup. 'You can apply the lamp cover:: 固义, 1 1. According to the application of the patent scope, the LED bulb is scattered in the middle of the 1st. 2. The cooling structure of the LED bulb contains at least: the lamp cap, the external thread, Fixing with the lamp holder, the lamp cap is internally threaded to be combined with the threaded bolt of the lamp cap connecting piece; the lamp cap connecting member is provided with a chamber, and the power module is disposed in the chamber of the lamp cup, the lamp cap is arranged The connecting member is provided with a snapping element for utilizing the engaging component and the lamp cup junction; the lamp cup is provided with a ring circumference for fixing the heat conducting plate; the outer surface of the lamp cup, or the inner surface, or the outer surface The inner surface is coated with a heat dissipating paint, that is, the heat sink is used as the heat sink of the LED bulb at the same time; ^ the heat conducting plate is disposed above the set ring of the aforementioned lamp cup, and the upper part of the heat conducting plate is set for the circuit board. And using the foregoing circuit board to set the LED light emitting diode; The lampshade is disposed at the opening of the lamp cup and is integrated with the lamp cup by an adhesive to form a heat dissipation structure of the LED bulb. Port 1 3, the light bulb heat dissipation structure according to Item 12 of the patent scope of the Shenqing, wherein the chamber of the lamp connector is provided with a ring to match the cavity source of the lamp cup. If, according to the LED bulb heat dissipation structure described in the scope of the patent application, the engaging component of the base connector is disposed in the extension of the base connector. If, according to the patent application scope of the first aspect of the led bulb heat dissipation structure, wherein the lamp connector is provided with an outer ring to be combined with the bottom end of the lamp cup. 1 According to the heat dissipation structure of the LED bulb described in item 2 of the patent application scope, the combination of the lamp cup and the lamp head connector is such that the inner ring of the lamp cup is engaged with the engaging member of the lamp holder ' The bottom end of the aforementioned lamp cup is abutted against the base of the lamp cap. 11. According to the heat dissipation structure of the LED bulb described in item 12 of the patent application scope, the combination of the 3J and the heat conducting plate in the bean is set to form a circle around the lamp cup, so as to set the guide &amp; 1"light ίΓϊίϊϊ, described in the LED bulb heat dissipation structure, which extends under the lampshade ^= forms a joint ring around the opening of the lamp cup, and the hook portion formed by the combination of the lampshade and the lamp cup into one body side is combined with each other' The heat dissipation structure of the led bulb of the 12th item can be set, and the source module is set to 'and the power module is placed against the chamber of the connector of the base. </ br> </ br> </ br> </ br> </ br> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; 2 The heat dissipation structure of the LED bulb described in Item 12, wherein the cover/light cup is combined with the inner circumference of the lamp cover, and the inner circumference of the inner circumference of the inner circumference π is set to extend the circumference. The inner extension ring and the lower extension soil are adhered to the inner surface of the lamp cup by the dot agent, and the lamp cover and the lamp cup can be fixed. 2 2. According to the LED light bulb heat dissipation structure described in Item No. 12 of the patent application scope, the heat conduction plate and the circuit board are integrally formed, and the heat conduction plate is made of an insulating material to set the LED light emitting diode. ’

TW100210114U 2011-06-03 2011-06-03 Heat-dissipation structure of LED light bulb TWM419877U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100210114U TWM419877U (en) 2011-06-03 2011-06-03 Heat-dissipation structure of LED light bulb
JP2012009926A JP2012253005A (en) 2011-06-03 2012-01-20 Led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100210114U TWM419877U (en) 2011-06-03 2011-06-03 Heat-dissipation structure of LED light bulb

Publications (1)

Publication Number Publication Date
TWM419877U true TWM419877U (en) 2012-01-01

Family

ID=46451976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100210114U TWM419877U (en) 2011-06-03 2011-06-03 Heat-dissipation structure of LED light bulb

Country Status (2)

Country Link
JP (1) JP2012253005A (en)
TW (1) TWM419877U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499740B (en) * 2012-06-21 2015-09-11 Acbel Polytech Inc Light emitting diode bulb

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107044588B (en) * 2017-04-06 2024-02-09 江门市美桢精密科技有限公司 Lamp cup and lamp bead and sealing cover continuous fixing device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11283570A (en) * 1998-03-31 1999-10-15 Toshiba Lighting & Technology Corp Black light fluorescent lamp
JP2004200086A (en) * 2002-12-19 2004-07-15 Matsushita Electric Works Ltd Lighting apparatus
EP2154420A1 (en) * 2008-08-13 2010-02-17 GE Investment Co., Ltd. Light-emitting diode illumination apparatus
JP2010205579A (en) * 2009-03-04 2010-09-16 Chugai:Kk Light-emitting diode small bulb
CN102032481B (en) * 2009-09-25 2014-01-08 东芝照明技术株式会社 Lighting lamps and lighting fixtures with sockets
JP3156563U (en) * 2009-10-22 2010-01-07 小林 操二 LED lamp for lighting
JP2011108396A (en) * 2009-11-13 2011-06-02 Toshiba Lighting & Technology Corp Lamp with base, and lighting fixture
JP5600936B2 (en) * 2009-12-29 2014-10-08 神保電器株式会社 LED lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499740B (en) * 2012-06-21 2015-09-11 Acbel Polytech Inc Light emitting diode bulb

Also Published As

Publication number Publication date
JP2012253005A (en) 2012-12-20

Similar Documents

Publication Publication Date Title
CN102734662B (en) 2014-08-27 Energy-saving lamp with heat-resistant effect
JP2013533581A5 (en) 2014-07-03
CN203131534U (en) 2013-08-14 led light bulb
TWM419877U (en) 2012-01-01 Heat-dissipation structure of LED light bulb
CN202017910U (en) 2011-10-26 LED high power lamp of ceramic aromatherapy
TWM374539U (en) 2010-02-21 LED bulb structure
JP3147051U (en) 2008-12-11 Multi-layer reflective cup
US20160273752A1 (en) 2016-09-22 Luminaire with thermally-insulating fin guards and associated methods
CN202125757U (en) 2012-01-25 LED light bulb cooling structure
US9416953B2 (en) 2016-08-16 LED lighting apparatus
CN102818132A (en) 2012-12-12 LED light bulb cooling structure
TW201116769A (en) 2011-05-16 Structure of LED lamp
JP2014089939A (en) 2014-05-15 Led lighting fixture
CN205535234U (en) 2016-08-31 Energy -concerving and environment -protective multicolour desk lamp
US20140293586A1 (en) 2014-10-02 Detachable Essential Oil Ring for Lamp and Application Thereof
JP6099259B2 (en) 2017-03-22 LED lamp
TWI307752B (en) 2009-03-21
CN202118551U (en) 2012-01-18 High-power LED lamp bulb
TWI315180B (en) 2009-09-21 Led module having a thermal management component
WO2020103134A1 (en) 2020-05-28 High-power led energy-saving lamp bulb
TWM532546U (en) 2016-11-21 Lamp with vacuum chamber
TWM460226U (en) 2013-08-21 Heat dissipation device
TWM441076U (en) 2012-11-11 Bridge linear light structure
TWM428508U (en) 2012-05-01 LED (light emitting diode) projection lamp
TWM416009U (en) 2011-11-11 Improved LED light bulb structure

Legal Events

Date Code Title Description
2014-10-01 MM4K Annulment or lapse of a utility model due to non-payment of fees