US20090027889A1 - LED lamp instantly dissipating heat as effected by multiple-layer substrates - Google Patents

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• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
  • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
  • F21S8/00—Lighting devices intended for fixed installation
  • F21S8/08—Lighting devices intended for fixed installation with a standard
  • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
  • F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
  • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
  • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
  • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
  • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
  • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
  • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
  • F21Y2107/60—Light sources with three-dimensionally disposed light-generating elements on stacked substrates
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S362/00—Illumination
  • Y10S362/80—Light emitting diode

Definitions

• the LEDs or LED module will rapidly increase their temperature to accumulate heat in the lamp. If the heat is not well dissipated, it may cause flicker and deteriorate the illumination quality of the LED lamp, thereby shortening the service life of the lamp.
• U.S. Pat. No. 6,793,374 disclosed a LED lamp having a gear column connected between a cap and substrates.
• the substrates are arranged as a polyhedron with planar surfaces.
• a fan is provided in the column for cooling the substrates and LEDs.
• the present inventor has found the drawbacks of the prior art and invented the LED lamp for instantly and effectively dissipating the heat from the lamp.
• the object of the present invention is to provide a LED lamp including: a plurality of substrates juxtapositioned as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.
• LEDs light emitting diodes
• FIG. 1 is an illustration showing an assembled LED lamp in accordance with the present invention.
• FIG. 2 is a sectional drawing of the present invention as viewed from Line 2 - 2 direction of FIG. 1 .
• FIG. 3 is a side-view illustration of the present invention when removing the transparent cover and lamp shade.
• FIG. 4 is a sectional drawing as viewed from Line 4 - 4 direction of FIG. 3 .
• FIG. 5 is a bottom view of FIG. 3 .
• FIG. 6 is a modification of the present invention by adding vertical heat-dissipating fins to the example of FIG. 1 .
• FIG. 7 shows another preferred embodiment of the present invention.
• FIG. 8 is a bottom view of the LED lamp as shown in FIG. 7 by removing the transparent cover.
• FIG. 9 is a sectional drawing as viewed from Line 9 - 9 direction of FIG. 8 .
• FIG. 10 is a sectional drawing when viewed from Line 10 - 10 of FIG. 9 .
• FIG. 11 is a modification of the present invention as modified from FIG. 10 .
• a LED lamp (or lighting fixture) 100 of the present invention comprises: a plurality of light-emitting diodes or LEDs 1 ; a plurality of substrates 2 , 2 a ⁇ 2 d juxtapositionally formed as a multiple-layer structure; each substrate 2 , 2 a ⁇ 2 d having at least a light emitting diode or LED 1 mounted thereon; and at least a heat-dissipating device 3 secured to one substrate of the plurality of substrates 2 , 2 a ⁇ 2 d ; a transparent cover (or lens cover) 4 mounted on a front portion or a light-output side of the LED lamp 100 ; and at least a lamp shade 5 mounted on a rear portion or inner portion of the LED lamp 100 .
• the light emitting diodes 1 may be secured or mounted on each substrate 2 , 2 a ⁇ 2 d by individual LEDs, an annular array, a LED module, or any other array arrangements or lay-out, not limited in the present invention.
• the LEDs may be electrically connected to a LED circuit which is formed on a circuit board secured or integrally formed with the substrate 2 , 2 a ⁇ 2 d of the present invention.
• the electrical insulation for the LED circuit with the other elements should also be considered.
• the plurality of substrates 2 , 2 a ⁇ 2 d may be juxtapositioned with one another to be a multiple-layer structure, with every two neighboring substrates defining an air space A therebetween for increasing the contacting area between the substrates and the air, in order for increasing the heat dissipation area for instantly effectively dissipating heat outwardly.
• the substrate is made of heat conductive material having good heat dissipation property and may be selected from: copper, aluminum, aluminum alloy and other composites having good heat conducting and dissipating properties.
• the plurality of substrates 2 , 2 a ⁇ 2 d are gradationally juxtapositionally mounted on the LED lamp about a longitudinal axis X of the LED lamp as shown in FIGS. 3 ⁇ 5 to be multiple layers of substrates, each substrate formed as an annular shape and defining a central opening 21 for each substrate, which is gradually decreasing an inside diameter of the central opening 21 of the annular-shaped substrate from an outer (or front) substrate to an inner (or rear) substrate (especially as shown in FIG.
• each substrate having a plurality of light emitting diodes 1 concentrically mounted thereon, and each light emitting diode 1 on an inner substrate projecting its light outwardly through a central opening 21 of an outer substrate neighboring to the inner substrate without obstruction of an output light projection of the light emitting diodes 1 .
• Every two neighboring substrates are connected by a fastening element 20 such as a bolt; and having a heat dissipating device 3 secured to an innermost substrate 2 d of the substrates for further dissipating heat outwardly.
• a fastening element 20 such as a bolt
• the heat dissipating device 3 may includes a plurality of heat dissipating fins.
• the number of substrates 2 and the areas of the substrates may be variable and adjustable, depending upon the watts of the LEDs. For example, a LED lamp with high power or high watts, the number of LEDs and substrates may then be increased correspondingly.
• the light emitting diode 1 may be mounted on the substrate 2 by the aid of a heat sink slug for enhancing the heat transfer from the LED to the substrate, through which the heat as produced by the LED will be effectively dissipated outwardly.
• the LED circuit may be directly printed or formed on an outer surface of the substrate 2 , and an inner surface of the substrate may be formed as a rough surface to increase its contacting area with the air to increase its heat dissipation efficiency.
• a plurality of vertical heat-dissipating fins 3 a may be radially secured to the plurality of substrates 2 , 2 a ⁇ 2 d to further increase the heat dissipating area and heat dissipating efficiency.
• Such a vertical heat-dissipating fins 3 a may also protect the direct contact with the LEDs, thereby preventing unexpected injury caused by the heat of the LEDs.
• the lamp shade 5 may be formed with a plurality of ventilation holes 51 for facilitating the air ventilation in the LED lamp for helping heat dissipation from the LEDs.
• the LED may be oriented in any light-output direction or in a straightforward direction for projecting light outwardly in the directions according to the practical requirements, not limited in the present invention.
• FIGS. 7 ⁇ 10 Another preferred embodiment of the present invention is shown in FIGS. 7 ⁇ 10 , which will be described in detail hereinafter.
• the LED lamp 100 includes: a plurality of LED modules la (such as LED array or multi-chip LED array) respectively thermally connected to a plurality of substrates 2 which may be juxtapositionally formed as multiple layers, each substrate 2 thermally connected with at least a heat dissipating device 3 , a transparent cover 4 mounted on a front or outer portion of the LED lamp 100 , and at least a lamp shade 5 secured to a rear or inner portion of the LED lamp 100 and connected with an inner portion of the heat dissipating device 3 ; with said plurality of substrates encased in between the transparent cover 4 and lamp shade 5 .
• LED modules la such as LED array or multi-chip LED array
• Each LED array may be mounted on the substrate 2 with any desired light-output angles or directions, not limited in this invention.
• the plurality of substrates 2 may be juxtapositionally superimposed to define an air space A between every two neighboring substrates 2 ( FIG. 7 ), each substrate 2 having at least a LED module la mounted thereon.
• the plurality of substrates 2 may be formed as a multiple-layer cassette as show in FIG. 7 .
• the heat dissipating device 3 includes: a plurality of heat-transfer blocks 31 each block 31 connected with at least one substrate 2 and each block 31 having an outer surface portion connected with one said LED module 1 a ; a plurality of horizontal heat pipes 32 having at least one horizontal heat pipe 32 horizontally connected with each heat-transfer block 31 ; a plurality of vertical heat-dissipating fins 33 perpendicularly connected with the horizontal heat pipes 32 ; a plurality of vertical heat pipes 34 each vertically connected to each heat-transfer block 31 ; and a plurality of horizontal heat-dissipating plates 35 perpendicularly connected with the vertical heat pipes 34 .
• the vertical heat-dissipating fins 33 are separated from the horizontal heat-dissipating plates 35 by a diaphragm 30 .
• Each heat pipe 32 or 34 is filled with vaporizable working fluid or heating medium therein for conducting and dissipating heat as produced from the LED modules 1 a.
• the lamp shade 5 is made of heat conductive materials and includes a plurality of ventilation holes 51 formed through the lamp shade 5 for venting hot air outwardly, with the inner end portions of the vertical heat pipes 34 connected with the lamp shade 5 , which will play as a big heat-dissipating plate for dissipating heat outwardly.
• the lamp shade 5 is further connected with a water-proof shade 5 a juxtapositioned to the lamp shade 5 to prevent rain water or water droplets to enter the interior of the lamp 100 ; and the water-proof shade 5 a is connected with partial vertical heat pipes 34 for further conducting and dissipating heat outwardly as thermally transferred from the heat pipes 34 as shown in FIG. 7 .
• the water-proof shade 5 a may also play as another heat-dissipating plate next to the lamp shade 5 as above-mentioned.
• This preferred embodiment (as shown in FIGS. 7 ⁇ 10 ) has the following advantages superior to the prior art:
• the horizontal heat-dissipating plates 35 in FIG. 10 have been modified to be heat-dissipating plates 35 a each slightly inclined sidewardly outwardly towards a plurality of ventilation holes formed in the lamp shade (referable to FIG. 7 ) to thereby smoothly guide the hot air upwardly outwardly through the. inclined plates 35 a .
• a plurality of ventilation openings 351 , 301 are formed through the heat-dissipating plates 35 a and diaphragm 30 for helping the heat convection of the hot air through the openings for enhancing the heat dissipation.
• the present invention may be used as a LED bulb, a LED street lamp or any other LED lamps, not limited.

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• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optics & Photonics (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

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Cited By (32)

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Citations (10)

• 2007
  • 2007-07-23 US US11/880,372 patent/US7607802B2/en not_active Expired - Fee Related

Patent Citations (10)

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