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USD806046S1 - Wafer carrier with a multi-pocket configuration - Google Patents

  • ️Tue Dec 26 2017

USD806046S1 - Wafer carrier with a multi-pocket configuration - Google Patents

Wafer carrier with a multi-pocket configuration Download PDF

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Publication number
USD806046S1
USD806046S1 US29/587,929 US201629587929F USD806046S US D806046 S1 USD806046 S1 US D806046S1 US 201629587929 F US201629587929 F US 201629587929F US D806046 S USD806046 S US D806046S Authority
US
United States
Prior art keywords
wafer carrier
pocket configuration
view
pocket
configuration
Prior art date
2015-04-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/587,929
Inventor
Alexander Gurary
Mandar Deshpande
Aniruddh Parekh
Yuliy Rashkovsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
2015-04-16
Filing date
2016-12-16
Publication date
2017-12-26
2016-12-16 Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
2016-12-16 Priority to US29/587,929 priority Critical patent/USD806046S1/en
2017-04-12 Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DESHPANDE, MANDAR, GURARY, ALEXANDER, PAREKH, ANIRUDDH, RASHKOVSKY, YULIY
2017-12-26 Application granted granted Critical
2017-12-26 Publication of USD806046S1 publication Critical patent/USD806046S1/en
2021-12-16 Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Status Active legal-status Critical Current
2032-12-26 Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

FIG. 1

is a perspective view of

embodiment

1 of the wafer carrier with a multi-pocket configuration according to the new design.

FIG. 2

is a top plan view of the wafer carrier with a multi-pocket configuration shown in

FIG. 1

.

FIG. 3

is a detail view of a portion of the wafer carrier with a multi-pocket configuration shown in

FIG. 1

detailing an enlarged portion corresponding to the area indicated in

FIG. 1

that includes a single pocket and surrounding region in a perspective view.

FIG. 4

is a right side view of a wafer carrier with a multi-pocket configuration according to the new design shown in

FIGS. 1-3

, with the left side, front, and rear views being the same as the right side view.

FIG. 5

is a bottom plan view of a wafer carrier with a multi-pocket configuration according to the new design shown in

FIGS. 1-4

.

FIG. 6

is a perspective view of a wafer carrier with a multi-pocket configuration according to a second embodiment of the new design.

FIG. 7

is a right side view of a wafer carrier with a multi-pocket configuration according to the new design shown in

FIGS. 6-8

, with the left side, front, and rear views being the same as the right side view; and,

FIG. 8

is a bottom plan view of a wafer carrier with a multi-pocket configuration according to the new design shown in

FIGS. 6-8

.

The broken lines, where present, in all views illustrate portions of the wafer carrier with a multi-pocket configuration that represent environment of the claimed design and form no part of the claimed design. The dash-dot lines of

FIG. 1

define the area corresponding to the enlarged portion shown in

FIG. 3

and form no part of the claimed design. The dash-dot and broken lines in

FIG. 3

represent the edge of the enlarged portion of the design and form no part of the claimed design.

Claims (1)

    CLAIM

  1. We claim the ornamental design for a wafer carrier with a multi-pocket configuration, as shown and described.

US29/587,929 2015-04-16 2016-12-16 Wafer carrier with a multi-pocket configuration Active USD806046S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/587,929 USD806046S1 (en) 2015-04-16 2016-12-16 Wafer carrier with a multi-pocket configuration

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/524,104 USD778247S1 (en) 2015-04-16 2015-04-16 Wafer carrier with a multi-pocket configuration
US29/587,929 USD806046S1 (en) 2015-04-16 2016-12-16 Wafer carrier with a multi-pocket configuration

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/524,104 Division USD778247S1 (en) 2015-04-16 2015-04-16 Wafer carrier with a multi-pocket configuration

Publications (1)

Publication Number Publication Date
USD806046S1 true USD806046S1 (en) 2017-12-26

Family

ID=55358780

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/524,104 Active USD778247S1 (en) 2015-04-16 2015-04-16 Wafer carrier with a multi-pocket configuration
US29/587,929 Active USD806046S1 (en) 2015-04-16 2016-12-16 Wafer carrier with a multi-pocket configuration

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/524,104 Active USD778247S1 (en) 2015-04-16 2015-04-16 Wafer carrier with a multi-pocket configuration

Country Status (4)

Country Link
US (2) USD778247S1 (en)
KR (1) KR20160003714U (en)
DE (1) DE202015007242U1 (en)
TW (6) TWM531049U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD852762S1 (en) * 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893682S1 (en) * 2018-05-31 2020-08-18 Smith Industries Inc. Floor drain grate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD1002915S1 (en) * 2022-05-18 2023-10-24 Chen Wu Lens

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